Chip
Passive or active components test and their interconnected circuitry in silicon or germanium.
See Also: Integrated Circuit, IC
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Production Programmers
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eltek offers both traditional gang programmers and modern stand-alone models for production cluster setups. Traditional gang programmers come with four independent sockets that allow chips to be programmed concurrently.Recent trends have shifted from gang programming to cluster setups. Cluster setups consist of multiple stand-alone programmers operated by one operator for enhanced efficiency and cost-savings during production.
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Product
Metrology & Inspection Systems
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Our optical and e-beam wafer metrology and inspection products quickly and accurately measure pattern quality before and during high-volume chip manufacturing.
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16GB DDR5-5600 2GX8 1.1V SAM
AQD-D5V16GN56-SB
Memory Module
SAM Original Chip, PCB: 30μ gold finger, Anti-sulfuration, On-die ECC for Enhanced RAS, Operating Temperature: 0°C ~ 85°C.
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Product
Thick Film Chip Resistors
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Panasonic Industrial Devices Sales Company of America
An AEC-Q200 Compliant SeriesPanasonic components specified as AEC-Q200 Compliant are consistently designed into automotive systems. However, today’s Design Engineers are specifying AEC-Q200 components to meet the high-quality standards of devices beyond automotive applications.
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3.4 MP Custom Lens Low Light Camera Module
e-CAM30_CUMI0330_MOD
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e-CAM30_CUMI0330_MOD is a high performance, small form factor, 3.4 MP pluggable Low Light Camera Module with S-Mount lens holder. It is based on AR0330 - a 3.4MP CMOS Image sensor from ON Semiconductor®. It has a dedicated, high-performance Image Signal Processor chip (ISP) on-board that performs the entire Auto functions (Auto White Balance, Auto Exposure control) in addition to complete image signal processing pipeline that provides best-in-class images, videos and the optional MJPEG compressions.
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Product
IGBT Drive
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IGBT gate drive photocouplers (optocouplers) are optically coupled isolators containing a GaAlAs LED on the input side and a photo diode, signal processing circuit and power output transistor on the output side in a single chip. This coupler is designed specifically to provide high common mode transient immunity (CMR) and a high output current, and has an active miller clamp and high switching speed, making it ideal for driving IGBTs and MOS FETs.
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Product
Thermal Conductivity Gas Analyzer
CI2000-RQD
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Shanghai ChangAi Electronic Science & Technology Co.,Ltd
Determining gas concentrations by measuring the thermal conductivity of the gas, CI2000-RQD analyzer uses advanced thermal conductivity sensor with single chip technology. It adopts platinum thread as sense organ to make up Imbalance Bridge, which output signal has a relationship with tested gas volume. And the single chip will magnify, sieve wavelength, modify linearly and criteria the signal by electric procedure.
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Product
Limiter Diodes
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The SemiGen SLP7100 series of Limiter Diodes are processed with a high-resistivity epi that have thin intrinsic layers. These devices are typically in the 2 to 20 micron range of epi thickness and can be gold doped to achieve specific performance goals. These diodes are used in passive or active limiter designs in the 100 MHz to 30 GHz frequency ranges. They are ideal for use in high-power applications and can be supplied in chip form or in your choice of packages below.
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Product
Chip Resistor Networks/Arrays
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Panasonic Industrial Devices Sales Company of America
Panasonic’s Chip Resistor Arrays are offered in cases from 0201 to 0805. The smaller 0201 case sizes are available with flat terminations and all other case sizes are offered with either convex or concave terminations. The EXB Series Resistor Arrays are available in 2, 4, or 8 Resistors per package. These Resistor Arrays allow for an improvement of the placement efficiency. Compliance Standards include: IEC 60115-9, JIS C 5201-9, EIAJ RC-2129, AEC-Q200 and RoHS.Panasonic’s Resistor Networks are available in 8 or 15 bussed Resistors and are recommended for all pull up/down circuits.
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Product
Industrial Flash & Memory Solutions DDR3 Memory
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SQRAM offers DDR3 memory modules with Samsung or Hynix chips and DDR3L of low voltage 1.35v backward to 1.5V compatible with Intel and AMD platforms.
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COM Express Compact Size Type 6 Module with 6th Gen Intel® Core™ i7/i5/i3 and Celeron® 3955U Processors (formerly codename Sky Lake)
cExpress-SL
Computer on Module
The cExpress-SL is a COM Express® COM.0 R2.1 Type 6 Compact size module featuring the 64-bit 6th Generation Intel® Core™ i7/i5/i3 and Intel® Celeron® Ultra-Low TDP processors (formerly Sky Lake-U") with CPU, memory controller, graphics processor and I/O hub on a single chip. Leveraging the benefits provided by the 6th generation Intel® Core™ and Celeron® System-on-Chip, the cExpress-SL is specifically designed for customers who need optimum processing and graphics performance with suitable power consumption using Intel® Configurable TDP in a long product life solution.
