Chip
Passive or active components test and their interconnected circuitry in silicon or germanium.
See Also: Integrated Circuit, IC
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Product
Inspection Microscope
Z-NIR
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The McBain Z-NIR Near Infrared Inspection System is best-in-class for wafer-to-wafer and die-to-die alignment measurement and verification. This unique tool has been sold into many industries with various applications including sub-surface wafer and die inspection for cracks and bond integrity, MEMS, wafer bonding, 3-D chip stacking, failure analysis, process development, tool verification, part characterization, environmental testing and more.
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Product
Universal Counter (150MHz - 9GHz)
S4386
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S4386 series universal counter is a kind of high-precision instrument for measurement of frequency and time, which is developed by Saluki Technology. Taking the high-performance AVR single chip microcomputer as the core, this instrument is used for function control, measurement time sequence control, data processing and result display. The reciprocal counting technology is employed to achieve the equal precision measurement within the full range.Due to the characteristics such as stable performance, complete functions, wide range of measurement, high sensitivity, large dynamic range, high precision, small volume, and convenient and reliable operation, S4386 series universal counter is widely used in the fields of industrial production, scientific research, and measurement and metering as the renewal product replacing the traditional electronic counter.
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Product
DDR4 BGA Interposers, DDR4 DRAM X16 Packages
N2115A
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The N2115A DDR4 BGA Interposers are soldered in between the DRAM and PC board or DIMM raw card where the DRAM would normally be soldered. They are designed with the PCB or DIMM foot print on the bottom side and the DRAM footprint on the top side. The signals from the memory controller chip and DRAM are then passed directly to the top side of the BGA probe adapter where they can be accessed with the oscilloscope probes.
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Product
13MP MIPI Camera Module
e-CAM130_CUMI1820_MOD –
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e-CAM130_CUMI1820_MOD is a 13MP MIPI Camera Module. This small form factor 13MP camera module comes with S-Mount lens holder. It is based on AR1820HS – an 18MP CMOS Image sensor from Aptina™ / ON Semiconductor® and has a dedicated, high-performance Image Signal Processor chip (ISP) on-board that performs all the Auto functions (Auto White Balance, Auto Exposure control) in addition to complete image signal processing pipeline that provides best-in-class images and video and the optional MJPEG compression. Though the AR1820HS is an 18MP image sensor, the e-CAM130_CUMI1820_MOD supports only up to 13MP resolution.
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Product
NVM Express
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NVM Express is a scalable host controller interface designed to address the needs of Enterprise, Data Center and Client systems for supporting chip-to-chip, board-to-board, adapter and distance solutions. The protocol can efficiently use interconnect and fabric technologies such as PCI Express, Ethernet and Fibre Channel. Teledyne LeCroy provides protocol analysis, emulation, exerciser and other test equipment to service all NVMe storage applications.
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Product
8G SO-DDR5-5600 1GX16 1.1V SAM -20~85℃
AQD-SD5V8GN56-SCH
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SAM Original Chip, Industrial Design for Improved Reliability, PCB: 30μ gold finger. Anti-sulfuration, Semi Wide-temp Support -20~85℃.
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Product
P/N 1110087 144-Pin VQFP-to-PGA Adaptor
1110087
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144 Pin VQFP to PGA Adapter. Convert surface mount VQFP packages to a 13 x 13 PGA footprint. Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs. Pins are mechanically fastened and soldered to board using Aries patented process, creating a reliable electrical connection and rugged contact. Consult factory for panelized form or for mounting of consigned chips.
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Product
Compact Professional IC Tester
ChipMaster
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The ABI ChipMaster Compact Professional is a low-cost, hand-held out-of-circuit IC tester. The ChipMaster is designed for testing digital ICs with up to 40 pins through a ZIF socket (see LinearMaster for analogue devices). A range of adapters is also available for SOIC and PLCC devices.
