Ironwood Electronics
Ironwood Electronics has been the go-to source for advanced adapters, sockets, and modules. Our adapters convert package and pitch between devices, our modules offer complete fully tested assemblies for component replacement and upgrade, and our sockets allow for complete component and assembly testing - from new silicone characterization and validation, all the way thru burn-in and high volume automated testing – always with the highest performance and lowest possible footprint in the industry. Ironwood brings a combined knowledge of hundreds of years of engineering and manufacturing expertise, all under one roof in our state of the art 25,000 sq. foot facility just outside Minneapolis, Minnesota. Combined with our recent acquisition of the Grypper socket line, our continuous new product development demonstrates our on-going commitment to both our customers and the industry we serve.
- 800-404-0204
952-229-8200 - 952-229-8201
- info@ironwoodelectronics.com
- 1335 Eagandale Court
Eagan, MN 55121
United States of America
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Product
Grypper
Grypper
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*Package-size PCB footprint: Since the PCB footprint of Grypper is identical to or smaller than the IC package, only one PCB design is required, enabling a seamless transition from test and validation through production and reducing overall cost of test*No lid required: The package snaps directly without a lid, enabling easy probing, scoping and troubleshooting the topside of the device*Excellent signal performance: A short signal path achieves low inductance and low insertion loss, providing a nearly invisible electrical connection
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Product
Grypper G35 / G40
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*Package-size PCB footprint: Since the PCB footprint of Grypper is identical to the package, only one PCB design is required, enabling a seamless transition from test and validation through production and reducing overall cost of test*Low insertion force: Unique contact design reduces the insertion force required to insert and retain higher-ball-count packages safely and securely within the test socket*Oxide cutting wipe action: The contact design wipes the side of the solder ball during insertion, breaking through solder oxides ensuring a good electrical connection between contact and solder ball*Signal integrity: A short signal path achieves low inductance and low insertion loss, providing a nearly invisible electrical connection*Test socket has solder balls attached: The G40 contacts have solder balls reflowed onto the contacts to ensure reliable solder volume at the PCB to test socket solder interface.
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Product
Adapters
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- Pluggable BGA adapter system (Giga-snaP™) – Surface mount package emulators – Package convertors & Fix adapters – Prototype, probe & analysis adapters – Receptacles, extenders, rotators and socket plugs– Electronic modules
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Product
Probing & Analysis Adapters
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No matter how well designed a circuit is, there is almost always a need to hook up test instruments to it to verify function, look for bugs, or baseline performance. As IC packages become smaller and pin counts grow this becomes harder and harder. probing adapters are required to alleviate this de-bug problem. Many different types of adapters fall into the test and debug category. The common feature is that they bring the signals of an IC out to a format that is easy to interface with test and analysis equipment.
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Product
Surface Mount Package Emulation
SMT Adapters
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Ironwood’s SMT package emulation adapters are often called “surface mount feet” or “emulator bases”. These adapters provide access and interconnections to surface mount lands. Typically, the adapters are soldered to the target board in place of the IC device and provide a pluggable array of pins interface for sockets, probing adapters, package converters, and even board-to-board connections. These adapters are often utilized as a base for many of our probing adapter products. We constantly innovate to provide the most reliable, cost effective interfaces available. For example, many of our PLCC, QFP and SOIC emulation bases use our proprietary shaped solder techniques, replacing expensive, and often fragile, J-lead and Gull Wing leads. Shaped solder parts are easily fluxed and reflowed onto the target system. Our emulator bases can present either a male or female interface at 1.27mm or 1mm or 0.8mm pitch gold plated array pins for pluggable connection.