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Product
Electromagnetic Field Simulator
EMPIRE XPU
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EMPIRE XPU is an outstanding 3D time-domain EM modelling tool for antennas, microwave circuits, EM chip design and more. It is based on the powerful Finite Difference Time Domain (FDTD) method, which has become the industry standard for RF and microwave component and antenna design.
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Integrated Potentiostat and Multiplexer
EmStatMUX8
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Based upon the EmStat range, there are two types of multiplexers to suit most types of sensor array work. The MUX8 is the most flexible offering the ability to connect arrays made of up to eight working electrodes in two or three electrode cell types and chips sharing a reference electrode and/or counter electrode.
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Product
Data Analytics
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KLA’s data analytics systems centralize and analyze the data produced by inspection, metrology and process systems. Using advanced data analysis, modeling and visualization capabilities, our comprehensive suite of data analytics products support applications such as run-time process control, defect excursion identification, wafer and reticle dispositioning, scanner and process corrections, and defect classification. By providing chip and wafer manufacturers with relevant root cause information, our data management and analysis systems accelerate yield learning rates and reduce production risk.
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IEEE-488 GPIB Device Interface IC (Chip) for the PCI-Bus
GPIB-72120
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The i72120 GPIB-Chip is the ideal solution to implement a IEEE488.2 GPIB interface for next generation PCI based instruments. The GPIB-ASIC is designed to meet all of the functional requirements for talker and listener (TL) devices as specified by the IEEE Standards 488.1-1987 and 488.2-1987. Connected between the PCI bus and the GPIB, this GPIB-IC provides high-level management of the GPIB to unburden the processor and to simplify both hardware and software design. The i72120 is fully compatible with the PCI specification and requires only the addition of bus driver/receiver components to implement a talker/listener GPIB interface.
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Product
Fourier Transform Optical Spectrum Analyzer, 600 - 1700 nm
OSA202C
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Thorlabs' Optical Spectrum Analyzers (OSAs) perform highly accurate spectral measurements. Compatible with fiber-coupled and free-space light sources, these compact benchtop instruments suit a wide variety of applications, such as analyzing the spectrum of a telecom signal, resolving the Fabry-Perot modes of a gain chip, and identifying gas absorption lines. Many commonly available OSAs use grating-based monochromators, which have slow acquisition times due to the need to mechanically scan the grating and average out noise at each wavelength. Thorlabs' OSAs acquire the spectrum via a Fourier transform using a scanning Michelson interferometer in a push/pull configuration. This approach dramatically improves the acquisition time, enables a high-precision wavelength meter mode with 7 significant figures and ±1 part-per-million accuracy, and allows the included software to provide robust statistical analysis of the acquired spectra, as explained in the Design tab.
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Product
COM Express Basic Size Type 7 Module with Up to 16 Cores Intel Xeon D and Pentium D SoC (formerly codename: Broadwell-DE)
Express-BD7
Computer on Module
The Express-BD7 is a COM Express COM.0 R3.0 Basic Size Type 7 module supporting the 64-bit Intel Xeon processor D and Intel Pentium D processor system-on-chip (SoC) (formerly "Broadwell-DE"). The Express-BD7 is specifically designed for customers who need excellent computing performance with balanced power consumption and multiple 10G Ethernet connectivity in a long product life solution.
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USB-8452, 3.3 MHz I2C, 50 MHz SPI I2C/SPI Interface Device
781964-03
Interface Module
The NI USB‑8452 is a master interface for connecting to and communicating with inter-integrated circuit (I2C) and serial peripheral interface (SPI) devices. With plug‑and‑play USB connectivity, the USB‑8452 is a bus-powered, portable solution to communicate with consumer electronics and integrated circuits. It also includes eight general-purpose digital I/O lines for a variety of applications, such as configuring the address of I2C devices, toggling LEDs, or strobing convert and data ready lines common to analog converter chips. You can physically place the USB‑8452 more closely than PCI interfaces to I2C/SPI devices, which reduces I2C bus length and minimizes noise problems. Additionally, the interface provides +5 V and GND to power circuits with no external power supply.
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Product
Peak Track Instrument
90323
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The model 90323 Peak Track Instrument is a general-purpose sensor readout device designed to complement our AutoID line of load cells and torque sensors. AutoID is a term that indicates that the calibration information for a sensor is stored on a chip inside the sensor’s connector. AutoID allows true “plug and play” operation without manual calibration procedures of any kind. The unit is also equipped with a 2-line alpha-numeric display and single button operation for simplicity.
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Product
Multilayer PCB
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ultilayer circuit boards were essential in the advancement of modern computing. The multilayer PCB basic construction and fabrication are similar to micro chip fabrication on a macro size. The range of material combinations is extensive from basic epoxy glass to exotic ceramic fills. Multilayer can be built on ceramic, copper, and aluminum. Blind and buried vias are commonly produced, along with pad on via technology.
