Chip
Passive or active components test and their interconnected circuitry in silicon or germanium.
See Also: Integrated Circuit, IC
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Product
ICs For Wireless Charging System
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The feature of power receiving and charge/discharge system IC RAA457100 is integrated all functions needed for a wireless chargeing, rectification, charging control for small Lithium-Ion battery and top level of power-efficiency DC-DC converter in a singl chip as 3.22mm x 2.77mm small package.
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Product
10-CH General Purpose Timer/Counter & 8-CH DIO Module
cPCI-8554
Counter/Timer Module
- PICMG 2.0 Rev 3.0- Four 82C54 programmable timer/counter chips- Up to 12-CH 16-bit timer/counter- 1-CH 32-bit cascaded timer based on 8 MHz clock source- Four programmable clock sources for each timer/counter- Programmable de-bounce filters for external clock & external interrupt inputs- 8-CH TTL digital inputs & 8-CH TTL digital outputs- +12 V and +5 V power available on the connector
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Product
FPGA Boards
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For over two decades, Digilent has proudly worked with Xilinx to become a global leader in the design and manufacturing of cost-optimized field-programmable gate array (FPGA) and System on a Chip (SoC) development boards. Optimized for accessibility and flexibility, our control system boards are suited to a wide array of applications ranging from embedded vison and sensor fusion to networking and RF to embedded measurement and control systems. Enjoy high performance-to-price ratio, ease-of-use through onboard peripheral support, extensive documentation and example designs, and an open-source philosophy.
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Product
SoC Verification
TrekSoC
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TrekSoC automatically generates self-verifying C test cases to run on the embedded processors in SoCs. This verifies your chips more quickly and more thoroughly than an external testbench, hand-written C tests, or running only production code on the processors. TrekSoC's generated test cases target all aspects of full-SoC verification and work in a variety of different environments.
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Product
8 Channel Sample & Hold and Signal Conditioning Board for Group3
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All channels provide for voltage division ahead of transient suppression before going into the S&H ICs. Channels that are sampled and held use a common sample and hold pulse that samples while high and holds while low. Jumpers on each S&H chip allow buffering of analog signals where sample and holds are not required. An advantage to the buffers is that it provides a high input impedance for high impedance voltage dividers.
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Product
Linear Vs. Switching Regulators
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Linear RegulatorsLinear regulators are a great choice for powering very low powered devices or applications where the difference between the input and output is small. Even though they are easy to use, simple and cheap, a linear regulator is normally inefficient.Switching RegulatorsSwitching regulators on the other hand are highly efficient and available as modular chips which are compact and reliable. Switching regulators can be further divided into isolated and non-isolated.
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Product
Semiconductors
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Multiphysics Analysis Solutions for Chips and 3D IC Systems. Ansys cloud-native solutions provide unparalleled capacity to speed up completion times for even the largest finFET integrated circuits (IC) and 3D/2.5D multi-die systems. These powerful multiphysics analysis and verification tools reduce power consumption, improve performance and reliability, and lower project risk with foundry-certified golden signoff verification.
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Product
8 Channel DAC FMC Module
DACNF08 – HPC
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Sundance Multiprocessor Technology Ltd.
The RFM-DACNF08 is a eight channel Digital to Analog converter FMC which complies with VITA 57.1-2010.It uses 4x AD9122 DAC chips, with a sampling speed of up to 1.2GHz
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Product
Diode Arrays
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a silicon diode with minimal packaging overhead. The small signal 0603, 1005 and 1206 Chip Diodes are lead free with Cu/Ni/Au plated terminations while the other packages (SMA, SMB, SMC, 1408, 1607, 2010, 2419, 8L NSOIC, 16L NSOIC, SOT23, SOT23-6, 16L WSOIC) use 100 % Tin terminations. All Bourns® diodes are compatible with lead free manufacturing processes, conforming to many industry and government regulations on lead free components.
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Product
ESP8266 WiFi With Headers
Feather HUZZAH
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Flagship development board from Adafruit, and like its namesake it is thin, light, and lets you fly! We designed Feather to be a new standard for portable microcontroller cores. This is the Assembled Adafruit Feather HUZZAH ESP8266 with headers. At the Feather HUZZAH's heart is an ESP8266 WiFi microcontroller clocked at 80 MHz and at 3.3V logic. This microcontroller contains a Tensilica chip core as well as a full WiFi stack. You can program the microcontroller using the Arduino IDE for an easy-to-run Internet of Things core.
