Chip
Passive or active components test and their interconnected circuitry in silicon or germanium.
See Also: Integrated Circuit, IC
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Product
OEM CCD Camera
Syncerity BI-NIR Camera
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The TE-cooled back illuminated 2048 x 70 CCD Camera combines affordability, performance and versatility for OEM applications. With peak QE of 84% @ 700nm and 20% at 1050nm, Syncerity BI-NIR offers a relatively broad response and addresses multiple applications. In the near-NIR, this detector is a much lower cost alternative to a deep depleted CCD, with no etaloning. Syncerity’s flexible design allows our OEM-dedicated team to quickly adapt the camera for industrial requirements, ranging from alternate CCD chips to electronics
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Product
Wireless Test Solutions
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Adivic/Chroma Group has been in the development of RF & Wireless test solutions for more than a decade. Take RF Recorder as an example, it has been adapted by all major Japanese & Korean automotive brand names such as Mitsubishi, Honda, Hyundai,.. ,most of the global IC design houses with DTV chips, and also military entities in NATO. With the same customer-proved Software Defined Radio architecture, we have introduced Wi-Fi, Bluetooth tester since 2014. It will soon cover other current/future wireless standards such as 4G/LTE, 802.11ax, 802.11ah, etc.
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Product
Arduino CAN Shield
IFB-10003-ANP
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CAN (Controller Area Network) communication has become ubiquitous in industry. It is used in automotive applications (part of OBD and many other datalinks), on-highway trucks (J1939), industrial machinery and instrumentation, and equipment applications (factory automation). This shield is designed to provide a CAN 2.0 front-end interface for 5V Arduino modules (Uno, Mega, etc). The module uses SPI to communicate to the Arduino, and requires an aditional chip select pin. An optional interrupt line to the MCP2515 and two LEDS are also provided. The chip select and interupt lines are selected via zero ohm resistors and have several configuration options for flexibility stacking additional shields. A set of stackable headers is included with this board, not installed. An optional on-board voltage regulator may be used to supply 7.5V to the Arduino's 'Vin' pin (which is regulated to 5V by the Arduino's on-board LDO). The CAN shield regulator supports a wide input range of 9V to 32V. This makes it possible to cleanly build a stand-alone CAN node (remote sensor) without the need for a separate Arduino power supply!
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Product
IGBT Drive
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IGBT gate drive photocouplers (optocouplers) are optically coupled isolators containing a GaAlAs LED on the input side and a photo diode, signal processing circuit and power output transistor on the output side in a single chip. This coupler is designed specifically to provide high common mode transient immunity (CMR) and a high output current, and has an active miller clamp and high switching speed, making it ideal for driving IGBTs and MOS FETs.
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Product
SMARC
ROM-5420 B1
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ROM-5420 SMARC v1.1 Module integrates ARM Cortex-A9 NXP i.MX6 series ultra low power SoC and I/O solution chips to be OS support ready. NXP i.MX6 supports 2D, 3D graphics acceleration, full HD 1080P video decoding and an HD 1080p video encoding hardware engine.
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Product
IPM Drive
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IPM drive photocouplers (optocouplers) are optically coupled isolators containing a GaAlAs LED on the input side and a photo diode and signal processing circuit on the output side in a single chip. This coupler is a high common mode transient immunity (CMR), high CTR type whose pulse width changes according to the operating temperature, making it ideal for driving IPMs (intelligent power modules).
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Product
Video Signal Generator
MSPG-3233RT
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MSPG-3233RT is basically supporting the Teletext and Closed Caption as multi broadcast for the D-TV(NTSC, PAL), as well as V-Chip(Violence Chip) function to block the violence and sex etc. bad program to protect a person under age through the regulation grade.
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Product
PCIe 4.0 RAID Controller
MegaRAID 9560-16i
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The MegaRAID 9500 series is the industry’s first PCIe Gen 4.0 RAID adapter family, offering PCIe Gen 4.0 host and storage interfaces. The MegaRAID 9560-16i adapter, based on the SAS3916 high-port count PCIe 4.0 x8 RAID-on-Chip (RoC), delivers twice the performance of previous generations.