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Product
BGA SMT Adapters
Giga-snaP™
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Giga-snaP™ 0.75, 0.8, 1.0, and 1.27mm pitch BGA Surface Mount Feet Adapter line of products provide an inexpensive and reliable method for attaching BGA chips to target board. The product line consists of patented female sockets with machined pins epoxy over-molded into an assembly that matches a particular BGA pattern. The epoxy over-molded female BGA socket is soldered to a PCB using standard soldering methods. A corresponding male pin BGA adapter, to which the user attaches their BGA chip, is plugged into the female socket on the board thus interconnecting the chip and the system is ready to go. The SMT adapters have the same solder ball types as the chips they are emulating. These adapters have less than half of the insertion force of competitive adapters, shorter electrical path for highest speed, and can be solder reflowed numerous times. A complete description and drawings of Giga-snaP™ 0.75, 0.8, 1.0, and 1.27mm pitch BGA Surface Mount Feet Adapters can be found at the tables shown below.
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Product
Chip Obsolescence Solutions
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Solve component obsolescence problems with an Ironwood adapter and an alternate device. Adapters convert the pinout of an alternate device to maintain compatibility with an existing footprint – no need to redesign a new circuit board. Very often, these adapters (called Package Converters) are a simple 1:1 pin mapping from the new package to the old. Here are a few examples of package converters and how they can solve chip obsolescence issues.
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Product
Silver Ball Matrix Sockets
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SM Contact is a unique contact that has precise silver balls held together by a proprietary conductive formulation. These conductive columns (diameter optimized for 50 ohm impedance) are suspended in a non-conductive flexible elastomer substrate with a patented solid core for enhanced durability and reliable performance over time, temperature and cycles. This flexible substrate is very compliant and resilient and enables the conductive columns to revert back to original shape when the force is removed. Solutions are available for 0.25mm to 1.27mm LGA, BGA, QFN, CSP, POP, WLP and other packages. The silver ball matrix contact technology is also available with a protective plunger matrix (a gold plated copper cylinder) that sits on top of the conductive columns. This plunger matrix protects the conductive column from contamination from various solder ball interfaces. A quickly replaceable plunger matrix enables minimal downtime during final production test. The product family code for this line of sockets is SMP.
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Product
Grypper G80 / G80 LIF
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*Package-size PCB footprint: Since the PCB footprint of G80 is identical to the package, only one PCB design is required, enabling a seamless transition from test and validation through production and reducing overall cost of test*Low insertion force: Unique contact design reduces the insertion force required to insert and retain higher-ball-count packages safely and securely within the test socket*No lid required: The package snaps directly without a lid, enabling easy probing, scoping and troubleshooting the topside of the device*Excellent signal performance: A short signal path achieves low inductance and low insertion loss, providing a nearly invisible electrical connection
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Product
Custom Engineering Services
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Ironwood Electronics has the largest, most experienced engineering staff in our industry. Quick turn custom solutions are our specialty, with some custom solutions available as fast as 1 week. Our engineers utilize advanced tools to design precision and quality into each product. We are dedicated to providing high quality services that meet or exceed customer requirements.
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Product
Silver Button Sockets
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For BGA, QFN, or LGA applications, GTP contact technology provides >94 GHz signal speed and can additionally be used in high cycle life applications such as ATE. These sockets support pitches from 0.2 mm to 1.27 mm. Ironwood's GT sockets are ideal for prototyping and testing almost any BGA device application. These IC sockets provide excellent signal integrity yet remain cost effective. Innovative elastomer interconnect technology that delivers low signal loss (1dB at 94GHz) and supports BGA packages with pitches down to 0.2mm was utilized in these sockets. GT BGA sockets are mechanically mounted over a target system's BGA lands using mounting and alignment holes at proper locations (page 2 of the individual socket drawing shows recommended PCB layout information). These low-profile sockets are only 2.5 mm per side larger than actual IC packages (industry's smallest footprint).
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Product
Socket Accessories (Lid Options)
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GHz elastomer, spring pin and other socket technologies can accommodate different lid options depending upon the application requirement. Typical choices are swivel-lid, clamshell, double-latch, integral heatsink, etc. Custom lid solutions are also available.
