Chip
Passive or active components test and their interconnected circuitry in silicon or germanium.
See Also: Integrated Circuit, IC
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Product
N2 O2 Analyzer
GNL-IN881 Series
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Shanghai ChangAi Electronic Science & Technology Co.,Ltd
GNL-IN881 series analyzer is the online intelligent measurement instrument, which adopting advanced ion current oxygen sensor with single chip technology. N2%=100%-O2%.It has been widely used in the fields of nitrogen separation from air, fertilizer, petrochemicals and biological fermentation. - See more at: http://en.ci-ele.com/8aedb8bf-ef48-4f8c-127a-797c939a6181/78ea4933-855f-c270-f389-d6ac3b6fe432.shtml#sthash.Dk7zX5DN.dpuf
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Product
P/N 1110087 144-Pin VQFP-to-PGA Adaptor
1110087
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144 Pin VQFP to PGA Adapter. Convert surface mount VQFP packages to a 13 x 13 PGA footprint. Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs. Pins are mechanically fastened and soldered to board using Aries patented process, creating a reliable electrical connection and rugged contact. Consult factory for panelized form or for mounting of consigned chips.
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Product
SMARC® Short Size Module with Intel® Pentium™ and Celeron™ Processor N3000 Series SoC (codename: Braswell)
LEC-BW
Computer on Module
The LEC-BW Computer-On-Module (COM) combines the SMARC® 1.1 standard with the Intel® Pentium® and Celeron® N-series System-on-Chip (SoC), providing an ideal solution for low power consumption and high performance requirements. The module provides the high integration, high performance, low power, and ruggedness favored by Internet-of-Things (IoT) applications such as retail transactional clients, digital signage, and in-vehicle infotainment systems.
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Product
PC/104 Single Board Computer with Vortex86DX3 System-on-Chip
CM1-86DX3
Single Board Computer
The CoreModule CM1-86DX3 is a PC/104 board with DMP Vortex86-DX3 single chip solution and has a very good performance to power ratio. The board comprises all peripherals needed for an embedded PC on a small 3.775" by 4.050" printed circuit board. The CM1-86DX3 integrates a powerful yet efficient DMP Vortex86DX3 with graphic controller and audio controller together with an additional GBit Ethernet controller to form a complete PC, with all the standard peripherals already onboard. Two Ethernet ports (1x GBit and 1x 100MBit), four RS232/RS422/RS485 serial ports, two USB 2.0 host controller to handle the communication with external devices. There are PS/2 connectors for keyboard and mouse. A first generation SATA interface allows the connection of hard disk or CD drive. CFast is also available. System expansion can easily be realized over the PC/104 bus connectors.
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Product
UV Sensors
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With analog (4-20mA, 0-5V, 0-10V) or digital (USB, Modbus) output, also available with Android device (incl. app). SiC photodiode chip based Broadband UV sensitivity or filtered for UVA, UVB, UVC or UV-Index spectral sensitivity. Our sensors are also available with logarithmic signal transduction, linearity from 0 … 1500 mV. Calibration services available at our Berlin facility prior to delivery and after use
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Product
DIGITAL TACHOMETER
IBL-DT2235A
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International Biological Laboratories
This is a Digital Hand Held Contact type Tachometer and has Micro Computer LSI Chip
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Product
TMR Current Sensors
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MultiDimension Technology Co.,Ltd.
An open-close current transducer, high sensitivity and signal-to-noise ratio TMR chips are used in the design, which based on Tunneling magneto resistance effect. The transducer has a built-in temperature compensation and nonlinear compensation circuit, which can accurately measure DC, AC and pulse current. The transducer has many benefits ,such as high precision, wide bandwidth, low power consumption, excellent isolation performance and so on. Besides, the design of open-close structure makes it easier to install and unload.
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Product
Compact Goniophotometer
LSG-1200A
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The compact goniophotometer of LSG-1200A is used to measure the luminous intensity distribution curve, intensity data, spread angle and other parameters for Chip LED, LED Module, LED Spotlight and all other light which beam angle is no more than 180 degree. • Meets the requirements of IEC, CIE and LM-79 standards • Measures beam angle automatically: staple half intensity angle as well as 1/4 intensity angle, 3/4 intensity angle and 1/10 intensity angle which meets the special requirements. • Measured data is matched with international standard form (IES) and can be applied for lighting design by other lighting design software such as DiaLux • LSG-1200A has included a dark room, measures the maximum size of lamps: 180mm • Test range of luminosity: 0.1～30,000lx. Test accuracy of detector: Class 1 • The distance between the tested lamp and detector is 316mm/1000mm • Angle interval: Horizontal angle: 1°/5°/10°/15°/22.5°/30°/45°/90°, Vertical angle: 0.5°/2°/1.5° • The LSG-1200A horizontal automatic rotating on 0°~360° and Vertical automatic rotating on -90°~+90° • Test accuracy of angle: ±0.2° Work with the follow instruments as a System
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Product
8G SO-DDR4-3200 1GX8 1.2V SAM -20~85℃
AQD-SD4U8GN32-SE2
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SAM Original Chip, Industrial Design for Improved Reliability, PCB: 30μ gold finger, Anti-sulfuration, Semi Wide-temp Support -20~85℃.
