ADLINK Technology Inc.
ADLINK Technology Inc. (TAIEX:6166) leads edge computing, the catalyst for a world powered by artificial intelligence. ADLINK manufactures edge hardware and develops edge software for embedded, distributed and intelligent computing– more than 1600 customers around the world trust ADLINK for mission-critical success. ADLINK contributes to open source, robotics, autonomous, IoT and 5G standards initiatives across 24+ consortiums, driving innovation across industries. For over 25 years, with 1800+ ADLINKers and 200+ partners, ADLINK enables the technologies of today and tomorrow, advancing technology and society around the world.
- +886-3-216-5088
- +886-3-328-5706
- service@adlinktech.com
- No. 66, Huaya 1st Rd.,
Guishan Dist.
Taoyuan City, 333411
Taiwan
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Client Type COM-HPC Size C Module with 13th Gen Intel® Core™ Desktop Processor
COM-HPC-cRLS
ADLINK’s COM-HPC-cRLS COM-HPC Client Type Size C module is based on 13th Gen Intel® Core™ desktop processor. It features Intel’s advanced hybrid architecture (with up to 8 P-cores and 16 E-cores) along with 16 PCIe Gen5 that provide superior performance with fewer lanes than its predecessors, allowing for simplified designs and reduced time to market to drive various AIoT deployments.
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96-CH High-Driving DIO Card
PCI-7396
The PCI-7396 is 96-bit parallel digital input/output (DIO) cards designed for industrial applications. The PCI-7396 emulates four 8255 Programmable Peripheral Interface (PPI) chips. Each PPI offers three 8-bit DIO ports which can be accessed simultaneously. The total 12/6 ports can be configured as input or output independently.
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High Speed Link Extension Modules
HSL-HUB3/Repeater
HSL system is a great remote real-time I/O control solution. HSL-HUB3/Repeater comes with HSL technology and provides much flexibility in HSL system topology and extension. Machine makers and FA planners can use this extension module to install subsystem and process remote side (2.4 km) I/O even motion control.
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9-Slot 3U PXI Express Chassis with AC - Up to 8GB/s, All Hybrid
PXES-2590
The ADLINK PXES-2590 is a 9-slot PXI Express chassis equipped with advanced features and functions. Compliant with PXI Express and cPCI Express specifications, the PXES-2590 offers one system slot, one system timing slot, and seven hybrid peripheral slots for versatile test and measurement applications requiring enhanced bandwidth. The hybrid-slot design accepts installation of CompactPCI, PXI, CompactPCI Express, and PXI Express modules into any peripheral slots in PXES-2590, maximizing flexibility. The PXES-2590 is built on a four-link PXI express chassis with 8 GB/s system bandwidth, and 2 GB/s slot bandwidth for all peripheral slots.
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Value Family 6th Generation Intel® Core™ i7/i5/i3 Processor-Based Expandable Fanless Embedded Computer
MVP-6100 Series
- 9th Gen Intel® Xeon®/Core™ i7/i5/i3 & 8th Gen Celeron® LGA processor- Dual SODIMMs for up to 32GB DDR4 non-ECC/ ECC memory- Rich I/O: 2x DP++/ DVI/ VGA/ 3x GbE/ 4x COM/ 8-ch DI/ 8-ch DO/TPM2.0- 2x USB 3.1 Gen2 + 1x USB 3.1 Gen1 + 3x USB 2.0- Rich storage: up to 4x 2.5" SATA, CFast, M.2 2280
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Industrial Mini-Redundant AC Power Supply, 460W
APS-946XAR
- Power (typical): 460W- AC Voltage Input Range: Universal- Certifications: UL/cUL/TUV/CCC- Dimensions: 195 x 150 x 86 (mm)
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6th Generation Intel® Core™ i7/i5/i3 Processor-Based Fanless Embedded Computer
MXE-5500 Series
ADLINK's new Matrix MXE-5500 series of rugged quad-core fanless computers features the 6th generation Intel® Core™ i7/i5/i3 processors, delivering outstanding performance with robust construction.
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Software & Utilities
Supports ADLINK PCI Express, PCI, PXI, USB DAQ devices and PXI controller, chassis, bus expansion modules, and edge platform.
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Embedded MXM GPU Module With NVIDIA RTX™ ADA 2000
EGX-MXM-AD2000
- NVIDIA Ada Lovelace Architecture- Standard MXM 3.1 Type A (82x70 mm)- PCIe Gen 4 x8 Interface- 3072 CUDA® Cores, 24 RT Cores, and 96 Tensor Cores- 14.5 TFLOPS peak FP32 performance
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Mini Type COM-HPC Module With Intel® Core™ Ultra Processor (Meteor Lake)
COM-HPC-mMTL
Combining a power-efficient Intel® Core™ Ultra processor with up to 64GB LPDDR5 memory in a 95x70mm size makes this ideal for battery-powered, space-limited, high-performance edge applications like medical ultrasound devices, industrial automation, data loggers, autonomous driving, and AI robots.
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6U CompactPCI Enclosures & Systems
1~9U CompactPCI chassis for 6U CompactPCI boards , most of which are with front/rear panel I/O, H.110 CT bus and redundant power supplies.
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Embedded MXM Modules
ADLINK’s Embedded MXM GPU modules - based on NVIDIA's embedded GPUs - can boost the performance of a wide range of workloads, including image processing and analysis, computing acceleration, and artificial intelligence (AI). ADLINK’s Embedded MXM GPU modules offer high performance, high data bandwidth, power efficiency, and longevity support in a reduced hardware footprint, well-suited for size, weight, and power (SWaP) constrained applications. ADLINK’s Embedded MXM GPU modules can increase system responsiveness and accuracy, as well as decrease latency, and are an ideal fit for industrial automation, healthcare, transportation, aerospace and defense, gaming, and telecom applications.
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Intel® Celeron® N3160/ N3060 SoC Fanless Embedded Computer
MXE-1500 Series
The successor to ADLINK's best-selling MXE-1300 Series, the MXE-1500 offers richer I/O interfaces, and more flexible I/O configurations in the same compact enclosure. Intel® Celeron®(Braswell) processors, Intel’s last generation of CPU to support Windows 7, power the MXE-1500 to a 90% increase in image processing capabilities over the previous generation, and support three independent displays, altogether delivering an unequaled price/performance ratio and making the MXE-1500 an ideal choice for industrial automation applications and mass transit operators.
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1000 BASE-T1 Ethernet
MECS-6110
- 1x Intel® Xeon® D-2100 family processor- 4x DDR4-2666 1DPC RDIMM ECC REG up to 256GB- 2x 2.5” SATA bays and 2x M.2 M Key interfaces- 420mm depth 1U 19” rackmount form factor- Built-in Intel® QAT support- TPM 1.2/2.0 modul- 2x IEEE 1588 v2 1PPS/TOD RJ-45 port and 4x 1PPS SMA input/output Specifications- Verified for Intel® Select Solution for uCPE on CentOS
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15-Slot 32-Bit 3U I/O with 6U System CompactPCI Backplane
cBP-6515R
- PICMG:2.0 R3.0, 2.1 R2.0, 2.7 R1.0- Dimension:202.5 x 262.05 (mm, WxH, vertical insertion view)- Segment:One- cPCI Bus:32-bit/33MHz- System Slot:Right-hand side- System Slot Rear I/O:P3, P4 and P5 rear I/O with AB-type shroud- Peripheral Slot:14 (Bus A: 7 slots, Bus B: 7 *slots)Note- Peripheral Slot Rear I/O:P2 rear I/O with AB-type shroud