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Product
FPGA Card
VP869
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The VP869 is a high-performance 6U OpenVPX FPGA processing board featuring two Xilinx® UltraScale+™ FPGAs and a Zynq® 7000 Series multiprocessor system-on-chip (MPSoC). It is designed for the most demanding mission critical military, defense, and industrial applications where extreme FPGA processing and I/O bandwidth capabilities are needed. Applications include electronic warfare, signal intelligence, radar/sonar, and high performance embedded computing.
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Product
3D-IC Solution
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Consumer demand for increased bandwidth and low power in smaller form factor has forced design teams to pursue design and manufacturing alternatives to single system-on-chip (SoC) approaches. Moving to advanced geometries like 20nm/14nm is a natural progression; however, it has its own cost, yield, manufacturing, and IP reuse challenges.
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Product
JTAG (and IJTAG) Environment Tool Suite
SAJE
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SAJE is the SiliconAid Suite of JTAG related standards focused tools for chip development, verification, validation and patterns generation of ATE, Board, and System Test. Each tool can be used as a point tool by itself to compliment other tools in your flow. However, the SAJE Tool Suite used together in a flow can provide a total solution that also leveraging previous steps for debug and analysis.
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Product
Analysis
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External appearance due to non-destructive semiconductor · X-ray fluoroscopic observation, SAT observation, electrical operation confirmation, ESD fracture analysis, plastic opening observation of Chip, search for abnormal portions by EMS / OBIRCH, package (PKG) analysis, Please do not hesitate to contact us anything related to semiconductor analysis, such as observation by polishing / parallel polishing (ball and bump observation etc.), peeling observation of defective part, analysis of foreign matter by EDX · FT - IR etc.
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Product
XMC Display Control Card
XM26001
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LinkedHope Intelligent Technologies Co.,Ltd.
XM26001 is a graphics, image processing and computing single-board computer independently developed by Linghao Intelligent®. It uses the AMD G series APU GX-210HA by default, integrating the CPU, GPU, south bridge and north bridge on one silicon chip.
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Product
16GB SO-DDR4-3200 1GbX8 1.2V ECC Samsung Chip
AQD-SD4U16GE32-SE
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16GB, Speed 3200MHz, 30u" Gold Plating Thickness, Anti-sulfurization resistance, ECC.
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Product
Miniature 8-channel photon counter
id150 SERIES
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Intended for large-volume OEM applications, the id150-1x8 is the only multichannel solid-state single photon detector on the market. It consists of a CMOS silicon chip packaged in a standard TO8-16pin header with a transparent window cap. The chip combines 8 in-line single photon avalanche diodes that can be accessed simultaneously for parallel processing. square in center-to-center A fast active quenching circuit is integrated within each pixel in order to operate each diode in photon counting regime. The chip is mounted on a printed circuit board on top of a single-stage thermoelectric cooler (TEC). A thermistor can be used to measure the temperature of the chip. Only two low power supplies of +5V and -25V are needed for operation in photon counting mode. The fast active quenching circuit leads to a dead time of less than 50ns per channel. An outstanding timing resolution of less than 60ps allows high accuracy measurements.
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Product
Ethernet
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Arasan Chip Systems has a complete portfolio of Fast (10/100) Mbps and Gigabit (10/100/1000) Mbps and now 10Gigabit Ethernet IP. Our high quality IP has completed the rigorous interoperability tests at UNH-IOL laboratories and has been widely licensed. Arasan also provides a portable Ethernet driver.
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Product
KV CAPS
500 V
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Macom Technology Solutions Holdings Inc.
The MACOM KV CAPSTM Si high voltage capacitors feature very high working voltage ratings, very low loss and excellent stability by virtue of their novel internal construction and very high-quality dielectric layers. These capacitors are available as unpackaged chips. The chips have gold bonding surfaces on both terminals to enable excellent bonding and minimum contact resistance.
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Product
GPIB PC/104 Interface Card & Cable
GPIB-PC104-XL
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The ines GPIB PC/104 interface card uses the enhanced features of the ines GPIB chip , resulting in a reliable solution for industrial measurement.