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Product
PC/104 Low-Power SBC with Vortex86DX CPU and Data Acquisition
HELIOS
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Helios is a low power, mid-range performance PC/104 form factor single board computer combining a highly integrated CPU with Diamond Systems’ renowned high-accuracy data acquisition circuitry on a single board, reducing size and cost while increasing ruggedness. Helios utilizes a Vortex integrated single chip CPU operating at 800MHz or 1GHz, and 256MB of DRAM soldered on-board.
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Product
Microcontrollers (MCUs)
8-bit
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An innovative 8-bit chip design provides a fully-integrated experience. Silicon Labs' 8-bit MCUs are ideal for IoT applications and beyond, delivering the industry's fastest speeds and lowest power.
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Product
3U OpenVPX High Density Multifunction I/O Board
68CB6
Multifunction I/O
The 68CB6 is a Configurable Open Systems Architecture™ (COSA®) 3U OpenVPX™ board that is preconfigured with 10 different “inboard” I/O, measurement and communication functions. This Combination-function Board (CB) provides a full suite of some of the most common & useful function interfaces supporting many different applications. The 68CB6 features a wide but dedicated selection of functions: Standard Functionality Discrete I/O (DT1); Successive Approximation Register (SAR) ±100 V Analog-to-Digital (AD); Isolated High Voltage Analog-to-Digital (ADF); ±10 V Digital-to-Analog (DA); Thermocouple (TC1) or Resistance Temperature Detector (RT1); Full-bridge Strain Gauge (SG1); Transmission/gear box Chip Detection and Fuzz Burn (CD1); LVDT-to-Digital linear (LD6) displacement (position) measurement, AC Reference Source output (AC2); CAN bus communication (CB8). The 68CB6 offers unparalleled programming flexibility, a wide range of operating characteristics, and a unique design that eliminates the need for external intermediate circuit considerations such as pull-up resistors or mechanical configuration jumpers. Inboard functions are software controlled and memory addressed, accessed in similar COSA® modular fashion to maintain seamless common NAI Software Support Kit & API/library structures.
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Product
Software
SSI-TRES
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Was developed to read and edit Plug and Play Smart Sensors that are compliant to the IEEE 1451.4 Standard. TEDS, or transducer Electronic Data Sheet, is a set of electronic data in a standardized format defined within the IEEE 1451.4 standard. This data specifies what type of sensor is present, describes its interface, and gives technical information such as sensitivity, bridge type , excitation, etc. This information is stored in an EEPROM chip attached to the sensor. By having this chip, the sensor can identify and describe itself to the network and or Smart Load Cell Meter (DPM-3), thereby easing automatic system configuration.
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Product
16G DDR5-5600 2GX8 1.1V SAM -20~85℃
AQD-D5V16GN56-SBH
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SAM Original Chip, Industrial Design for Improved Reliability, PCB: 30μ gold finger, Anti-sulfuration, Semi Wide-temp Support -20~85℃.
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Product
Microcontrollers
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Frontgrade offers highly integrated, full-featured SPARC and Arm®-based Rad Hard microcontrollers ideal for system-on-chip (SoC) applications. These small footprint, low power devices are augmented with integrated analog front-end components making them ideal for mixed signal processing.
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Product
Resistors
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Panasonic Industrial Devices Sales Company of America
Panasonic offers a broad line of Resistors that include Chip Resistors, Power, High Power, Fuse, EMI Filters, and Arrays and Networks for all applications.Panasonic Resistors have a wide range of features and specifications including conventional Thick Film Chip Resistors or specialized types like Anti-Sulfur, 0201 to 0805 case sized Chip Resistor Arrays, three different types of Power Resistors, Surface Mount and Leaded EMI Filters and one of the smallest Chip Fuses in the industry.
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Product
Isolation Amplifiers
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Isolation Amplifiers provide power supply designers with a higher performing, single chip alternative to isolation techniques based on optocouplers and shunt regulators. Analog Devices ADuM3190 and ADuM4190 isolated error amplifiers have a 400 kHz bandwidth, with 0.5% typical initial accuracy at 25°C and 1% total accuracy over the extended temperature range of –40˚C to +125˚C. This provides manufacturers of ac-to-dc and dc-to-dc power supplies with a significant upgrade in speed and operating temperature range, as well as a 5× improvement in transient response.