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Product
Interface RS-232
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The RS-232 specification allows for reliable data transmission from one transmitter to one receiver at data rates of up to 20 kbps over relatively short distances (up to 50 feet). On more recent RS-232 transceiver chips, data rates of up to 1 Mbps are achievable over shorter distances (up to 5 feet). The most common applications for RS-232 transceivers are computers and peripherals, mobile phone data cables, and diagnostic data ports.
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Product
COM Express Compact Size Type 6 Module with 6th Gen Intel® Core™ i7/i5/i3 and Celeron® 3955U Processors (formerly codename Sky Lake)
cExpress-SL
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The cExpress-SL is a COM Express® COM.0 R2.1 Type 6 Compact size module featuring the 64-bit 6th Generation Intel® Core™ i7/i5/i3 and Intel® Celeron® Ultra-Low TDP processors (formerly Sky Lake-U") with CPU, memory controller, graphics processor and I/O hub on a single chip. Leveraging the benefits provided by the 6th generation Intel® Core™ and Celeron® System-on-Chip, the cExpress-SL is specifically designed for customers who need optimum processing and graphics performance with suitable power consumption using Intel® Configurable TDP in a long product life solution.
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Product
COM Express Mini Size Type 10 Module with Intel Atom® E3900 Series, Pentium®, and Celeron® SoC (formerly Apollo Lake)
nanoX-AL
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The nanoX-AL is a COM Express® COM.0 R3.0 Type 10 module supporting Intel Atom® processor E3900 series system-on-chip (SoC). The nanoX-AL is specifically designed for customers who need optmized processing and graphics performance with low power consumption in a long product life solution.
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Product
29MP Ultra-High Resolution Forensic Camera
SceneScope RUVIS 29MP System
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The SceneScope RUVIS 29MP is an Ultra High Definition camera based on a 29MP sensor with 6644 x 4452 pixel resolution, and a full-frame chip. It includes capture software with 3 user-selectable modes: Fast Viewing for placement, Focus on the evidence, and High Detail for Capture at High Resolution and High Dynamic Range.
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Product
Inductor Products
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Macom Technology Solutions Holdings Inc.
They provide uniformity, durability and repeatability in circuit fabrication. The coils are polyimide coated to protect from ambient contaminants, and to eliminate the need for conformal coating. Quartz substrates are rugged and reduce dielectric losses. Chips may be bonded using either conductive or non conductive epoxies, and wire bonded with gold wire or ribbon by thermocompression bonding.
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Product
Embedded Boards
UltraZed Family
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Embedded boards are boards with processors, multiple integrated circuits, interfaces and other essential components assembled on it to serve a dedicated function. Embedded boards comprise multiple technologies, including processors, core logic, networking, connectivity, and multimedia components to provide functionality and performance for embedded system design applications. Embedded boards and solutions are normally employed to ensure a faster time to market for the developer. Applications of embedded systems vary from tiny portable devices, to large commercial and industrial installations, and even largely complex systems like medical or military or aviation purposes. Embedded boards can have single MCU chip or multiple MCUs depending on the complexity of application.
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Product
Automotive System-on-Chip (SoC)
R-Car
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"R-Car" is the nickname for Renesas' system-on-chip (SoC) family for car information systems designed for the next-generation of automotive computing for the age of autonomous vehicles.
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Product
32 Channel Multihit TDC (25 ps)
V1290A-2eSST
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The V1290A-2eSST is a 32 channel Multihit TDC, housed in a 1-unit wide VME 6U module. The unit features High Performance Time to Digital Converter chips developed by CERN. LSB is 25 ps (21 bit resolution, 52 µs FSR). The module accepts both ECL and LVDS inputs.
