Chip
Passive or active components test and their interconnected circuitry in silicon or germanium.
See Also: Integrated Circuit, IC
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Coating And Finish Durability
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Our capabilities: Adhesion. Impact Resistance. Gravelometer. Chemical Resistance. Cyclic Corrosion. Hardness. Chipping. Resistance. Water Immersion
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E-beam Metrology And Inspection
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Our HMI e-beam solutions help to locate and analyze individual chip defects amid millions of printed patterns.
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Isolated LVDS
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Isolated LVDS (low voltage differential signaling) devices couple differential signals applied to the LVDS receiver inputs across the isolation barrier to the outputs on the other side and re-transmits the bit stream or clock as LVDS. Analog Devices' drop-in LVDS isolators offer designers robust, high speed differential signaling for point-to-point and multidrop applications. Extending iCoupler® chip scale transformer technology for ultrahigh speed data encoding, these LVDS isolators support a a data rate of up to 2.5 Gigabits per channel for a total bandwidth of 10 Gbps. In contrast to expensive fiber implementations, deserialized links over standard digital isolators or optocouplers, and design-intensive bespoke solutions using transformers or high voltage capacitors, ADI Gigabit Digital LVDS isolators offer the only integrated comprehensive, high performance isolation at 10 Gbps. High performance galvanic isolation for applications include analog front-end (AFE), processor to processor serial communication, or video and imaging data (such as HDMI isolators) as well as isolation between boards, or at a cable interface for LVDS or CML signal chains.
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Automotive Infotainment SoCs
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ST’s portfolio of infotainment systems on chips (SOCs) includes a complete offer of automotive-grade devices for a wide range of infotainment systems ranging from turnkey Accordo2 processors for car radio applications and Display Audio systems, featuring smartphone mirroring and support of rear-view cameras, up to powerful Accordo5 multi-core processors with best-in class 3D graphics and video decoding capabilities, to address multi-standard smartphone replication technology as well as Digital Instrument Cluster applications.
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Digital I/O Card
PCIe-DIO-48JPLS
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The PCIe-DIO-48JPS is a 48 channel PCI Express (PCIe) card designed for use in a variety of digital I/O applications. It uses the high speed PCI Express bus to transfer digital data to and from the card. The digital I/O is compatible with 8255 PPI chips making it easy to program. This also allows for simple and trouble-free migration from other ACCES PCI digital I/O cards.
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4K UHD Fanless Edge Computer
UBX-110K
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The UBX-110K is a 4K UHD fanless edge computer powered by an Intel® N97 or Core™ i3-N305 processor. Built-in an Intel® N97 or Core™ i3-N305 processor, Built-in a TPM 2.0 chip for data encryption enhancement. Supports triple displays to expand the visible range and provide detailed video content. Supports two M.2 2280 SATA SSD expansions.
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High-Speed Digital Output
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High-speed digital output photocouplers (optocouplers) are optically coupled high-speed, totem-pole output isolators containing a GaAlAs LED on the input side and a photodiode and signal processing circuit on the output side in a single chip.
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16 Channel Multihit TDC
VX1290N-2eSST
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The VX1290N-2eSST is a 16 channel Multihit TDC, housed in a 1-unit wide VME64X 6U module. The unit features High Performance Time to Digital Converter chips developed by CERN. LSB is 25 ps (21 bit resolution, 52 µs FSR). The module accepts NIM inputs.
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Extreme Rugged PC/104 Single Board Computer with Intel® Atom™ Processor System-on-Chip
CM1-BT1
Single Board Computer
The CMx-BTx is a PC/104-based, Single Board Computer (SBC), fully compliant with the PCI-104 Specification, Version 1.1 and partially compliant with the PC/104 Specification, Version 2.6. PC/104 SBCs are very compact and highly integrated computers. This SBC features the 22nm, Intel® Bay Trail SoC. The board provides a DDR3L SO-DIMM socket, a PC/104 connector, a PCI-104 connector, two USB 2.0 ports, one USB 3.0 port, up to two Gigabit Ethernet ports, up to two SATA 3 Gb/s ports, one dedicated HD-Audio panel connector, one VGA port, one LVDS port, up to four COM ports, one mini-PCIe slot (with one USB 2.0 port included). The CMx-BTx can be run with only 5 volts and is capable of running operating systems like DOS, Windows XP/7/8 in either 32-bit or 64-bit configuration, Linux, VxWorks, and others. Another feature included on the board is a fail safe BIOS that enables the user to start the module even if the original BIOS is corrupted.
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System Level Test
SLT
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As technology nodes continue to evolve and with a more aggressive time to market to bring devices to their end applications, full test coverage of such chips is possible only with System Level Testing.
