Chip
Passive or active components test and their interconnected circuitry in silicon or germanium.
See Also: Integrated Circuit, IC
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Product
Ground Leads Continuity Tester
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Weshine Electric Manufacturing Co., Ltd
1. The new power supply technology is adopted in the grounding down lead conduction tester.2. It has the characteristics of small size, light weight, large output current, good repeatability, strong anti-interference ability and protection function. 3. The whole machine is controlled by single chip microcomputer, which has a high degree of automation. 4. The instrument has high precision and easy operation. The maximum current is 10A.
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Product
SMT Rework Station
RW1210
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Safely and precisely rework SMD, BGA, or LED chips. This all-in-one solution covers rework needs for even the most complex, densely populated PCBAs. Yet it is easy to use, enabling technicians to quickly master delicate alignment, placement, and heating controls.
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Photonic Device Testing
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ficonTEC’s series of photonic device testing machines is focused on automated electrical, optical or mixed-signal electro-optical characterization (test-&-qualify) of chips and dies, opto-electronic assembles and integrated devices. Capability includes PIC design validation and device verification.
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Product
SigmaDSP Audio Processors
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SigmaDSP® processors are fully programmable, single chip audio DSPs that are easily configurable through the SigmaStudio™ graphical development tool, and are ideal for automotive and portable audio products. SigmaDSP chips are available with integrated sample rate converters, A/D converters, D/A converters, and output amplifiers.
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Product
Thin Film Chip Resistors, High Reliability Type
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Panasonic Industrial Devices Sales Company of America
An AEC-Q200 Compliant SeriesPanasonic components specified as AEC-Q200 Compliant are consistently designed into automotive systems. However, today’s Design Engineers are specifying AEC-Q200 components to meet the high-quality standards of devices beyond automotive applications.
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Product
Electrical Receiver Conformance Test Application for IEEE 802.3bs/ cd
M8091BSCA
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IEEE 802.3bs receiver test application for 200GAUI-4 and 400GAUI-8, covering chip-to-module, chip-to-chip, backplane, and copper cable interconnects.
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Product
Electronic Ballast Production Line Tester
UI2000-OK
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• Eight windows for displaying input characteristics, output characteristics, convenient for comparison and analysis. • Frequency response for testing input current up to 1 MHz, suitable for precise testing of various kind of electronic ballast. • High speed testing, finish testing input and output characteristics within 1 minute. • Portable with built-in chip micro-processor, particular suitable for development and spot production. • Parameters, waves and curves of input, output and startup can be printed. • Communicating with PC, special software provided and both Chinese version and English version available. Run in WINDOWS3.2, WINDOW95 or WINDOWS98, nice interface between people and computer, easy to operate.
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Product
High Performance Embedded Development Kit
TySOM EDK
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The TySOM™ Embedded Development Kit is for the embedded designers who need a high-performance RTL simulator/debugger for their embedded applications such as IoT, Automotive, Factory automation, UAV and Robotics. The kit includes Riviera-PRO™ Advanced Verification Platform and a TySOM development/prototyping board. TySOM boards come with either a Zynq 7000 chip (FPGA + Dual ARM® Cortex™-A9) or with a Zynq® UltraScale+™ MPSoC device. These boards include memories, and various communication and multimedia interfaces in addition to FMC connectors for peripheral expansion. Reference designs for application such as IoT, ADAS, 4K UltraHD imaging and Robotics and a complete reference design, which contains the SW (Linux) and all the hardware blocks required to support the peripherals on the board, are provided.
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Product
XMC Display Control Card
XM26001
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LinkedHope Intelligent Technologies Co.,Ltd.
XM26001 is a graphics, image processing and computing single-board computer independently developed by Linghao Intelligent®. It uses the AMD G series APU GX-210HA by default, integrating the CPU, GPU, south bridge and north bridge on one silicon chip.
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Product
32G DDR5-5600 2GX8 1.1V SAM -20~85℃
AQD-D5V32GN56-SBH
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SAM Original Chip, Industrial Design for Improved Reliability, PCB: 30μ gold finger, Anti-sulfuration, Semi Wide-temp Support -20~85℃.
