Chip
Passive or active components test and their interconnected circuitry in silicon or germanium.
See Also: Integrated Circuit, IC
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Product
In-Process Wafer Inspection System
7945
System
Chroma 7945 wafer chip inspection system is an automated inspection system for pre and post diced patterned wafers. Change kits enable switching between various applications by allowing different carriers including metal frame or grip ring.
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Product
Universal Programmer Superpro 6100N
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Until now,Support 401 IC manufacturer, 103004 pcs devices and keeps growing.Features:Supports 87454 types of devices from 305 IC manufacturers (by 3/15/2013) and keeps growing.Supports EPROM、Paged EPROM、Parallel and Serial EEPROM、FPGA、PROM、FLASH(NOR & NAND)、BPROM、NVRAM、SPLD、CPLD、EPLD、Firmware HUB、Microcontroller、MCU；Supports devices with Vcc as low as 1.2V. Socket Adaptors available for DIP、SDIP、PLCC、JLCC、PGA、LGA、SOIC、SOJ、SOT、QFP、TQFP、PQFP、VQFP、MQFP、LQFP、TSOP、SOP、TSOPII、PSOP、SSOP、TSSOP、SON、EBGA、FBGA、FTBGA、VFBGA、μBGA、CSP、SCSP、QFN、HVQFN etc.High programming speed.Built with 144 universal pin-drivers. Universal adaptors are available for varies packages up to 144 pins. Quick new device support. Popular NAND FLASH Platform supported including Samsung (XSR1.0/1.6), QualComm, HYNIX（HIFFS）, MTK(Solution V1.1), ICERA (v1.0/2.0), ST （7162、7141等）, AMLOGIC(IF2/0), REALTEK, PICOCHIP, DataLight ( Flash FX Pro), Marvell(310/303/920/935…), BroadCom, ZTE, Intel (CE4100)，UBI, LEADCORE(L1809OG), MSATR etc. Customer-specific NAND solution available.PC hosted mode and stand-alone dual modes. Under PC hosted mode the programmer is controlled by a PC via USB2.0 (high speed) to program a chip. Under stand-alone mode the programmer is controlled via a 6-KEY keypad and a 20 character by 4 line LCD display. A CF card is used to store the project files.User can operate multiple units to construct a concurrent multiprogramming system thank for the stand-alone mode. IC manufacturer approved programming algorithms are used for high reliability.Testing functions for logic devices.Advanced and powerful software functions.Production mode starts chip operation at the moment the chip is inserted in the socket properly.Project function simplifies processes such as device selection, file loading, device configuration setting, program option, and batch file setting into one touch step.Password can be set for project files and production volume controlBatch command combines device operations like program, verify, security into a single command at any sequence.Dynamic buffer makes it possible that each chip is programmed with different data file. Applications including serial number, MAC address etc.Log file is useful for quality tracking.Many safety mechanisms are built including self-diagnosis, wrong chip placement detection, poor-pin-contacting detection, ID checking, over-current and over-voltage protection etc.Windows XP/Vista/Win7/ Win8/Win10 compatibility.
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Product
LED Tester For Chip And Wafer
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Electrical Testing: Forward：VF,DVF,VFDReverse：VZ,IROptical Testing: can test LOP in cd/mcd/W/mW/lm... from different optical componentsWavelength λp,λd,λc,hw,purity,(x,y),CCT,CRIFour-wire measurement and contact resistance in case of deviation.Auto polarity identification and preheat function.Compatible mechanical interface.Optional ESD static test system or polycrystalline test system
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Product
Copper Pillar Bump
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Like in conventional fabrication, integrated circuits are created on the wafer but near the end of the manufacturing process, the attachment pads are metalized on the surface of the chips to make them more receptive to solder. Then solder dots are deposited on each of the pads, and chips are cut, flipped, and positioned so that the solder balls are facing the connectors on the external circuitry.
