Chip
Passive or active components test and their interconnected circuitry in silicon or germanium.
See Also: Integrated Circuit, IC
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Product
DDR4 Registered DIMM
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a type of computer RAM that features a register (or buffer) between the memory chips and the system memory controller. This register stabilizes the electrical load, allowing servers and workstations to utilize higher memory capacities and improve overall stability compared to unbuffered RAM (UDIMM).
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Product
NVIDIA Jetson Solutions
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Edge AI Inference computers have NVIDIA Jetson chips for video image applications in surveillance, transportation, and manufacturing sectors.
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Product
RF Signal Generators
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The G6 VSG from Transcom Instruments is a Vector Signal Generator that operates from 10 MHz to 6 GHz. It can simulate GSM, EDGE, CDMA, TD-SCDMA, WCDMA, CDMA2000, TD-LTE, FDD-LTE, NB-IoT, and LoRa base station signals for production and calibration of UE, chips. The signal generator has a dynamic range (power range) from -100 to 10 dBm and an in-built automatic gain control function. It is available in a module that measures 180 x 50 x 290 mm and is ideal for educational practices, wireless monitoring, mobile communication, aerospace and national defense industry in terms of research, manufacturing, testing and measurement, and electronic countermeasure.
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Product
6 Chip Detection and Burn Channels
CD1
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The CD1 provides 6 Chip Detect and Fuzz Burn interface(s). A Chip Detector (CD) is a magnetic-electrical device that provides a reliable method of detecting impending failure of bearings and gears.
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Product
High-Speed Analog Output
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High-speed analog output photocouplers (optocouplers) are optically coupled isolators containing a GaAlAs LED on the input side and a PIN photodiode and high-speed amplifier transistor on the output side in a single chip.
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Product
4G SO-DDR3-1600 512X8 1.35V SAM -40~85C
AQD-SD3L4GN16-SGW
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30u" Gold Plating Thickness, Anti-sulfurization resistance, Samsung original chip, Wide Temp. -40C to +85C, 100% tested for stability, compatibility and performance.
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Wireless Test Solutions
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Adivic/Chroma Group has been in the development of RF & Wireless test solutions for more than a decade. Take RF Recorder as an example, it has been adapted by all major Japanese & Korean automotive brand names such as Mitsubishi, Honda, Hyundai,.. ,most of the global IC design houses with DTV chips, and also military entities in NATO. With the same customer-proved Software Defined Radio architecture, we have introduced Wi-Fi, Bluetooth tester since 2014. It will soon cover other current/future wireless standards such as 4G/LTE, 802.11ax, 802.11ah, etc.
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Product
8G SO-DDR4-3200 1GX8 1.2V SAM -20~85℃
AQD-SD4U8GN32-SE2
Memory Module
SAM Original Chip, Industrial Design for Improved Reliability, PCB: 30μ gold finger, Anti-sulfuration, Semi Wide-temp Support -20~85℃.
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Product
32GB SO-DDR4-3200 2GbX8 1.2V Samsung Chip
AQD-SD4U32GN32-SB
Memory Module
32GB, Speed 3200MHz, 30u" Gold Plating Thickness, Anti-sulfurization resistance, Unbuffered.
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Product
4G SO-DDR3-1600 204Pin 512MX8 1.35V ECC Samsung Chip
AQD-SD3L4GE16-SG
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DDR3-1600 ECC SO-DIMM, 204-Pin, 512MX8, Samsung Chip.
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Product
RF/Microwave Assembly Capability
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Teledyne Labtech offers a comprehensive build-to-print microwave module and microwave components manufacturing service. This includes MMIC placement, Au wire bonding, SMT assembly and test.Our microwave MIC production facility is housed in a class 10,000 clean room that accommodates manual chip placement and semi-automatic wire bond assembly. Dedicated microwave components manufacturing is undertaken within production cells established to meet specific customer or product requirements.
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Product
High Speed High Mix Pick And Place
MC389
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The MC389 sets new standards for SMT pick and place speed, precision, and flexibility. Based on the MC Series’ durable ball-screw and rotary-encoded drive train, its three heads and on-the-fly vision allow accurate placement of any SMD (including 01005 chips, µBGAs, and 12-mil pitch QFPs). With an enormous placement area of 650 mm x 460 mm (25.6" x 18.1") and a capacity for up to 160 Smart Tape and Stick Feeders, the MC389 can easily be configured for virtually any high-mix project.
