Chip
Passive or active components test and their interconnected circuitry in silicon or germanium.
See Also: Integrated Circuit, IC
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1G SO-DDR1-400 200Pin 64MX8 2.5V Unbuffered
96SD1-1G400NN-AP
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DDR1-400, 200-Pin, 64MBX8, Promos Chip.
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Product
16G SO-DDR4-3200 1GbX8 1.2V SAM -40~85C
AQD-SD4U16N32-SEW1
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DDR4 3200Mhz Unbuffered SO-DIMM, 30u" Gold Plating Thickness, Anti-sulfurization resistance. 1.2V power consumption, Samsung original chip, wide temperatures from -40° to 85°C.
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Product
AMC GBit link card/VITA 57 FMC carrier
SIS8100
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The SIS8100 will be a single width mid height AdancedMC card. It will interface with a single PCI Express lane over a PLX Technology PEX811 PCI Express to local bus bridge chip and have an on board Virtex IV FPGA. The default stuffing option has a Small Form Factor (SFF) optical link medium that can be operated at 1, 2.5 and 4 GBit/s.
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10-CH General-Purpose Timers/Counters & 8-CH Digital I/O Card
PCI-8554
Digital I/O Module
- Supports a 32-bit 5 V PCI bus- On-board four 82C54 programmable timer/counter chips- 10-CH independent 16-bit down counters- 1-CH 32-bit cascaded timer- Four programmable clock sources for each timer/counter
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SparkFun ESP8266 Thing
Dev Board (with Headers)
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This is the SparkFun ESP8266 Thing Dev Board --- a development board that has been solely designed around the ESP8266, with an integrated FTDI USB-to-Serial chip. The ESP8266 is a cost-effective and very capable WiFi-enabled microcontroller. Like any microcontroller, it can be programmed to blink LEDs, trigger relays, monitor sensors or automate coffee makers. With an integrated WiFi controller, the ESP8266 is a one-stop shop for almost any internet-connected project. To top it all off, the ESP8266 is incredibly easy to use; firmware can be developed in Arduino and uploaded over a simple serial interface. The ESP8266 Thing Development Board breaks out all of the module’s pins with pre-soldered headers, and the USB-to-serial converter means you don’t need any peripheral components to program the chip. Just plug in a USB cable, download the Arduino board definitions, and start IoT-ing.
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Smart Lighting
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The AS721x/AS722x are complete System-on-Chip (SoC) sensor-integrated IoT smart lighting managers for color-tunable white lighting applications. They also support daylight harvesting and color/lumen maintenance lighting applications. 0-10V control and network-enabled high-level command inputs are combined with industry-standard PWM and 0-10V outputs for direct control of LED power systems.
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Scanning Acoustic Microscope
Pulse2
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This industry-leading scanning acoustic microscope provides a universal inspection tool for packaged semiconductor development, production and failure analysis. With the ability to detect air defects as thin 0.05 micron and spatially resolve defects down to 10 microns, the ECHO is perfect for bump detection, stacked die (3D packaging) inspection, complex flip chip inspection and more traditional plastic packages.
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SparkFun Analog/Digital MUX Breakout
CD74HC4067
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This is a breakout board for the very handy 16-Channel Analog/Digital Multiplexer/Demultiplexer CD74HC4067. This chip is like a rotary switch - it internally routes the common pin (COM in the schematic, SIG on the board) to one of 16 channel pins (CHANxx). It works with both digital and analog signals (the voltage can't be higher than VCC), and the connections function in either direction. To control it, connect 4 digital outputs to the chip's address select pins (S0-S3), and send it the binary address of the channel you want (see the datasheet for details). This allows you to connect up to 16 sensors to your system using only 5 pins!
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Chip Resistor Array
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Panasonic Industrial Devices Sales Company of America
An AEC-Q200 Compliant SeriesPanasonic components specified as AEC-Q200 Compliant are consistently designed into automotive systems. However, today’s Design Engineers are specifying AEC-Q200 components to meet the high-quality standards of devices beyond automotive applications.
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On-Off Controllers
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The STM6600 and STM6601 smart push-button on/off controller chips offer protection for battery-operated devices in many ways. These include minimizing the risk of powering up without sufficient battery energy to complete the sequence, which can damage the system. It can also prevent power-up if it detects a fault in the power supply.
