Showing product results. 1 - 15 of 650 products found.
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Starter Kit - ETX - ADLINK Technology Inc.
*ETX module of choice*CPU, Memory of choice*Thermal Solution (heatspreader, and heatsink) of choice*Reference Carrier Board*Schematics, Design Guide, and User ManualsADLINK USB Stick with Documentation, Software,
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Q7-Starterkit - ADLINK Technology Inc.
*Qseven compliant Q7-BASE carrier board*SD card and USB stick*300 Watt ATX power supply
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ADLINK Technology Inc.
Pulse train motion controllers generate high-frequency digital signals to control servo motors and steppers, matching performance and precision positioning of high-performance servo amplifiers.
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ADLINK Technology Inc.
The COM-HPC specification currently defines three client modules: Size A (95mm x 120mm), Size B (120mm x 120mm) and Size C (160mm x 120mm). The largest of the server modules, Size C (160mm x 120mm), offers up to four on-board SO-DIMM sockets. The power input is a single 12-volt supply that can deliver up to 251 watts of power, and there are 49x lanes PCIe Gen5 in total.
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COM-HPC-cADP - ADLINK Technology Inc.
ADLINK’s COM-HPC-cADP COM-HPC Client Type Size B module is based on the 12th Gen Intel® Core™ processor and is the first COM-HPC Client Type module to support advanced hybrid architecture with up to 6 Performance-cores (P-cores) for IoT workloads and up to 8 Efficient-cores (E-cores) for background task management, boosting productivity and fueling IoT innovation across a wide variety of deployments.
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ADLINK Technology Inc.
The COM-HPC specification currently defines two server modules. The largest of the server modules, Size E (200mm x 160mm), offers up to eight on-board DIMM sockets. The power input is a single 12-volt supply that can deliver up to 358 watts of power, and there are 64x lanes PCIe Gen5 in total.
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COM-HPC-sIDH - ADLINK Technology Inc.
ADLINK’s COM-HPC-sIDH COM-HPC Server Type Size D module is based on the Intel® Xeon® D-2700 processor and features integrated high-speed Ethernet for up to 8x 10G or 4x 25G combined with 32 PCIe Gen4 lanes for instantaneous responsiveness and performance. Equipped with Intel® TCC, Deep Learning Boost (VNNI), and AVX-512 technologies for optimal, accelerated AI performance, and support for Time Sensitive Networking (TSN), it offers precise control for hard-real-time workloads across all networked devices.
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ADLINK Technology Inc.
ADLINK’s COM-HPC-sIDH COM-HPC Server Type Size D module is based on the Intel® Xeon® D-2700 processor and features integrated high-speed Ethernet for up to 8x 10G or 4x 25G combined with 32 PCIe Gen4 lanes for instantaneous responsiveness and performance. Equipped with Intel® TCC, Deep Learning Boost (VNNI), and AVX-512 technologies for optimal, accelerated AI performance, and support for Time Sensitive Networking (TSN), it offers precise control for hard-real-time workloads across all networked devices.
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AVA Developer Platform - ADLINK Technology Inc.
The platform hosts the SOAFEE (Scalable Open Architecture for Embedded Edge) providing a cloud-native environment for embedded edge development. It supports the open source EDKII as bootloader with UEFI, so customers can just download a stock AArch64 (arm64) ISO such as Ubuntu and install it through booting a live ISO directly on the target. The same convenience we have become used to by using x86 / amd64 target systems.
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Vortex OpenSplice - ADLINK Technology Inc.
Vortex OpenSplice enables data to be shared and integrated across a wide spectrum of operating systems and platforms. It provides a full implementation of both the OMG DDS latest rev1.4 (DCPS profiles) and the OMG-DDSI / RTPS v2.3 interoperable wire-protocol standards. It is targeted for use with server-class (desktops, racks etc.) platforms as well as more specialized real-time embedded environments and operating systems (e.g. single board computer running VxWorks). Vortex Opensplice is fully interoperable with Cyclone DDS, Vortex Link and and Vortex Insight .
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EOS-i6000-P Series - ADLINK Technology Inc.
The ADLINK AI Plug-and-Play (PnP) Solution is a set of ADLINK AI edge hardware and data connectivity platforms that help our partners build and deploy AI solutions faster and simpler. With ADLINK Data River™ enabled at AI edge platforms, devices, AI inferences, and data integrations, the AI PnP Solution offers a crossplatform,flexible, scalable solution that delivers business value.
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ADLINK Technology Inc.
ADLINK provides a complete line of 3U and 6U CompactPCI platform and along with a diverse line of plug in boards and these CompactPCI products provide the most cost-effective high performance platforms for telecommunications, military , industrial automation.
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Qseven® - ADLINK Technology Inc.
Qseven is an off-the-shelf, multi-vendor, computer-on-module that integrates all the core components of a common x86 PC and is mounted onto an application specific carrier board. A single ruggedized 230-pin MXM connector provides the carrier board interface to carry all the I/O signals to and from the Qseven module.
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SMARC - ADLINK Technology Inc.
SMARC form factor is the only computer-on-module form factor that truly is capable of supporting both ARM and x86 designs. With 314-pins on a high speed MXM3 connector, SMARC can fully cover both typical x86 interfaces as well as typical ARM type low level signals. Using ARM SoCs opens the possibility to leverage the product ecosystem of familiar devices such as tablet computers and smart phones. Alternative low power SoCs and CPUs, such as tablet oriented x86 devices and other RISC CPUs may be used as well.