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Product
90μm Ceramic Interdigitated Electrode Chip
CIC1
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Ceramic IDE chip with a 90μm gap designed for gas sensing, humidity monitoring, biosensor development, and capacitive sensing.
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Product
Accelerometers - Special Purpose
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Analog Devices accelerometers and iSensor® MEMS accelerometer subsystems provide accurate detection while measuring acceleration, tilt, shock, and vibration in performance driven application. Our portfolio leads the industry in power, noise, bandwidth, and temperature specifications, and offers a range of MEMS sensor and signal conditioning integration on chip. Our MEMS-based Circuits from the Lab® reference designs have been built and tested by ADI experts to help you jumpstart your next system design.
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Product
DDR4 BGA Interposers, DDR4 DRAM X16 Packages
N2115A
Interposer
The N2115A DDR4 BGA Interposers are soldered in between the DRAM and PC board or DIMM raw card where the DRAM would normally be soldered. They are designed with the PCB or DIMM foot print on the bottom side and the DRAM footprint on the top side. The signals from the memory controller chip and DRAM are then passed directly to the top side of the BGA probe adapter where they can be accessed with the oscilloscope probes.
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Product
High Performance EV Battery Test System
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Shenzhen Sinexcel RE Equipment CO., Ltd
The 6V series battery test system uses a full-bridge circuit topology with a higher digit sampling chip. It can provide higher precision and more dynamic test data, and can provide a complete test program for mainstream lithium-ion batteries and batteries with a variety of material systems such as sodium batteries.
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Product
32GB SO-DDR5-5600 2GX8 1.1V SAM
AQD-SD5V32GN56-SB
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SAM Original Chip, PCB: 30μ gold finger, Anti-sulfuration, On-die ECC for Enhanced RAS, Operating Temperature: 0°C ~ 85°C.
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Product
2.5G DFB Laser Diode Chips
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Guilin GLsun Science and Tech Group Co., LTD
2.5G DFB Laser Diode Chips by GLSN
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Product
Automotive
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indie delivers advanced semiconductor, hardware, and software solutions for automotive, industrial, and mobility markets. We specialize in high-performance System-on-Chip (SoC), multi-modal sensing technologies, and advanced perception IP to enable smarter, safer, and more automated systems.
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Product
Stone-chip (Gravelometer)
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Trialon routinely tests products for the automotive, military, medical, aerospace, heavy truck and customer markets in our facilities in Michigan and Indiana.
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Product
Patented DPEM Process for Die Removal
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DPEM (Decapsulate Plastic Encapsulated Module) is DPACI’s patented Turn-Key Solution to replacement of obsolete high reliability devices in legacy systems. From dissolving the plastic encapsulation of a semiconductor device to re-bonding new wires onto a chip or package lead frame, complete solutions are offered. DPACI retains reliability test data as well as customer testimonials for the process and can share this information on a need-to-know basis.
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Product
10μm Transparent Quartz IDE Chip
TID1
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The TID1 10um Transparent Quartz IDE Chip is an interdigitated electrode chip designed for gas sensing, humidity sensing, biosensing, impedance measurement, and MEMS-related electrochemical or electrical detection research. The 10 um transparent electrode geometry provides a defined interdigitated pattern for surface-functionalized sensing experiments. The quartz glass substrate supports optical access, transparent sensing, and photoelectric detection, while the IDE layout helps improve interaction between the electrode fingers and the target film, electrolyte, vapor, or biological interface.
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Product
Semiconductor Thermal Transient Tester
T3Ster®
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T3Ster (pronounced "Trister") is an advanced thermal tester from Mentor Graphics MicReD Products for thermal characterization of semiconductor chip packages. Superior to all other thermal characterization equipment on the market due to its speed and ease of use; its extremely accurate temperature measurements (0.01oC); and its 1 micro-second measurement resolution in time.
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Product
500-1000W AC Power Source
CX-P150
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Shenzhen Chuangxin Instruments Co., Ltd.
