Showing results: 1 - 6 of 6 items found.
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UNIVANS Co., Ltd.
LED power type high efficiency PWM (Pulse Wide Modulation) control method
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UNIVANS Co., Ltd.
the electrical characteristics of the individual CHIPs in WAFER that have been completed through the FAB stage during the semiconductor fabrication process
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UNIVANS Co., Ltd.
The reliability test board is used for testing of HAST, THB, HTOL, BURN-IN, etc. It is a product that evaluates the environmental test and durability when applied to actual products such as lifetime test, high temperature, low temperature, high humidity and thermal shock
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UNIVANS Co., Ltd.
The semiconductor manufacturing process is divided into a front process (WAFER) and a post process (PACKAGE). The LOAD BOARD is an INTERFACE device for inspecting the function and performance of a package state IC, which is a post process, It is an INTERFACE key device for inspection. In particular, LOAD BOARD is widely used in non-memory semiconductor inspection equipment.
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UNIVANS Co., Ltd.
IC Package It is a device to install INTERFACE between TESTER and DEVICE during TEST to check electrical defects such as O / S (Open, Short) test, mounting test, BURN-IN TEST and RLC TEST, The device
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UNIVANS Co., Ltd.
Why need for PCB Simulators?Higher data speed (>GHz) Higher density Larger system size EMI concern Cost cut down Reduce of project term