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Product
Temperature Forcing System
ETF-SERIES
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Precise Temperature Accuracies with Reliable Test Results Temperature Limits: -40/-60 °C to 30 °C Temperature Accuracies: ±2-3°C Temperature Rate of Change: 20-25 deg /min (Non-linear) Maintenance Free Access to The System Self-Sufficient System Compact with small footprints suitable for any space constraint laboratories Low decibel system Suitable for testing electronic chips / devices Environmentally friendly refrigerants Efficient heating Microprocessor based single set point PID temperature controller with data logging Flexible hose up to 2.5-3.0m Interchangeable heads according to chip size. Inbuilt electrical control panel with switchgear system
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Product
SC6-TANGO cPCI® Serial Intel® Atom™ E3900 Series SBC
SC6-TANGO
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The SC6-TANGO is a low power CompactPCI® Serial CPU board, based on an Intel® Atom™ E39xx-series System-on-Chip processor (Apollo Lake APL-I).
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Product
Flexible Pick & Place Machine W/ 64-feeder Capacity
MC400
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The MC400 Pick and Place machine places an enormous range of components, quickly and accurately, from 0201s through 100 x 150 mm SMDs, including BGAs, MBGAs, CSPs, µBGAs, MLFs, flip chips, odd form components and ultra-fine-pitch parts down to 15 mil. The system is easy to program and operate and comes standard with universal CAD conversion and teach-in capability.
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Product
16GB DDR5-5600 2GX8 1.1V SAM
AQD-D5V16GN56-SB
Memory Module
SAM Original Chip, PCB: 30μ gold finger, Anti-sulfuration, On-die ECC for Enhanced RAS, Operating Temperature: 0°C ~ 85°C.
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Product
Microcontrollers (MCUs)
8-bit
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An innovative 8-bit chip design provides a fully-integrated experience. Silicon Labs' 8-bit MCUs are ideal for IoT applications and beyond, delivering the industry's fastest speeds and lowest power.
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Product
Isolated LVDS
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Isolated LVDS (low voltage differential signaling) devices couple differential signals applied to the LVDS receiver inputs across the isolation barrier to the outputs on the other side and re-transmits the bit stream or clock as LVDS. Analog Devices' drop-in LVDS isolators offer designers robust, high speed differential signaling for point-to-point and multidrop applications. Extending iCoupler® chip scale transformer technology for ultrahigh speed data encoding, these LVDS isolators support a a data rate of up to 2.5 Gigabits per channel for a total bandwidth of 10 Gbps. In contrast to expensive fiber implementations, deserialized links over standard digital isolators or optocouplers, and design-intensive bespoke solutions using transformers or high voltage capacitors, ADI Gigabit Digital LVDS isolators offer the only integrated comprehensive, high performance isolation at 10 Gbps. High performance galvanic isolation for applications include analog front-end (AFE), processor to processor serial communication, or video and imaging data (such as HDMI isolators) as well as isolation between boards, or at a cable interface for LVDS or CML signal chains.
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Product
X-Ray Inspection System
MX1
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Manncorp’s new MX1 is a high-performance x-ray inspection system designed for real time imaging of multilayer PCBs and dense metal BGAs, μBGAs, and chip scale packages. Its high voltage (80kV), computer-controlled x-ray tube and 35 μm focal spot provide the power necessary for detection of a variety of defects including bridging, voids, and missing balls. The MX1’s standard camera features continuous zoom magnification from 4X to 50X and variable angle viewing up to 45°, and an upgrade to the x-ray tube can boost magnification to 225X.
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Product
8GB SO-DDR4-3200 1GbX8 1.2V ECC Samsung Chip
AQD-SD4U8GE32-SE
Memory Module
8GB, Speed 3200MHz, 30u" Gold Plating Thickness, Anti-sulfurization resistance, ECC.
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Product
8G SO-DDR3-1600 512X8 1.35V SAM -20~85℃
AQD-SD3L8GN16-SGH
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SAM Original Chip, Industrial Design for Improved Reliability, PCB: 30μ gold finger, Anti-sulfuration, Semi Wide-temp Support -20~85℃.