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Product
Wafer Sorter and Inspection
SolarWIS Platform
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Eliminating the opportunity for problematic wafers to enter cell manufacturing lines greatly improves output and yield. ASM AE’s wafer sorter features 3D area inspection capability to inspect wafer thickness, total thickness variation (TTV), saw marks, as well as wafer bow and warpage. SolarWIS also includes modules that can inspect for stain, geometry, micro-cracks, edge chips, resistivity, P or N conductivity and lifetime.
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Product
N2 O2 Analyzer
GNL-IN881 Series
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Shanghai ChangAi Electronic Science & Technology Co.,Ltd
GNL-IN881 series analyzer is the online intelligent measurement instrument, which adopting advanced ion current oxygen sensor with single chip technology. N2%=100%-O2%.It has been widely used in the fields of nitrogen separation from air, fertilizer, petrochemicals and biological fermentation. - See more at: http://en.ci-ele.com/8aedb8bf-ef48-4f8c-127a-797c939a6181/78ea4933-855f-c270-f389-d6ac3b6fe432.shtml#sthash.Dk7zX5DN.dpuf
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Product
Molded Interconnect Subtrate
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A substrate interposes between an IC chip and a motherboard to enable the IC chip to communicate with the motherboard effectively. Typically, the IC chip is attached onto the substrate and assembled into an IC package before connecting to the motherboard. It is an essential part of the IC package and is responsible for a successful packaging process. Also, it plays an important role in making the IC chip to become a real product and a real solution for end customers. In the past years, semiconductor technologies were highly driven by PC applications which follow Moore’s law in technology migration. In recent years, the emergence of mobile applications increasingly, become the main driver in the semiconductor industry. These mobile applications requires a new kind of substrate that have ability for making IC packages with smaller form factor, thin profile, better thermal, mechanical and electrical performance.
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Product
SparkFun Cryptographic Co-Processor Breakout
ATECC508A (Qwiic)
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The SparkFun ATECC508A Cryptographic Co-Processor Breakout allows you to easily add strong authentication security to your IoT node, edge device, or embedded system. It includes two Qwiic ports for plug and play functionality. Utilizing our handy Qwiic system, no soldering is required to connect it to the rest of your system. However, we still have broken out 0.1"-spaced pins in case you prefer to use a breadboard. The ATECC508A chip is capable of many cryptographic processes, including, but not limited to:
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Product
Electronic Ballast Production Line Tester
UI2000-OK
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• Eight windows for displaying input characteristics, output characteristics, convenient for comparison and analysis. • Frequency response for testing input current up to 1 MHz, suitable for precise testing of various kind of electronic ballast. • High speed testing, finish testing input and output characteristics within 1 minute. • Portable with built-in chip micro-processor, particular suitable for development and spot production. • Parameters, waves and curves of input, output and startup can be printed. • Communicating with PC, special software provided and both Chinese version and English version available. Run in WINDOWS3.2, WINDOW95 or WINDOWS98, nice interface between people and computer, easy to operate.
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Product
3U OpenVPX High Density Multifunction I/O Board
68CB6
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The 68CB6 is a Configurable Open Systems Architecture™ (COSA®) 3U OpenVPX™ board that is preconfigured with 10 different “inboard” I/O, measurement and communication functions. This Combination-function Board (CB) provides a full suite of some of the most common & useful function interfaces supporting many different applications. The 68CB6 features a wide but dedicated selection of functions: Standard Functionality Discrete I/O (DT1); Successive Approximation Register (SAR) ±100 V Analog-to-Digital (AD); Isolated High Voltage Analog-to-Digital (ADF); ±10 V Digital-to-Analog (DA); Thermocouple (TC1) or Resistance Temperature Detector (RT1); Full-bridge Strain Gauge (SG1); Transmission/gear box Chip Detection and Fuzz Burn (CD1); LVDT-to-Digital linear (LD6) displacement (position) measurement, AC Reference Source output (AC2); CAN bus communication (CB8). The 68CB6 offers unparalleled programming flexibility, a wide range of operating characteristics, and a unique design that eliminates the need for external intermediate circuit considerations such as pull-up resistors or mechanical configuration jumpers. Inboard functions are software controlled and memory addressed, accessed in similar COSA® modular fashion to maintain seamless common NAI Software Support Kit & API/library structures.