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Product
3μm Silicon Interdigitated Electrode (IDE)
EAP1
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Silicon IDE chip with a 3μm gap for MEMS, biosensing, gas sensing, and electrochemical applications.
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Product
Model MCPC: Lab Moisture Analyzer
AM-MCPC-RS
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PC-Based lab/production moisture analyzer connects through RS-232 Serial Port. Designed for nuts, granules, powders, pellets, chips, or flakes. Includes two sample cups, MCPC-RS test chamber, windows PC-based software, and more. See product link for complete features and minimum computer requirements.
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SMARC® Short Size Module with Intel Atom® E3900 Series, Pentium™ N4200 or Celeron™ N3350 Processor (codename: Apollo Lake)
LEC-AL
Computer on Module
The LEC-AL Computer-On-Module (COM) combines the SMARC® 2.0 standard with the latest Intel Atom® E-Series and Pentium® and Celeron® N-series System-on-Chips (SoCs), providing ideal solutions for low power consumption and high performance requirements. The module provides the high integration, high performance, low power, and ruggedness favored by Internet- of-Things (IoT) applications such as retail transactional clients, digital signage, and in-vehicle infotainment systems. The LEC-AL module utilizes the latest Intel E-series and N-series SoCs, which are based on the Intel 64 Architecture, the new HD Graphics 500/505 engine, and a faster, 4-vector image processing unit. The SoCs are manufactured on Intel's industry-leading, tri-gate 14nm process, improving system performance by supporting more than 4 GB of both virtual and physical memory.
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Product
Receiver Conformance Test Application for IEEE 802.3bm
M8091BMCA
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IEEE 802.3bm Receiver Test Application for 25GAUI-1 Chip-to-Module, Chip-to-Chip, Cable and Backplane.
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Product
Cost-Effective ATE System
PRO RACK ATE
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Qmax Test Technologies Pvt. Ltd.
Pro-Rack is a cost effective ATE System, which comes with Modular Structure provision option to improvise and enhance much instrumentation based on the user’s requirements. Basically it is designed to cater to the needs of PCB test and repair depots, keeping in mind the changing PCB technology and the challenges in testing them off-line. It can provide complete PCB test and diagnostic functions for any kind of PCB including the latest very high density complex PCBs with high pin count PQFP, FPGA VLSI chips. AC /DC parametric tests enables testing of the DC parametric of device pins on the edge connector for input bias current, Fan out capacity ,Tri-state leakage currents, AC parametric measurements such as Input / Output Propagation delay Rise time / Fall time to further enhance fault coverage. Pro-Rack is designed with VPC Mass Interconnect adapter with 16 bit fixture ID interface to the UUT through simple clips and probes or through card edge or through a bed of nail test fixture.
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Product
Cloud And Networking
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From laser chips (EMLs, DMLs, and VCSELs) and pluggable coherent transceivers to pump lasers and TrueFlex® colorless/directionless/contentionless ROADMs, Lumentum’s comprehensive, vertically integrated portfolio lowers costs and speeds time-to-market. We optimize our components for best-in-class performance, creating flexible and scalable platforms that address ever-changing market conditions and product migrations. To ensure field reliability, Lumentum uses only the best materials and processes including stringent, proprietary burn-in processes during laser manufacturing.
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Precision Thick Film Chip Resistors
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Panasonic Industrial Devices Sales Company of America
An AEC-Q200 Compliant SeriesPanasonic components specified as AEC-Q200 Compliant are consistently designed into automotive systems. However, today’s Design Engineers are specifying AEC-Q200 components to meet the high-quality standards of devices beyond automotive applications.
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Product
PCI Evaluation Board
BCM91125E
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The BCM91125E is a full-length PCI evaluation board with the SiByte® BCM1125H MIPS processor System on a Chip (SoC). The board is designed for software development and developing PCI applications, which require high-performance processors. The BCM91125E can be plugged into a PCI slot in any PC, workstation or server, or can be used as a stand-alone device.
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Attenuators
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The 01311 attenuator chip series is designed to achieve precision and tight flatness with an attenuation accuracy of ± 0.2 dB on our 1-10 dB pads and ± 0.3 dB on our 11-20 dB pads. SemiGen tests 100% of all attenuator chips prior to shipment to verify that they meet specifications.
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Development Kit
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The VP430 is 3U VPX RF processing system featuring the transformational Xilinx® Zynq® Ultrascale+™ RF system-on-chip technology (RFSoC). The ZU27DR device used on the VP430 includes eight integrated analog-to-digital converters at 4GSPS, eight digital-to-analog converters at 6.4 GSPS, a user-programmable FPGA fabric, and multi-core Zynq ARM® processing subsystem.