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OBD Chips
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STNxxxx OBD-II to UART Interpreter ICs are developed by our in-house engineering team at OBD Solutions. STNxxxx chips combine ELM327 compatibility with advanced hardware at an unbeatable price. We utilize STN11xx technology in all of our OBDLink scan tools.
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MIL-STD-1553 Interface Board
EXC-4000VME/MCH-x / EXC-4000VXI/MCH-x
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The EXC-1553VME/MCH and EXC-1553VXI/MCH cards are based on a MIL-STD 1553 certified "Summit" chip used in many flight critical systems. Each dual redundant channel supports both MIL-STD-1553A and MIL-STD 1553B protocols. Up to eight channels may be programmed individually to operate as a Bus Controller, Remote Terminal, Bus Monitor, or Remote Terminal / Concurrent Bus Monitor. The 32 K x 16 of RAM allotted to each channel for the storage of data and control parameters may be updated in real time.
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Mobile Forensics Tool-Chip off
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Mobile phone forensics-chip-off data recovery -system verifydebug and internal-analyzequality review.etc
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LED Tester For Chip And Wafer
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Electrical Testing: Forward：VF,DVF,VFDReverse：VZ,IROptical Testing: can test LOP in cd/mcd/W/mW/lm... from different optical componentsWavelength λp,λd,λc,hw,purity,(x,y),CCT,CRIFour-wire measurement and contact resistance in case of deviation.Auto polarity identification and preheat function.Compatible mechanical interface.Optional ESD static test system or polycrystalline test system
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SparkFun Dev Board
ESP8266 Thing
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This is the SparkFun ESP8266 Thing Dev Board – a development board that has been solely designed around the ESP8266, with an integrated FTDI USB-to-Serial chip. The ESP8266 is a cost-effective, and very capable WiFi-enabled microcontroller. Like any microcontroller, it can be programmed to blink LEDs, trigger relays, monitor sensors, or automate coffee makers, and with an integrated WiFi controller, the ESP8266 is a one-stop shop for almost any Internet-connected project. To top it all off, the ESP8266 is incredibly easy-to-use: firmware can be developed in Arduino, and uploaded over a simple, serial interface. The ESP8266 Thing Development Board breaks out all of the module’s pins, and the USB-to-serial converter means you don’t need any peripheral components to program the chip. Just plug in a USB cable, download the Arduino board definitions, and start IoT-ing.
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MPI Sorter Series
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MPI’s Sorter Series are improving production efficiency and yields for market sectors related to LED chip, package production, discrete device handling, and IC substrate manufacturing. Deploying MPI’s Pick & Place technology, the Sorter Line offers dedicated sorting and defect inspection solutions particularly suited for GaN, GaAs, Vertical LED Chip, Flip Chip, and Laser Diode applications. With a proven heritage of and market-advanced technologies, MPI offers competitive and differentiated solutions that are scalable and cost-effective.
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UDIMM
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UDIMM (Unbuffered Dual In-line Memory Module) is the most common type of RAM used in desktop computers, laptops, and consumer-grade workstations, designed for high speed and direct communication with the CPU. They are "unbuffered," meaning no buffer sits between the memory controller and chips, offering lower latency.
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Universal Counter (150MHz - 9GHz)
S4386
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S4386 series universal counter is a kind of high-precision instrument for measurement of frequency and time, which is developed by Saluki Technology. Taking the high-performance AVR single chip microcomputer as the core, this instrument is used for function control, measurement time sequence control, data processing and result display. The reciprocal counting technology is employed to achieve the equal precision measurement within the full range.Due to the characteristics such as stable performance, complete functions, wide range of measurement, high sensitivity, large dynamic range, high precision, small volume, and convenient and reliable operation, S4386 series universal counter is widely used in the fields of industrial production, scientific research, and measurement and metering as the renewal product replacing the traditional electronic counter.
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Demonstration Board
SAMPULSE20x2
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The SAMPULSE20x2 is a demonstration board for the Furaxa SiGe3 30GHz sampler/pulser IC. The SIGe3 IC is a dual channel sampler pulser chip, and the SAMPULSE20x2 demonstration board contains two 2.4mm combined TDR input/output connectors, one to each sampler/pulser channel in the IC. The SiGe3 IC's two sampler outputs are then sent to to two SMA jacks, the first outputting the sample taken on the rising edge of the sampler clock, and the second containing the sample taken on the falling edge of the sampler clock. The sampler clock input, which must be a square wave, may be set to any frequency from 5MHz to 1GHz, causing the board take two pairs of samples (one on each clock edge) at rates from 5 million to 1 billion per second. A pulser clock input, which may be set to any frequency from 5MHz to 2GHz, and MUST be a square wave (preferably differential) with rise time under 100pS, causes the board to produce concurrent pulses on both of the SiGe3's I/O pins, which produce near-concurrent pulses at the two 2.4mm sampler/pulser TDR input/output connectors.