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Product
Presence Sensor
X4M300
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The XeThru X4M300 is Novelda’s presence and occupancy sensor powered by the XeThru X4 ultra wide band radar chip. Ultra sensitive and with excellent signal to noise performance, the sensor detects even the smallest human movement in a room.
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Product
802.11b/g/n Radio/Baseband (SiP)
SX-SDPGN
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The Silex SX-SDPGN (Qualcomm Atheros AR6103) is a third generation wireless LAN solution, featuring 802.11n. Based on the game-changing AR6003 Wireless LAN chip, the SX-SDPGN brings 802.11n throughput, range and power eficiency to portable devices including patient monitors, printers, handheld terminals and more.
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Product
PROBE CARD
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the electrical characteristics of the individual CHIPs in WAFER that have been completed through the FAB stage during the semiconductor fabrication process
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Product
Material Identification Spectroscopy
ChipCHECK
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Gastops specializes in advanced fluid sensing and analysis systems specifically designed and developed for critical equipment condition monitoring applications. ChipCHECK offers the fastest way of making on-site equipment maintenance decisions. It is a field deployable analyzer designed for rapid on-site identification of equipment lube oil. This automated maintenance decision-support tool employs innovative laser spectroscopic technology, which enables on-site analysis of microscopic chip debris. ChipCHECK provides the maintainers with quick, reliable, and conclusive information, including the total number of particles, and the size, shape, and specific alloy classification for each individual particle on the sample.
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Product
Battery Backup IC
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Analog Devices offers a range of supervisory circuits that offer a complete single chip solution for power supply monitoring and battery control functions in microprocessor systems. Functions include microprocessor reset, backup battery switchover, watchdog timers, CMOS RAM write protection, and power failure warning.
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Product
16GB SO-DIMM DDR5-5600 262Pin 2GX8 1.1V Unbuffered Hynix Chip
AQD-SD5V16GN56-HB
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Hynix Original Chip, Increased Banks and Burst Length, DDR5 5.6GT/s. Same-Bank Refresh, On-die ECC for Enhanced RAS.
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Product
29MP Ultra-High Resolution Forensic Camera
SceneScope RUVIS 29MP System
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The SceneScope RUVIS 29MP is an Ultra High Definition camera based on a 29MP sensor with 6644 x 4452 pixel resolution, and a full-frame chip. It includes capture software with 3 user-selectable modes: Fast Viewing for placement, Focus on the evidence, and High Detail for Capture at High Resolution and High Dynamic Range.
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Product
IR Sensor
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The sensor measures a very useful 0.17 mm in thickness and is made of plastic. Essentially it is a piece of robust plastic that can be used “bare” – without protective housing, such as a metal casing commonly used by other producers. The sensor it is less than 0.2 mm. thin and it is made using plastic membrane. This configuration makes the sensor so robust it can be used “bare” – without protective housing such as a metal container. Due to the fact thatSince the sensor chip can be used applied bare, means it can be used in a totally new ways, which can re-defines todays the current view on application design and reduces the cost of the entire system, and not just the sensor-element as such.
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Product
Emulation
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Synopsys ZeBu® emulation system delivers the performance needed to make verification teams and software developers working on the most advanced chips successful. ZeBu emulation systems are modular, allowing users to deploy the capacity needed in a scalable and easily extensible fashion.
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Product
32G SO-DDR4-3200 2GbX8 1.2V SAM -40~85C
AQD-SD4U32N32-SBW
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DDR4 3200Mhz Unbuffered SO-DIMM, 30u" Gold Plating Thickness, Anti-sulfurization resistance. 1.2V power consumption, Samsung original chip, 100% tested for stability, compatibility and performance.
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Product
20μm Silicon Interdigitated Electrode Chip
SBC1
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High-stability 20μm silicon IDE chip for MEMS, gas sensing, biosensing, and photoelectric applications.
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Product
Stamped Spring Pin Sockets
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Ironwood Electronics SBT sockets are small footprint sockets that are compatible with other product lines such as GHz elastomer sockets, Giga-Spring sockets, etc. The socket needs about 2.5mm extra space around the chip than the actual chip size utilizing only very small PCB real estate. A heat sink screw on the top provides the compression force as well as thermal relief and can be customized to dissipate more power. SBT socket uses SBT contact technology for high endurance and wide temperature applications. SBT Contact is a stamped contact with outside spring as well as inside leaf spring that provides a robust solution for Burn-in & Test applications. Solutions are available for 0.3mm to 1.27mm LGA, BGA, QFN, QFP, SOIC and other packages. Contact technology has 3 part system which includes top plunger, bottom plunger and a spring. The Beryllium Copper plungers are stamped and assembled to a stainless steel spring in an automated system to enable fast turnaround time, low cost and zero defects.