The AC power source is made by adopting microcomputer processing chip and high power device. It provides a stable pure sine wave and has voltage,
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Product
Phase Locked Loop (PLL) Synthesizer & Translation Loop
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ADI’s industry leading phase locked loop (PLL) synthesizer family features a variety of high performance, low jitter clock generation and distribution devices. The extensive, ever growing family includes over 100 products, optimized for high data rate, low jitter clocking applications. The portfolio features PLLs, PLL/VCOs, and distribution chips, designed for clocking applications where synchronization, clock distribution, and phase noise performance are all vitally important.
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Product
Value Added Services
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For over three decades, Teledyne RF & Microwave has built a strong heritage delivering advanced value added services to the military, space and industry sectors of aerospace. With test capabilities up to 40 GHz, Teledyne offers chip and wire assembly of products ranging from single die through complex hybrids which can then be submitted to a combination of customer-specified RF and DC testing and environmental screening. We offer a complete portfolio of screening and testing services for device sorting, labeling, lead forming and tinning, and tape-and-reel packaging, as well as LAT services on packaged devices or bare-die, including diodes, transistors, and MMICs.
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Product
Cryogenic Temperature Sensors
Cernox®
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Cernox® thin film resistance cryogenic temperature sensors offer significant advantages over comparable bulk or thick film resistance sensors. The smaller package size of these thin film sensors makes them useful in a broader range of experimental mounting schemes, and they are also available in chip form. They are easily mounted in packages designed for excellent heat transfer, yielding a characteristic thermal response time much faster than possible, with bulk devices requiring strain-free mounting. Additionally, Cernox sensors have been proven very stable over repeated thermal cycling and under extended exposure to ionizing radiation.
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Optical Sensors
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Vishay's proximity, reflective, transmissive, slotted interrupters, optical and ambient light sensors put the "smart" into smart devices. Advantages of Vishay sensors include best-in-class performance, in-house chip manufacturing and assembly including AEC-Q101 automotive grade product lines, and comprehensive range of package types for wide range of applications.
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Product
Services
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For over three decades, Teledyne Microwave Solutions has built a strong heritage delivering advanced value added services to the military, space and industry sectors of aerospace. With test capabilities up to 40 GHz, TMS offers chip and wire assembly of products ranging from single die through complex hybrids which can then be submitted to a combination of customer-specified RF and DC testing and environmental screening. TMS offers a complete portfolio of screening and testing services for device sorting, labeling, lead forming and tinning, and tape-and-reel packaging, as well as LAT services on packaged devices or bare-die, including diodes, transistors, and MMICs.
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Product
ASIC
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Xtramus Industrial Instruments
Application-specific integrated circuit chips and hardware-based silicon solutions.
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Product
Mems-Based Probe Cards
MEMSFlex
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Nidec SV Probe proprietary MEMSFlex™ Probes are a perfect complement to our probe card technologies, ideal for many advanced testing applications including Flip Chip, WLCSP, Solder Bump, CuPillar and Pad. Featuring a fine 3D MEMS coil spring and electro-formed Ni-pipe, these probes are manufactured using a continuous, automated, manufacturing process, we can support a wide array of custom pin pitches within a short cycle. Other features include:
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Product
Ultra-Low Power Computing Module
CM22303
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LinkedHope Intelligent Technologies Co.,Ltd.
CM22303 uses Intel® 7th generation Kaby Lake-Y platform and Core M Ultra low-power SoC processors, and integrates the full functions of CPU, GPU and South/North Bridge on a single chip. The processor provides powerful computing and display performance with dual-core and four threads configuration. Its turbo frequency can boost up to 3.6 GHz and the display output resolution can be up to 4K. CM22303 has an amazing thermal design power consumption of only 4.5W (TDP) and can be used for a variety of high-performance fanless designs. SPI BIOS is designed on board to support dual-channel low voltage on board memory (up to 16GB), Gigabit Ethernet, TPM module and other functions. With high-performance and low power consumption, it can be widely used in the field of low power embedded systems. Meanwhile, CM22303 adopts COM Express standard and is compatible with Type10 pin out definition, and also provides rich peripheral interfaces such as USB3.0/2.0, PCIe, SATA, HD Audio etc.