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Electronic Inspection Systems
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Intego's knowhow even makes it possible to identify challenging defects that may be located under the surface. One system is the inspection of chips by means of lock-in thermography, which visually represents the IR radiation intensity signal of electronics. Special lasers and flash lamps generate a very short heat impulse (10 ms) on the chip, which generates a measurable heat flow. In most cases, a resolution of < 1 μm can be achieved.
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Product
200μm Flexible PET Interdigitated Electrode Chip
FPL1
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200μm flexible PET IDE chip designed for biosensing, gas sensing, and humidity monitoring applications.
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N2,O2 Analyzer
P860 Series
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Shanghai ChangAi Electronic Science & Technology Co.,Ltd
P860 series analyzer is the online intelligent measurement instrument, which adopting advanced ion current oxygen sensor with single chip technology. N2%=100%-O2%. It has been widely used in the fields of nitrogen separation from air, fertilizer, petrochemicals and biological fermentation. - See more at: http://en.ci-ele.com/8aedb8bf-ef48-4f8c-127a-797c939a6181/54b8d904-ebc5-7b11-fc19-cf39baaa5889.shtml#sthash.0iShzAbt.dpuf
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Production Test System
G3 Hybrid
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The G3 Hybrid is a state of the art system for fast Production test throughput in DC test applications. The system combines the most versatile offerings of features in a single system, at the lowest cost. For devices requiring DC and Continuity test capability only, G3H is a very flexible cost-effective Production Test solution. This approach provides a DC test system with the capability to add logic resources (AC/SCAN) as well as analog resources for Mixed Signal. The HILEVEL G3H embraces low cost while supporting SCAN, giving you the ability to toggle every node in your chip.
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COM Express Compact Size Type 6 Module with Mobile 7th Gen Intel® Core™ and Celeron® Processors (formerly codename: Kaby Lake)
cExpress-KL
Computer on Module
The cExpress-KL is a COM ExpressR COM.0 R2.1 Type 6 Compact size module featuring the 64-bit 7th Generation Intel® Core™ i7/i5/i3 and IntelR CeleronR Ultra-Low TDP processors (formerly "Kaby Lake U") with CPU, memory controller, graphics processor and I/O hub on a single chip.
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MIPI Video Devices
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The abundance of the MIPI® interface in mobile applications has driven its proliferation into other application areas such as the automotive and broader consumer environments. Analog Devices, an established provider of video products, offers a range of MIPI video devices that provide interfaces to the latest generations of system on chip (SoC) processors. Typical applications for MIPI video devices include the rear-view camera function in the automotive environment and HDMI® output from portable devices featuring a MIPI-capable SoC. The MIPI video device portfolio offers a variety of solutions.
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SODIMM DDR4 3200MT/s
SQR-SD4S
Dual In-Line Memory Module (DIMM)
Original Hynix IC chips adopted, Data transfer rate: 3200MT/s. Capacity: 4/8/16/32GB, Operating temperature: 0 °C ~ 85 °C Lifetime warranty.
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Infrared Moisture Analyzer
LD-LIMA-A10
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Infrared Moisture AnalyzerLD-LIMA-A10is an online, fast, continuous measurement and non-contact measurement device with measurement distance range of 20 to 40 cm. It provides automated control and 4 to 20 mA current signal. This IR Moisture Analyzer emits different wavelengths of infrared light (4, 6, 8, 10 beam) to calculate the moisture content of the measured object. Designed with long-life high-speed brushless motor, imported high response infrared sensors, information processing chip FPGA + DSP + ARM9 combination, to attain real time data, improved stability and precision.
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Wide Temperature Server DIMM
SQR-RD4M
Dual In-Line Memory Module (DIMM)
Original Hynix IC chip adopted, Wide operating temperature support -25~85oC, Data transfer rate up to 3200 MT/s.
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High-Speed Analog Output
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High-speed analog output photocouplers (optocouplers) are optically coupled isolators containing a GaAlAs LED on the input side and a PIN photodiode and high-speed amplifier transistor on the output side in a single chip.
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RF/Microwave Assembly Capability
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Teledyne Labtech offers a comprehensive build-to-print microwave module and microwave components manufacturing service. This includes MMIC placement, Au wire bonding, SMT assembly and test.Our microwave MIC production facility is housed in a class 10,000 clean room that accommodates manual chip placement and semi-automatic wire bond assembly. Dedicated microwave components manufacturing is undertaken within production cells established to meet specific customer or product requirements.