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Product
64 Channel Multihit TDC
VX1190B-2eSST
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The VX1190B-2eSST is a 64 channel Multihit TDC, housed in a 1-unit wide VME64X 6U module. The unit features High Performance Time to Digital Converter chips developed by CERN. LSB can be set at 100 ps (19 bit resolution, 52 µs FSR), 200 ps (19 bit, 104 µs FSR) or 800 ps (17 bit, 104 µs FSR).
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Product
Multi Socket Programmers
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Gang programmers are based around the universal programmers but offer multiple sockets allowing 4 or more devices to be programmed at the same time giving a greater throughput where a large number of devices require programming. Mass production environments churning out tens of thousands of chips a week are where these programmers are typically found.
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Product
13MP MIPI Camera Module
e-CAM130_CUMI1820_MOD
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e-CAM130_CUMI1820_MOD is a 13MP MIPI Camera Module. This small form factor 13MP camera module comes with S-Mount lens holder. It is based on AR1820HS – an 18MP CMOS Image sensor from Aptina™ / ON Semiconductor® and has a dedicated, high-performance Image Signal Processor chip (ISP) on-board that performs all the Auto functions (Auto White Balance, Auto Exposure control) in addition to complete image signal processing pipeline that provides best-in-class images and video and the optional MJPEG compression. Though the AR1820HS is an 18MP image sensor, the e-CAM130_CUMI1820_MOD supports only up to 13MP resolution.
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Product
ECC UDIMM DDR3L 1600
SQR-UD3(ECC)
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Original memory chips (Micron) ECC function support. Fixed BOM, Wide Temperature support (-40~85oc).
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Product
13MP MIPI Camera Module
e-CAM130_CUMI1820_MOD –
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e-CAM130_CUMI1820_MOD is a 13MP MIPI Camera Module. This small form factor 13MP camera module comes with S-Mount lens holder. It is based on AR1820HS – an 18MP CMOS Image sensor from Aptina™ / ON Semiconductor® and has a dedicated, high-performance Image Signal Processor chip (ISP) on-board that performs all the Auto functions (Auto White Balance, Auto Exposure control) in addition to complete image signal processing pipeline that provides best-in-class images and video and the optional MJPEG compression. Though the AR1820HS is an 18MP image sensor, the e-CAM130_CUMI1820_MOD supports only up to 13MP resolution.
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Product
UV TOCONs
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SiC based UV sensor with integrated amplifier and 0 – 5 V voltage output. Measures intensities from 1.8pW/cm² up to 18W/cm². Spectral response for broadband UV or filtered for UVA, UVB, UVC or UV-Index. Also available for blue light (GaP chip) or visible light (Si chip) measurement. Available in TO5 housings or as miniature sensor probes (stainless steel or plastic). Special TOCONs for hydrogen flame sensing (TOCON_F) and for fire detection (TOCON_N) available. Also available for operating temperatures up to 120°C (standard is 85°C). Please learn more about the sglux TOCONs here: TOCON selection guide and here: TOCON User Guide.
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Actuators, Adjusters, & Transducers
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We offer a wide range of adjustment screws, micrometers, and kinematic positioners, as well as stepper motor, DC servo, high-precision piezo inertia actuators, and voice coil actuators. Additionally, our piezoelectric offerings include modular, screw, and replaceable-tip piezoelectric actuators, as well as Langevin transducers for ultrasonic welding applications. A wide variety of piezoelectric chips and stacks are also available.
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Product
Combination Board Tester
ATE QT2256-640 PXI
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Qmax Test Technologies Pvt. Ltd.
Most commercial ATEs does only functional test and do not carry out DC/AC parameter testing, which are very essential in increasing the fault coverage and for achieving near zero field returns. The testing challenges get worse when the boards are equipped with BS compatible components, DSP chips and CPUs or micro controller based boards. ATE QT2256-640 PXI system is designed as a combination board tester capable of testing highly complex and PCBs employing various techniques on a single platform. It can be easily upgraded to 640 digital channels and with programmable UUT power supplies, IEEE or PXI external instrumentation, Bus cycle signature system, ICE and integrated Boundary scan Test AC/DC parametric testing. The ATE is interfaced to an external host PC using a PCI express interface card allowing a maximum data transfer rate. Most commercial ATEs does only functional test and do not carry out DC/AC parameter testing, which are very essential in increasing the fault coverage and for achieving near zero field returns. The testing challenges get worse when the boards are equipped with BS compatible components, DSP chips and CPUs or microcontroller based boards.
