Chip
Passive or active components test and their interconnected circuitry in silicon or germanium.
See Also: Integrated Circuit, IC
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Product
RFSoC Board
VP431
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VP431, the next generation of our highly successful VP430, is a 3U VPX commercial off-the-shelf direct RF processing system that features the 3rd-generation Xilinx Radio Frequency System-On-Chip (RFSoC). The VP431 maximizes I/O channel density, reduces the radio frequency signal chain complexity, and allows for heterogeneous processing capability.
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Product
6U VME 1/10/40 GbE Switch
ComEth4070e
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The ComEth 4070e is a cutting-edge 6U Layer 2/3 Ethernet switch for VME64x systems. Powered by the newest Marvell highly integrated system-on-chip (SoC) with programmable packet processors.
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Product
8K UHD Fanless Edge Computer
UBX-110H
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The UBX-110H is an 8K UHD fanless edge computer powered by an Intel® Celeron® 6305E or 11th generation Core™ i3/i5/i7 processor. Built-in an Intel® Celeron® 6305E or 11th gen Core™ i3/ i5/ i7 processor, Built-in a TPM 2.0 chip for data encryption enhancement.
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Product
MIS Capacitors
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The SemiGen 8000 and 8100 series of MIS Capacitors are available in a wide variety of capacitance ranges and sizes. They are made with prime starting material and consist of an Oxide/Nitride layer that provides low dielectric loss and high standoff voltage. These RF microwave chip capacitor products are available in chip form only.
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Product
Accelerometers - Special Purpose
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Analog Devices accelerometers and iSensor® MEMS accelerometer subsystems provide accurate detection while measuring acceleration, tilt, shock, and vibration in performance driven application. Our portfolio leads the industry in power, noise, bandwidth, and temperature specifications, and offers a range of MEMS sensor and signal conditioning integration on chip. Our MEMS-based Circuits from the Lab® reference designs have been built and tested by ADI experts to help you jumpstart your next system design.
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Product
Memory Interface Chips
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Providing memory bandwidth and capacity to unleash the power of multicore processors
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Product
Resistors
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SemiGen builds high power tantalum nitride resistor chips to customer specifications. We can manufacture chip resistors using a variety of substrates in various thicknesses to meet your specific needs. Resistors can be produced with element features under 0.002 inch for high density or high value resistor applications. Low noise stable TCR and chip sizes under 0.010 inch x 0.020 inch are routinely processed in production quantities. SemiGen’s series of Thin Film Resistors offer proven stability, low noise, and excellent TCR of both Tantalum Nitride (TaN) and Nichrome (NiC) resistive films. From our standard product offering, to custom requirements, this series of resistors is offered in a large selection of chip size, resistance values, and tolerances.
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Product
VIS-SWIR FPA's
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Imaging electronic sensors sensitive in visible, near infrared, short wavelength infrared spectral bands that generate two dimensional electronic images have found mass applications in industry, defense, security, science, environmental protection, medicine etc. Imaging sensors sensitive only in VIS/NIR range are almost exclusively silicon chips manufactured using a series of technologies: CCD, CMOS. ICCD, EMCCD, EBAPS, sCMOS in color or monochromatic versions. Color VIS/NIR sensors are sensitive to light only in visible range when monochromatic VIS/NIR sensors are sensitive up to about 1000nm.
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Product
16G SO-DDR4-3200 1GbX8 1.2V SAM -40~85C
AQD-SD4U16N32-SEW1
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DDR4 3200Mhz Unbuffered SO-DIMM, 30u" Gold Plating Thickness, Anti-sulfurization resistance. 1.2V power consumption, Samsung original chip, wide temperatures from -40° to 85°C.
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Product
32GB DDR4-3200 2GbX8 1.2V ECC Samsung Chip
AQD-D4U32GE32-SB
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32GB, Speed 3200MHz, 30u" Gold Plating Thickness, Anti-sulfurization resistance, ECC.