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Product
3.4 MP Custom Lens Low Light Camera Module
e-CAM30_CUMI0330_MOD
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e-CAM30_CUMI0330_MOD is a high performance, small form factor, 3.4 MP pluggable Low Light Camera Module with S-Mount lens holder. It is based on AR0330 - a 3.4MP CMOS Image sensor from ON Semiconductor®. It has a dedicated, high-performance Image Signal Processor chip (ISP) on-board that performs the entire Auto functions (Auto White Balance, Auto Exposure control) in addition to complete image signal processing pipeline that provides best-in-class images, videos and the optional MJPEG compressions.
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Wireless Test Solutions
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Adivic/Chroma Group has been in the development of RF & Wireless test solutions for more than a decade. Take RF Recorder as an example, it has been adapted by all major Japanese & Korean automotive brand names such as Mitsubishi, Honda, Hyundai,.. ,most of the global IC design houses with DTV chips, and also military entities in NATO. With the same customer-proved Software Defined Radio architecture, we have introduced Wi-Fi, Bluetooth tester since 2014. It will soon cover other current/future wireless standards such as 4G/LTE, 802.11ax, 802.11ah, etc.
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32GB DDR4-3200 2GbX8 1.2V ECC Samsung Chip
AQD-D4U32GE32-SB
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32GB, Speed 3200MHz, 30u" Gold Plating Thickness, Anti-sulfurization resistance, ECC.
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X-Ray Inspection System
MX1
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Manncorp’s new MX1 is a high-performance x-ray inspection system designed for real time imaging of multilayer PCBs and dense metal BGAs, μBGAs, and chip scale packages. Its high voltage (80kV), computer-controlled x-ray tube and 35 μm focal spot provide the power necessary for detection of a variety of defects including bridging, voids, and missing balls. The MX1’s standard camera features continuous zoom magnification from 4X to 50X and variable angle viewing up to 45°, and an upgrade to the x-ray tube can boost magnification to 225X.
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Product
SF6 Density Meter Tester
JHMD-1
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Xiamen Jiahua Electrical Technology Co.,Ltd
JHMD-1 is a smart tester. By using high accuracy core units, pressure sensor, A/D, D/A transducer, 32 bit ARM MCU and TI company’s high speed signal chip, it can automatically calibrate the density relay, measure pressure at signal activity temperature, convert pressure from any temperature to 20℃ standard pressure, print test data and save for review. It identifies the fault during the test. The whole procedure is under automatically operation, JHMD-1 is a high accurate, high stable, reliable tester.
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SDIO Wi-Fi Module
SX-SDMAC
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This Wi-Fi SDIO module is a low-power, single-stream solution with 802.11a/b/g/n/ac support based on the QCA9377 System-on-Chip from Qualcomm Atheros. This module supports Wave 2 MU-MIMO (Client), which increases the overall WLAN system performance by 3X compared to 11n. The module’s small form factor, rich features, and low power make it perfect for portable devices.
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Step Recovery Diodes
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Macom Technology Solutions Holdings Inc.
MACOM’s Silicon and GaAs varactor multiplier diodes provide broadband performance ranging from 10 MHz to 70 GHz. They are ideal for multiplier circuits and are available in die form, plastic and ceramic packaging. These diodes boast a flip chip series for higher frequency millimeter wave applications; plastic packaged series for microwave frequency surface mount applications; ceramic packaged series for high power waveguide and coaxial applications.
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Product
8G SO-DDR4-3200 1GbX8 1.2V SAM -40~85C
AQD-SD4U8GN32-SEW
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DDR4 3200Mhz Unbuffered SO-DIMM, 30u" Gold Plating Thickness, Anti-sulfurization resistance. 1.2V power consumption, Samsung original chip, 100% tested for stability, compatibility and performance.
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RF Signal Generators
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The G6 VSG from Transcom Instruments is a Vector Signal Generator that operates from 10 MHz to 6 GHz. It can simulate GSM, EDGE, CDMA, TD-SCDMA, WCDMA, CDMA2000, TD-LTE, FDD-LTE, NB-IoT, and LoRa base station signals for production and calibration of UE, chips. The signal generator has a dynamic range (power range) from -100 to 10 dBm and an in-built automatic gain control function. It is available in a module that measures 180 x 50 x 290 mm and is ideal for educational practices, wireless monitoring, mobile communication, aerospace and national defense industry in terms of research, manufacturing, testing and measurement, and electronic countermeasure.
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VS Tool Suite for Virtual Scan Synthesis and ATPG
VirtualScan
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VirtualScan is SynTest's solution to combat increase in test data volume and test cycle volume. With VirtualScan (VS) an extremely large number of short scan chains within the SOC can be virtually accessed from outside the chip with a limited number of pins assigned as scan pins.
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Probing Machines
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Probing machine is a wafer transfer and positioning device used for testing the electrical characteristics of chips formed on wafers. This wafer test is used to sort out good and defective chips.