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Product
USB-8452, 3.3 MHz I2C, 50 MHz SPI I2C/SPI Interface Device
781964-02
Interface Module
The NI USB‑8452 is a master interface for connecting to and communicating with inter-integrated circuit (I2C) and serial peripheral interface (SPI) devices. With plug‑and‑play USB connectivity, the USB‑8452 is a bus-powered, portable solution to communicate with consumer electronics and integrated circuits. It also includes eight general-purpose digital I/O lines for a variety of applications, such as configuring the address of I2C devices, toggling LEDs, or strobing convert and data ready lines common to analog converter chips. You can physically place the USB‑8452 more closely than PCI interfaces to I2C/SPI devices, which reduces I2C bus length and minimizes noise problems. Additionally, the interface provides +5 V and GND to power circuits with no external power supply.
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Product
Digitizer
742 Family
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The 742 is the Switched Capacitor Digitizer family, based on the DRS4 chip by PSI, with the highest sampling frequency (5GS/s) and channel density. It can record very fast signals from scintillators coupled to PMTs, Silicon Photomultipliers, APD, Diamond detectors and others, and save them with high efficiency and precision for advanced timing analysis. The 742 family has an additional channel (two channels in case of VME boards) which can be used as time reference for time of fight measurements. The resolution of this kind of measurements can reach up to 50 ps.
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Product
Clock Generation Devices
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Analog Devices offers ultralow jitter clock generation products for wireless infrastructure, instrumentation, broadband, automatic test equipment, and other applications demanding subpicosecond performance. Our clock products are ideal for generating the high speed, low noise clock signals required to clock high performance analog-to-digital converters (ADCs) and digital-to-analog converters (DACs). ADI clock ICs integrate PLL cores, dividers, phase offset, skew adjust, and clock drivers in small chip scale packages.
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Dummy Test Wafers/Chips
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Advanced Dummy Test Wafers/Chips available with over 35 different chip designs and choices of 11 different material configurations as well as kits complete with test vehicles. Custom-make test production of TEG wafer/glass (TEG=Test Element Group). Design and provide custom-make test kit.
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Product
16GB ECC DDR5-5600 2GX8 1.1V SAM
AQD-D5V16GE56-SB
Memory Module
SAM Original Chip, Anti-sulfuration, PCB: 30μ gold finger. Independent Power Management IC build-in, ECC function support.
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Product
Memory Interface Chips
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Providing memory bandwidth and capacity to unleash the power of multicore processors
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Product
4G DDR4-3200 512X16 1.2V SAM -20~85℃
AQD-SD4U4GN32-SP2
Memory Module
SAM Original Chip, Industrial Design for Improved Reliability, PCB: 30μ gold finger. Anti-sulfuration, Semi Wide-temp Support -20~85℃.
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Product
Wafer/Chip/Package Semi-automated ESD Tester
400SW
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Tokyo Electronics Trading Co., Ltd.
Semi-automated ESD tester featuring Ecdm 400E, Universal ESD Simulator. Used with a manual wafer probing system or a die manipulator, wafer or die level semi-auto ESD test can be done, as well as packaged device test. Damage is detected by V-I curve or leakage current change detection. Stress level and measurement points are programmed by personal computor via GP-IB. Once test terminals are selected, ESD endurance is automatically measured.
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Product
SMARC
ROM-7421
Computer-on-Module
ROM-7421 Qseven Module integrates ARM Cortex-A9 NXP i.MX6 series ultra low power SoC and I/O solution chips to be Linux support ready. NXP i.MX6 supports 2D, 3D graphicsacceleration, full HD 1080P video decoding and an HD 1080p video encoding hardware engine.
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Product
Analyze RTL
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ASICs and FPGA routinely have millions of gates with memories, transceivers, third party IP and processor cores. Problems can be time consuming and complex to debug in the lab and through simulations. Designers need verification tools that can identify problems quickly to reduce their verification and debug time before simulation, before synthesis, and definitely before burning chips in the lab.
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Product
Thin Film Chip Resistors, High Voltage Type
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Panasonic Industrial Devices Sales Company of America
Thin Film Chip Resistors, High Voltage Type by Panasonic