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Product
IR Sensor
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The sensor measures a very useful 0.17 mm in thickness and is made of plastic. Essentially it is a piece of robust plastic that can be used “bare” – without protective housing, such as a metal casing commonly used by other producers. The sensor it is less than 0.2 mm. thin and it is made using plastic membrane. This configuration makes the sensor so robust it can be used “bare” – without protective housing such as a metal container. Due to the fact thatSince the sensor chip can be used applied bare, means it can be used in a totally new ways, which can re-defines todays the current view on application design and reduces the cost of the entire system, and not just the sensor-element as such.
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Product
Chip Inductors-Multilayer
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Bourns Miltilayer chip inductors offer high frequency, nickel barrier, monolithic construction for high reliability, and magnetically shielded construction providing low radiation. They are well-suited for DC-DC converters, and prevention of electromagnetic interference to signals on the secondary side of electronic equipment, among many applications.
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Product
16G SO-DDR5-5600 2GX8 1.1V SAM -20~85℃
AQD-SD5V16GN56-SBH
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SAM Original Chip, Industrial Design for Improved Reliability, PCB: 30μ gold finger. Anti-sulfuration, Semi Wide-temp Support -20~85℃.
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Product
802.11b/g/n Radio/Baseband (SiP)
SX-SDPGN
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The Silex SX-SDPGN (Qualcomm Atheros AR6103) is a third generation wireless LAN solution, featuring 802.11n. Based on the game-changing AR6003 Wireless LAN chip, the SX-SDPGN brings 802.11n throughput, range and power eficiency to portable devices including patient monitors, printers, handheld terminals and more.
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Product
4G SO-DDR3-1600 512X8 1.35V SAM -20~85℃
AQD-SD3L4GN16-SGH
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SAM Original Chip, Industrial Design for Improved Reliability, PCB: 30μ gold finger, Anti-sulfuration, Semi Wide-temp Support -20~85℃.
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Product
13MP MIPI Camera Module
e-CAM130_CUMI1820_MOD
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e-CAM130_CUMI1820_MOD is a 13MP MIPI Camera Module. This small form factor 13MP camera module comes with S-Mount lens holder. It is based on AR1820HS – an 18MP CMOS Image sensor from Aptina™ / ON Semiconductor® and has a dedicated, high-performance Image Signal Processor chip (ISP) on-board that performs all the Auto functions (Auto White Balance, Auto Exposure control) in addition to complete image signal processing pipeline that provides best-in-class images and video and the optional MJPEG compression. Though the AR1820HS is an 18MP image sensor, the e-CAM130_CUMI1820_MOD supports only up to 13MP resolution.
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Product
WLCSP Probe Heads
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Smiths Interconnect offers Wafer Level Chip Scale Package (WLCSP) Probe Heads utilizing spring probe technology which provide high parallelism in test, superior signal integrity and high speed / RF testing capability.
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Product
Production Test System
G3 Hybrid
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The G3 Hybrid is a state of the art system for fast Production test throughput in DC test applications. The system combines the most versatile offerings of features in a single system, at the lowest cost. For devices requiring DC and Continuity test capability only, G3H is a very flexible cost-effective Production Test solution. This approach provides a DC test system with the capability to add logic resources (AC/SCAN) as well as analog resources for Mixed Signal. The HILEVEL G3H embraces low cost while supporting SCAN, giving you the ability to toggle every node in your chip.
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Product
COM Express Type 6 Basic Module With 5th Gen Intel® Core™ I7 & 4th Intel® Core™ I7/i5/i3 & Celeron® Processor And Intel® QM87
CEM880
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The CEM880 COM Express Type 6 basic module features 5th generation Intel® Core™ processor (H-processor line), one onboard 4 GB extended temperature DDR3L chip, and one 204-pin SO-DIMM DDR3L socket supporting up to 8 GB. With outstanding computing performance, low power consumption, wide temperature range, and seismic design, the rugged basic-size SoM (system on module) drives Internet of Things innovation and is ideal for graphics-intensive and rich I/O applications such as telecommunication, medical imaging, digital signage, gaming machines, military, and networking.