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Product
EPROM Erasers
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A specialized device that uses high-intensity Ultraviolet (UV-C) light to erase data from Erasable Programmable Read-Only Memory (EPROM) chips.
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Product
Module Spectrum
nRF52832 Series
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Raytac nRF52832 module spectrum covers MDBT42Q, MDBT42 and MDBT42V series with both Chip Antenna and PCB Antenna option for selection.
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Product
Combination Board Tester
ATE QT2256-640 PXI
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Qmax Test Technologies Pvt. Ltd.
Most commercial ATEs does only functional test and do not carry out DC/AC parameter testing, which are very essential in increasing the fault coverage and for achieving near zero field returns. The testing challenges get worse when the boards are equipped with BS compatible components, DSP chips and CPUs or micro controller based boards. ATE QT2256-640 PXI system is designed as a combination board tester capable of testing highly complex and PCBs employing various techniques on a single platform. It can be easily upgraded to 640 digital channels and with programmable UUT power supplies, IEEE or PXI external instrumentation, Bus cycle signature system, ICE and integrated Boundary scan Test AC/DC parametric testing. The ATE is interfaced to an external host PC using a PCI express interface card allowing a maximum data transfer rate. Most commercial ATEs does only functional test and do not carry out DC/AC parameter testing, which are very essential in increasing the fault coverage and for achieving near zero field returns. The testing challenges get worse when the boards are equipped with BS compatible components, DSP chips and CPUs or microcontroller based boards.
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Product
Sealed Linear Encoders
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Sealed linear encoders feature optimal protection from dust, chips, and splash water. They are especially ideal for use in manually operated machine tools and also in numerically controlled machine tools.
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Product
UV Photodiodes
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Active area from 0.06 mm² to 36 mm² and quadrant photodiodes for position detections. Spectral response for broadband UV or filtered for UVA, UVB, UVC or UV-Index. Various entrance optics and housings options available (TO or SMD). Our own SiC photodiode chip production since 2009 also available with VUV sensitivity. PTB (German equivalent of NIST or NPL) measured high radiation hardness. 350°C high temperature stable photodiodes available. Photodiode application guide.
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Product
SparkFun Pulse Oximeter And Heart Rate Sensor
MAX30101 & MAX32664 (Qwiic)
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The SparkFun Pulse Oximeter and Heart Rate Sensor is an I2C based biometric sensor, utilizing two chips from Maxim Integrated: the MAX32664 Biometric Sensor Hub and the MAX30101 Pulse Oximetry and Heart Rate Module. While the latter does all the sensing, the former is an incredibly small and fast Cortex M4 processor that handles all of the algorithmic calculations, digital filtering, pressure/position compensation, advanced R-wave detection, and automatic gain control. We've provided a Qwiic connector to easily connect to the I2C data lines but you will also need to connect to two additional lines. This board is very small, measuring at 1in x 0.5in (25.4mm x 12.7mm), which means it will fit nicely on your finger without all the bulk.
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Product
3D AOI
Zenith2
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Zenith 2 AOI platform, which provides the AI-driven Auto Programming for rapid job programming. The Zenith 2 also combines Koh Young’s advanced vision algorithms with innovative high-resolution optics. The latest platform expands inspection capabilities, delivering best-in-class performance, functionality, and accessibility. Koh Young’s side-view solution allows Zenith 2 to quickly detect and analyze defects on a wide range of mounted components and chips.
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Product
25G APD Photodiodes
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Macom Technology Solutions Holdings Inc.
MACOM offers the highest sensitivity avalanche photodiodes (APD) on the market to satisfy 28G related applications. The chips are usable from 1250 to 1650 nm for bit rates up to 28 Gb/s and 28 GBd. Proprietary designs enable superior bandwidth, excellent temperature stability and high reliability to support market needs of PAM-4 and 400G Ethernet applications.