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Product
MPI Sorter Series
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MPI’s Sorter Series are improving production efficiency and yields for market sectors related to LED chip, package production, discrete device handling, and IC substrate manufacturing. Deploying MPI’s Pick & Place technology, the Sorter Line offers dedicated sorting and defect inspection solutions particularly suited for GaN, GaAs, Vertical LED Chip, Flip Chip, and Laser Diode applications. With a proven heritage of and market-advanced technologies, MPI offers competitive and differentiated solutions that are scalable and cost-effective.
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Product
Peak Track Instrument
90323
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The model 90323 Peak Track Instrument is a general-purpose sensor readout device designed to complement our AutoID line of load cells and torque sensors. AutoID is a term that indicates that the calibration information for a sensor is stored on a chip inside the sensor’s connector. AutoID allows true “plug and play” operation without manual calibration procedures of any kind. The unit is also equipped with a 2-line alpha-numeric display and single button operation for simplicity.
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Product
Universal Programmer Superpro 6100N
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Until now,Support 401 IC manufacturer, 103004 pcs devices and keeps growing.Features:Supports 87454 types of devices from 305 IC manufacturers (by 3/15/2013) and keeps growing.Supports EPROM、Paged EPROM、Parallel and Serial EEPROM、FPGA、PROM、FLASH(NOR & NAND)、BPROM、NVRAM、SPLD、CPLD、EPLD、Firmware HUB、Microcontroller、MCU；Supports devices with Vcc as low as 1.2V. Socket Adaptors available for DIP、SDIP、PLCC、JLCC、PGA、LGA、SOIC、SOJ、SOT、QFP、TQFP、PQFP、VQFP、MQFP、LQFP、TSOP、SOP、TSOPII、PSOP、SSOP、TSSOP、SON、EBGA、FBGA、FTBGA、VFBGA、μBGA、CSP、SCSP、QFN、HVQFN etc.High programming speed.Built with 144 universal pin-drivers. Universal adaptors are available for varies packages up to 144 pins. Quick new device support. Popular NAND FLASH Platform supported including Samsung (XSR1.0/1.6), QualComm, HYNIX（HIFFS）, MTK(Solution V1.1), ICERA (v1.0/2.0), ST （7162、7141等）, AMLOGIC(IF2/0), REALTEK, PICOCHIP, DataLight ( Flash FX Pro), Marvell(310/303/920/935…), BroadCom, ZTE, Intel (CE4100)，UBI, LEADCORE(L1809OG), MSATR etc. Customer-specific NAND solution available.PC hosted mode and stand-alone dual modes. Under PC hosted mode the programmer is controlled by a PC via USB2.0 (high speed) to program a chip. Under stand-alone mode the programmer is controlled via a 6-KEY keypad and a 20 character by 4 line LCD display. A CF card is used to store the project files.User can operate multiple units to construct a concurrent multiprogramming system thank for the stand-alone mode. IC manufacturer approved programming algorithms are used for high reliability.Testing functions for logic devices.Advanced and powerful software functions.Production mode starts chip operation at the moment the chip is inserted in the socket properly.Project function simplifies processes such as device selection, file loading, device configuration setting, program option, and batch file setting into one touch step.Password can be set for project files and production volume controlBatch command combines device operations like program, verify, security into a single command at any sequence.Dynamic buffer makes it possible that each chip is programmed with different data file. Applications including serial number, MAC address etc.Log file is useful for quality tracking.Many safety mechanisms are built including self-diagnosis, wrong chip placement detection, poor-pin-contacting detection, ID checking, over-current and over-voltage protection etc.Windows XP/Vista/Win7/ Win8/Win10 compatibility.