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Product
Probe Cards
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PICOPROBE® PROBE CARDS by GGB Industries, Inc., allows for more chip design flexibility because each probe card is custom configured to your circuit for testing wafers on either manual or automatic probe stations. Probe cards with complex layouts consisting of numerous DC contacts and multiple microwave probes with operating frequencies of 40, 50, 67, or 110 GHz can be custom fabricated quickly and inexpensively.
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Product
8GB DDR5-5600 1GX16 1.1V SAM
AQD-D5V8GN56-SC
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SAM Original Chip, PCB: 30μ gold finger. Anti-sulfuration, On-die ECC for Enhanced RAS. Operating Temperature: 0°C ~ 85°C.
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Product
288-Pin Dual In-Line Memory Module
SQR-UD4S
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SQRAM is Industrial Grade DRAM memory. all of SQRAM are designed with original IC chip and adopt a rigorous test program.
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Product
ICs For Wireless Charging System
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The feature of power receiving and charge/discharge system IC RAA457100 is integrated all functions needed for a wireless chargeing, rectification, charging control for small Lithium-Ion battery and top level of power-efficiency DC-DC converter in a singl chip as 3.22mm x 2.77mm small package.
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Product
SMARC® Short Size Module with Intel® Pentium™ and Celeron™ Processor N3000 Series SoC (codename: Braswell)
LEC-BW
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The LEC-BW Computer-On-Module (COM) combines the SMARC® 1.1 standard with the Intel® Pentium® and Celeron® N-series System-on-Chip (SoC), providing an ideal solution for low power consumption and high performance requirements. The module provides the high integration, high performance, low power, and ruggedness favored by Internet-of-Things (IoT) applications such as retail transactional clients, digital signage, and in-vehicle infotainment systems.
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Product
Piezo-resistive Accelerometer
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A Piezo-resistive Accelerometer has a stable structure composed on a silicon chip created by the micromachining and semiconductor production technology. A mass and a beam on which a set of the Piezo-resisters are created on the silicon chip. A set of electrical bridged is formed by such Piezo-resistive resisters to generate signals proportional to the applied acceleration.
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Product
Emulation
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Synopsys ZeBu® emulation system delivers the performance needed to make verification teams and software developers working on the most advanced chips successful. ZeBu emulation systems are modular, allowing users to deploy the capacity needed in a scalable and easily extensible fashion.
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Product
96-CH High-Driving DIO Card
PCI-7396
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The PCI-7396 is 96-bit parallel digital input/output (DIO) cards designed for industrial applications. The PCI-7396 emulates four 8255 Programmable Peripheral Interface (PPI) chips. Each PPI offers three 8-bit DIO ports which can be accessed simultaneously. The total 12/6 ports can be configured as input or output independently.
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Product
Battery Management Chip Module
Sentinel
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The first single system on chip module. Measures cell voltage, cell internal temperature and cell impedance.
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Product
Limiter Diodes
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The SemiGen SLP7100 series of Limiter Diodes are processed with a high-resistivity epi that have thin intrinsic layers. These devices are typically in the 2 to 20 micron range of epi thickness and can be gold doped to achieve specific performance goals. These diodes are used in passive or active limiter designs in the 100 MHz to 30 GHz frequency ranges. They are ideal for use in high-power applications and can be supplied in chip form or in your choice of packages below.
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Product
Optical Sensors
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Vishay's proximity, reflective, transmissive, slotted interrupters, optical and ambient light sensors put the "smart" into smart devices. Advantages of Vishay sensors include best-in-class performance, in-house chip manufacturing and assembly including AEC-Q101 automotive grade product lines, and comprehensive range of package types for wide range of applications.