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Wafer Sorter and Inspection
SolarWIS Platform
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Eliminating the opportunity for problematic wafers to enter cell manufacturing lines greatly improves output and yield. ASM AE’s wafer sorter features 3D area inspection capability to inspect wafer thickness, total thickness variation (TTV), saw marks, as well as wafer bow and warpage. SolarWIS also includes modules that can inspect for stain, geometry, micro-cracks, edge chips, resistivity, P or N conductivity and lifetime.
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Product
6U cPCI 1/10/40 GbE Switch
ComEth4050e
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The ComEth 4050e is a cutting-edge 6U cPCI Layer 2/3 Ethernet switch for PICMG 2.16 & VITA 31.1 systems and is powered by the newest Marvell highly integrated system-on-chip (SoC) with programmable packet processors.
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Product
SDIO Wi-Fi Module
SX-SDMAC
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This Wi-Fi SDIO module is a low-power, single-stream solution with 802.11a/b/g/n/ac support based on the QCA9377 System-on-Chip from Qualcomm Atheros. This module supports Wave 2 MU-MIMO (Client), which increases the overall WLAN system performance by 3X compared to 11n. The module’s small form factor, rich features, and low power make it perfect for portable devices.
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Product
Reflection Meter
RC-088
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This instrument is a special equipment for measuring the reflectivity of rearview mirror (or similar product) of motor vehicle. The product composes intelligent measuring instruments, optical integrating sphere, parallel lamp, standard light source, constant current source etc. It is easy to operate，it can measure the reflectivity quickly and accurately. On instrument structure, it adopts standardized modulation design. It takes latest single chip as its digital central processing element. After the measuring signal is converted by modulus, CPU will do some computation and compensation. The instrument can display the reflectivity of device which is measured in rear time. It operates simply and quickly, the indication is direct and accurate. It’s good for quality examination &control in the production scene as well as laboratories. This product has the convenience &quick demarcation way, can meet requirement of different occasion. It is applicable for measuring light reflection on mirror and not mirror parts.
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Product
Rectifier Diodes
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Chip Diodes from Bourns has emerged that offers the capability to provide a silicon diode with minimal packaging overhead. The small signal 0603, 1005 and 1206 Chip Diodes are lead free with Cu/Ni/Au plated terminations while the other packages (SMA, SMB, SMC, 1408, 1607, 2010, 2419, 8L NSOIC, 16L NSOIC, SOT23, SOT23-6, 16L WSOIC) use 100% Tin terminations. All Bourns® diodes are compatible with lead free manufacturing processes, conforming to many industry and government regulations on lead free components.
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Product
IF/RF Receivers
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IF and RF Receivers are designed for communications infrastructure applications. Wide input bandwidth and high sample rates allow digitizing close to the antenna. Various receiver architectures, such as zero-IF, IF sampling to direct RF receivers, are supported and available on chip post digital signal processing can be used to offset demands in the FPGA or digital ASIC and ease analog filtering.
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Product
8 Channel DAC FMC Module
DACNF08 – HPC
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Sundance Multiprocessor Technology Ltd.
The RFM-DACNF08 is a eight channel Digital to Analog converter FMC which complies with VITA 57.1-2010.It uses 4x AD9122 DAC chips, with a sampling speed of up to 1.2GHz
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Module Spectrum
nRF52810 Series
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Nordic nRF52810 solutioin features an Arm Cortex-M4 processor with 192 KB Flash and 24 KB RAM with 32 GPIO available. Supports SPI, UART, I2C, PWM interfaces with both Chip Antenna and PCB Antenna option for selection.
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Ethernet
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Arasan Chip Systems has a complete portfolio of Fast (10/100) Mbps and Gigabit (10/100/1000) Mbps and now 10Gigabit Ethernet IP. Our high quality IP has completed the rigorous interoperability tests at UNH-IOL laboratories and has been widely licensed. Arasan also provides a portable Ethernet driver.
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Product
OpenVPX SBC
SBC347D 3U
OpenVPX
The VPXcel3 SBC347D rugged single board computer is based on the highly integrated Intel® Xeon® D processor platform. The multiple core Xeon D brings the high performance of Intel Xeon processors into a dense, low power system-on-chip solution, ideal for High Performance Embedded Computing (HPEC) applications.