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Product
Development Kit
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The VP430 is 3U VPX RF processing system featuring the transformational Xilinx® Zynq® Ultrascale+™ RF system-on-chip technology (RFSoC). The ZU27DR device used on the VP430 includes eight integrated analog-to-digital converters at 4GSPS, eight digital-to-analog converters at 6.4 GSPS, a user-programmable FPGA fabric, and multi-core Zynq ARM® processing subsystem.
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Product
Humidity Sensors
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digital humidity sensor with integrated temperature sensor that provides excellent measurement accuracy at very low power. The device measures humidity based on a novel capacitive sensor. The humidity and temperature sensors are factory calibrated. The innovative WLCSP (Wafer Level Chip Scale Package) simplifies board design with the use of an ultra-compact package. The sensing element of the HDC1008 is placed on the bottom part of the device, which makes the HDC1008 more robust against dirt, dust, and other environmental contaminants. The HDC1008 is functional within the full 40C to +125C temperature range.
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Product
Radio Module with PCIe Card
SX-PCEAC2
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The SX-PCEAC2 is powered by Qualcomm Atheros radio chip, the QCA6174-5, which features 2x2 wave 2 MU-MIMO technology. It is a dual-band 802.11 a/b/g/n/ac module with Bluetooth support which is designed for devices that require wireless connectivity in a small form factor combined with high performance with throughputs reaching up to 867Mbps.
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Product
8G SO-DDR4-3200 1GbX8 1.2V SAM -40~85C
AQD-SD4U8GN32-SEW
Memory Module
DDR4 3200Mhz Unbuffered SO-DIMM, 30u" Gold Plating Thickness, Anti-sulfurization resistance. 1.2V power consumption, Samsung original chip, 100% tested for stability, compatibility and performance.
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Product
Chip Tester
TL2000
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ficonTEC’s series of testing machines is focused on automated electro-optical characterization ofsemiconductor chips. The ficonTEC TL2000 is a fully automated test and inspection system for unmountedlaser diode bars, single chips and chips on submounts.
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Product
Digital Color Camera for Microscopy
LC30
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The LC30 is a 3.1 megapixel digital color camera for microscopy that combines versatility with performance. The LC30 is the ideal entry-level microscope camera for quality bright-field imaging － suitable for material science applications. The Olympus LC30 color camera for microscopy combines versatility with performance. With up to 37 frames per second (fps), faithful color reproduction, full integration into Olympus imaging platforms, and an excellent cost-performance ratio, the LC30 is the ideal entry-level microscope camera for quality bright-field imaging － suitable for material science applications.. The sensitivity and frame rate of the 3.1-megapixel CMOS chip can be increased using various binning modes, resulting in easy observation and focusing. The LC30 camera can be quickly and easily mounted on all microscopes equipped with a standard C-mount adaptor, and requires only a single USB 2.0 cable for high-speed data transfer and power supply. Its complete integration into the OLYMPUS Stream imaging platforms helps ensure the seamless interaction of microscope, camera, and additional devices, delivering intuitive and efficient operation.
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Product
8G DDR5-4800 288Pin 1GX16 1.1V Unbuffered Samsung Chip
AQD-D5V8GN48-SC
Memory Module
Samsung Original Chip, Increased Banks and Burst Length. DDR5 4.8GT/s, Same-Bank Refresh, On-die ECC for Enhanced RAS.
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Product
Solar power Controller
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The controller computer chip on the battery voltage, solar battery voltage, discharge current, ambient temperature and other parameters of sampling, through a dedicated control chip basis, the realization of the battery discharge rate and temperature compensation for high accuracy control of the amendment, and intelligent and efficient use of pulse-width modulation (PWM) charging vague way to recharge batteries to ensure the batteries work in the best condition, significantly extended battery life.
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Product
Anti-Surge Chip Resistors (Double-Sided Resistive)
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Panasonic Industrial Devices Sales Company of America
An AEC-Q200 Compliant SeriesPanasonic components specified as AEC-Q200 Compliant are consistently designed into automotive systems. However, today’s Design Engineers are specifying AEC-Q200 components to meet the high-quality standards of devices beyond automotive applications.