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Product
Value Added Services
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For over three decades, Teledyne RF & Microwave has built a strong heritage delivering advanced value added services to the military, space and industry sectors of aerospace. With test capabilities up to 40 GHz, Teledyne offers chip and wire assembly of products ranging from single die through complex hybrids which can then be submitted to a combination of customer-specified RF and DC testing and environmental screening. We offer a complete portfolio of screening and testing services for device sorting, labeling, lead forming and tinning, and tape-and-reel packaging, as well as LAT services on packaged devices or bare-die, including diodes, transistors, and MMICs.
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Product
TDR System
TS9001
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The system accurately analyzes the wiring quality of various leading-edge semiconductor packages such as Flip Chip BGA, wafer level packages, and 2.5D/3D ICs using terahertz technology. It is a TDR analysis system that has the world’s top-class signal quality.
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Product
Chrysler CCD Vehicle Bus Comms PC Card
SL100
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The SL100 uses a standard 16450 UART with baud rate settings that makes it capable of communicating with a Chrysler CCD Vehicle bus. The SL100 uses a protected interface driver chip, as prescribed by the bus specification, to connect with vehicle peripherals in a robust and highly noise immune way. The card automatically configures to become another COM port by using the built-in O.S. drivers that are tried and tested and are optimized to work in the Windows environment.
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Product
Receiver Conformance Test Application for IEEE 802.3ck
M8091CKCA
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Designed to assist and simplify the stress signal calibration used for testing the inputs of IEEE 802.3ck Draft 3.3 chip-to-chip (C2C) and chip-to-module (C2M) electrical interfaces using Keysight M8040A 64Gbaud Higher Performance BERT or an M8050A 120Gbd High-Performance BERT together with Keysight Digital Communication Analyzer (DCA) Oscilloscope or Infiniium UXR real-time Oscilloscope.
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Product
Circuit Card Assembly
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Teledyne Advanced Electronic Solutions assembles and tests a variety of complex circuit card assemblies (CCAs) using leading edge, advanced technology assembly automation. We specialize in low-volume, high-mix assembly of highly complex CCAs.- RF, analog, high-speed and digital circuits on rigid-flex and Cu core substrates- Typical lot sizes from 3 to 300 pieces- 4 high speed, flexible SMT lines- Production processes for components from 0201 chips to large grid-array components and connectors- 100% solder paste, automated optical, and x-ray inspection- Forced air convection reflow with inert atmosphere option- Special processes for RF assemblies (filters, shields, etc)- BGA underfill, conformal coating, etc.- Selective and wave solder pin-thru-hole processes- CCA and component bonding processes
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Product
USB-8452, 3.3 MHz I2C, 50 MHz SPI I2C/SPI Interface Device
781964-02
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The NI USB‑8452 is a master interface for connecting to and communicating with inter-integrated circuit (I2C) and serial peripheral interface (SPI) devices. With plug‑and‑play USB connectivity, the USB‑8452 is a bus-powered, portable solution to communicate with consumer electronics and integrated circuits. It also includes eight general-purpose digital I/O lines for a variety of applications, such as configuring the address of I2C devices, toggling LEDs, or strobing convert and data ready lines common to analog converter chips. You can physically place the USB‑8452 more closely than PCI interfaces to I2C/SPI devices, which reduces I2C bus length and minimizes noise problems. Additionally, the interface provides +5 V and GND to power circuits with no external power supply.
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Product
25G APD Photodiodes
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Macom Technology Solutions Holdings Inc.
MACOM offers the highest sensitivity avalanche photodiodes (APD) on the market to satisfy 28G related applications. The chips are usable from 1250 to 1650 nm for bit rates up to 28 Gb/s and 28 GBd. Proprietary designs enable superior bandwidth, excellent temperature stability and high reliability to support market needs of PAM-4 and 400G Ethernet applications.
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Product
Netlist Analyzer
GateVision
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GateVision PRO is the third generation of graphical netlist analyzers from Concept Engineering. Completely rewritten to run on modern 32/64bit platforms, GateVision PRO provides the designer of even the largest chips with intuitive design navigation, schematic viewing, logic cone extraction and interactive logic cone viewing for debug support and design documentation.