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32 Channel Multihit TDC (25 ps)
V1290A-2eSST
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The V1290A-2eSST is a 32 channel Multihit TDC, housed in a 1-unit wide VME 6U module. The unit features High Performance Time to Digital Converter chips developed by CERN. LSB is 25 ps (21 bit resolution, 52 µs FSR). The module accepts both ECL and LVDS inputs.
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Low Light USB Camera With Microphone
Conversa
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Conversa, camera for conversation (See3CAM_CU38), is a 3.4 MP low light USB 3.1 Gen1 camera with built-in stereo microphone providing 16bit audio @48KHz. This low-light USB camera is the next advanced version of our flagship product See3CAM_CU30, with built-in stereo microphone for crystal clear sound. It is a plug-and-play (UVC and UAC) compliant USB 3.1 Gen1 SuperSpeed camera and is also backward compatible with USB 2.0 host ports. It has S-mount (M12) lens holder which allows customers to choose and use the lens according to their requirement. It has a dedicated, high-performance Image Signal Processor chip (ISP) that performs all the Auto functions (Auto White Balance, Auto Exposure control).
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Optical Transimpedance Amplifiers
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Analog Devices optical transimpedance amplifiers offer a complete, high performance, single chip solution for converting photodiode current into a differential voltage input. Supporting data rates from 155 Mbps to 11.1 Gbps, our transimpedance amplifiers are ideally suited for data communications and telecommunications applications supporting lay protocols including 1×, 2×, 4×, and 8× Fibre Channel, 10GBASE-LX4, SONET/SDH up to OC-192 with FEC, and 10 Gigabit Ethernet. Our transimpedance amplifiers feature low input referred noise current, high input current, and low power dissipation.
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Product
Metal Foil Llow Resistance Chip Resistor
MFR (Metal foil)
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*Low Resistance / TCR / EMF 9only FOR MnCu) / Inductance*Excellent long term stability*RoHS compliant and halogen free.*Lead free.* High precision current sensing and voltage division.
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Product
SparkFun GPS Breakout
NEO-M9N, Chip Antenna (Qwiic)
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The SparkFun NEO-M9N GPS Breakout with on-board chip antenna is a high quality GPS board with equally impressive configuration options. The NEO-M9N module is a 92-channel u-blox M9 engine GNSS receiver, meaning it can receive signals from the GPS, GLONASS, Galileo, and BeiDou constellations witn ~1.5 meter accuracy. This breakout supports concurrent reception of four GNSS. This maximizes position accuracy in challenging conditions, increasing precision and decreases lock time; and thanks to the onboard rechargeable battery, you'll have backup power enabling the GPS to get a hot lock within seconds! Additionally, this u-blox receiver supports I2C (u-blox calls this Display Data Channel) which made it perfect for the Qwiic compatibility so we don't have to use up our precious UART ports. Utilizing our handy Qwiic system, no soldering is required to connect it to the rest of your system. However, we still have broken out 0.1"-spaced pins in case you prefer to use a breadboard.
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128 Channel Multihit TDC
VX1190A-2eSST
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The VX1190A-2eSST is a 128 channel Multihit TDC, housed in a 1-unit wide VME64X 6U module. The unit features High Performance Time to Digital Converter chips developed by CERN. LSB can be set at 100 ps (19 bit resolution, 52 µs FSR), 200 ps (19 bit, 104 µs FSR) or 800 ps (17 bit, 104 µs FSR).
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8G SO-DDR4-3200 1GbX8 1.2V SAM -40~85C
AQD-SD4U8GN32-SEW1
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DDR4 3200Mhz Unbuffered SO-DIMM, 30u" Gold Plating Thickness, Anti-sulfurization resistance, 1.2V power consumption. Samsung original chip, wide temperatures from -40° to 85°C.
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Solid-State High Power Amplifier 18 - 26.5 GHz
AMP4065LC-2
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Exodus Advanced Communications
Designed for EMI/RFI, lab, and general communication applications. Exodus Broadband SSPA product feature GaN, GaAsFET discrete and Chip & Wire Hybrid technologies covering one octave through decades frequency ranges from Operating Frequency Range 18.0-26.5 GHz.
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SMARC
ROM-5420 B1
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ROM-5420 SMARC v1.1 Module integrates ARM Cortex-A9 NXP i.MX6 series ultra low power SoC and I/O solution chips to be OS support ready. NXP i.MX6 supports 2D, 3D graphics acceleration, full HD 1080P video decoding and an HD 1080p video encoding hardware engine.