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Product
16G DDR4-3200 1GbX8 1.2V SAM -40~85C
AQD-D4U16N32-SEW
Memory Module
DDR4 3200Mhz Unbuffered DIMM, 30u" Gold Plating Thickness, Anti-sulfurization resistance. 1.2V power consumption, Samsung original chip, 100% tested for stability, compatibility and performance.
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Product
Image Sensor/Fingerprint-on-Display Testing
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Enli Tech provides the most advanced optical and non-destructive inspection technology, which can de-convolute the digital images back to the analog properties, such as quantum efficiency, spectral response, system gain K, Dynamic Range (DR), PRNU, DRNU, Linearity Error LE, and Chief-Ray-Angle (CRA). The testing solution can be applied to CCD and CMOS image sensors in aerospace, defense, and scientific camera field. Image sensor packages that can be tested by Enli Tech’s systems include bare wafers, dies, chips, or camera modules. Our image sensor testers can help users reduce the sensor-modules or camera-modules development time and RD budget.
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Product
Linux-based Development Platform For The GridARM™ ΜController
PEAK gridARM Evaluation Board
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The ARM7 microcontroller gridARM™ was developed by Grid Connect® as a system on a chip solution (SoC) for the implementation of embedded applications with a focus on industrial communication. The Evaluation Board PEAK-gridARM is a Linux-based development platform for the gridARM™ microcontroller. It has connections for Gigabit Ethernet, high-speed CAN, USB 2.0, RS-232, SPI and I²C. The digital and analog inputs of the evaluation board can be manipulated with buttons and potentiometers. The states of the microcontroller, the supply and the message traffic are displayed via LEDs. A board support package for Linux enables access to the hardware resources of the PEAK-gridARM evaluation board.
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Product
Accelerometers - Special Purpose
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Analog Devices accelerometers and iSensor® MEMS accelerometer subsystems provide accurate detection while measuring acceleration, tilt, shock, and vibration in performance driven application. Our portfolio leads the industry in power, noise, bandwidth, and temperature specifications, and offers a range of MEMS sensor and signal conditioning integration on chip. Our MEMS-based Circuits from the Lab® reference designs have been built and tested by ADI experts to help you jumpstart your next system design.
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Product
SMARC® Short Size Module with Intel® Pentium™ and Celeron™ Processor N3000 Series SoC (codename: Braswell)
LEC-BW
Computer on Module
The LEC-BW Computer-On-Module (COM) combines the SMARC® 1.1 standard with the Intel® Pentium® and Celeron® N-series System-on-Chip (SoC), providing an ideal solution for low power consumption and high performance requirements. The module provides the high integration, high performance, low power, and ruggedness favored by Internet-of-Things (IoT) applications such as retail transactional clients, digital signage, and in-vehicle infotainment systems.
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Product
Digital I/O Card
PCIe-DIO-48JPLS
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The PCIe-DIO-48JPS is a 48 channel PCI Express (PCIe) card designed for use in a variety of digital I/O applications. It uses the high speed PCI Express bus to transfer digital data to and from the card. The digital I/O is compatible with 8255 PPI chips making it easy to program. This also allows for simple and trouble-free migration from other ACCES PCI digital I/O cards.
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Product
DisplayPort v1.3 Protocol Analysis Probe
FS4500
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The FuturePlus FS4500 DisplayPort Analysis Probe provides a mechanical, electrical and software interface to the DisplayPort bus, a digital display interface standard supported by the Video Electronics Standards Association (VESA). The FS4500 is used to design and debug computer motherboards, monitors, home theater systems, and silicon chips incorporating DisplayPort technology.
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Product
Up Converters
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Macom Technology Solutions Holdings Inc.
MACOM's upconverters are widely used in point-to-point radio, broadband communications, and RADAR applications. Operating up to a frequency of 86 GHz, our upconverters feature an integrated image reject (balanced) mixer, LO buffer, and RF buffer. Some products also include LO multiplication and variable gain, all within a single chip. Available in die, or SMT lead-free QFN and LGA packages, our upconverters boast excellent performance with adjustable bias, high linearity and image rejection with low LO leakage