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Product
8G DDR4-3200 1GbX8 1.2V SAM -40~85C
AQD-D4U8GN32-SEW
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DDR4 3200Mhz Unbuffered DIMM, 30u" Gold Plating Thickness, Anti-sulfurization resistance. 1.2V power consumption, Samsung original chip, 100% tested for stability, compatibility and performance.
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Product
Multi Socket Programmers
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Gang programmers are based around the universal programmers but offer multiple sockets allowing 4 or more devices to be programmed at the same time giving a greater throughput where a large number of devices require programming. Mass production environments churning out tens of thousands of chips a week are where these programmers are typically found.
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Product
3.4 MP Custom Lens Low Light Camera Module
e-CAM30_CUMI0330_MOD
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e-CAM30_CUMI0330_MOD is a high performance, small form factor, 3.4 MP pluggable Low Light Camera Module with S-Mount lens holder. It is based on AR0330 - a 3.4MP CMOS Image sensor from ON Semiconductor®. It has a dedicated, high-performance Image Signal Processor chip (ISP) on-board that performs the entire Auto functions (Auto White Balance, Auto Exposure control) in addition to complete image signal processing pipeline that provides best-in-class images, videos and the optional MJPEG compressions.
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Product
Chip Scale TVS Arrays
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ProTek's patented* Flip Chip TVS Arrays are designed for small circuit board applications with limited size and space availability. To reduce installation costs, the Flip Chip can be mounted directly onto the printed circuit board; similar to chip resistors and capacitors. These devices are ideal for use in portable electronics such as Cellular Phones, Cellular Phone Accessories, Personal Digital Assistants (PDAs), Laptops and Pagers.
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Product
IC Test Clips
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Low-profile fine-pitch chips, desnely populated boards, or vertical boards, Pomona test clips connect you with confidence.
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Product
Enhance Transactional Universal Verification Methodology (UVM) testbenches
TrekUVM
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TrekUVM automatically generates self-verifying test cases that run in existing transactional testbenches, including those compliant with the Universal Verification Methodology (UVM) standard. This verifies your chips more quickly and more thoroughly than using UVM alone to generate transactions. TrekUVM's generated test cases target all aspects of full-chip verification and work in a variety of different environments.
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Product
High Speed Spectroscopy Camera
SynapsePlus CCD
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Superfast electronics (up to thousands of spectra per second). Very low read noise. Best linearity in its class. Different chip types to suit every spectroscopy need. Open Electrode (OE) 1024 x 256 pixels, Front-illuminated UV enhanced (FIUV) - 2048 x 512 pixels, Front-illuminated visible (FIVS) - 2048 x 512 pixels, Back-illuminated UV enhanced (BIUV) - 1024 x 256 and 2048 x 512 pixels, Back-illuminated visible (BIVS) - 1024 x 256 and 2048 x 512 pixels, Back-illuminated deep depletion (BIDD) – 1024 x 256 pixels.
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Product
2000-6000W AC power source
CX-P2KW
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Shenzhen Chuangxin Instruments Co., Ltd.
The AC power source is made by adopting microcomputer processing chip and high power device. It provides a stable pure sine wave and has voltage, over current, over temperature, overload protection. It can output 0-300V adjustable voltage, and 45-70Hz adjustable frequency as well as fixed frequency as 50 Hz or 60 Hz, 100 Hz and 200 Hz and 400 Hz. This AC power source can simulate power grid of different countries, provide a stable voltage, frequency, waveform which can be used to test and age the exprot products and provide kinds of precision tests for laboratory, measuring room, etc.





























