Chip
Passive or active components test and their interconnected circuitry in silicon or germanium.
See Also: Integrated Circuit, IC
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Product
Socket with Collet Contacts
Correct-A-Chip
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Correct-A-Chip with Collet Contacts. Correct-A-Chip technology solves problems associated with the use of alternate ICs (due to availability, obsolescence, need for better performance, etc.) by eliminating the need for new PCBs.
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Product
LoRaWAN Gateway
USM-S67-G0WP0
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Quad-core industrial processor with big memory, Equip with SX1302 chip, handling a higher amount of traffic with lower consumption. 8 half/full-duplex channels, IP65 enclosure and industrial design for parts of outdoor environment applications like eaves.
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Product
KV CAPS
500 V
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Macom Technology Solutions Holdings Inc.
The MACOM KV CAPSTM Si high voltage capacitors feature very high working voltage ratings, very low loss and excellent stability by virtue of their novel internal construction and very high-quality dielectric layers. These capacitors are available as unpackaged chips. The chips have gold bonding surfaces on both terminals to enable excellent bonding and minimum contact resistance.
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Product
BGA SMT Adapters
Giga-snaP™
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Giga-snaP™ 0.75, 0.8, 1.0, and 1.27mm pitch BGA Surface Mount Feet Adapter line of products provide an inexpensive and reliable method for attaching BGA chips to target board. The product line consists of patented female sockets with machined pins epoxy over-molded into an assembly that matches a particular BGA pattern. The epoxy over-molded female BGA socket is soldered to a PCB using standard soldering methods. A corresponding male pin BGA adapter, to which the user attaches their BGA chip, is plugged into the female socket on the board thus interconnecting the chip and the system is ready to go. The SMT adapters have the same solder ball types as the chips they are emulating. These adapters have less than half of the insertion force of competitive adapters, shorter electrical path for highest speed, and can be solder reflowed numerous times. A complete description and drawings of Giga-snaP™ 0.75, 0.8, 1.0, and 1.27mm pitch BGA Surface Mount Feet Adapters can be found at the tables shown below.
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Product
Advanced SoC Test System
3680
Test System
The Chroma 3680 is an advanced SoC test system with data rate up to 1Gbps. The Chroma 3680 is capable of conducting parallel tests on multiple chips to meet the digital and analog IC testing requirements, with applications including MCU, digital audio, digital TV, set-top box, DSP, network processor, field programmable gate array (FPGA) and consumer electronics.
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Product
Module Spectrum
nRF51822 Series
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Raytac nRF51822 module provides 16K & 32K RAM option with Chip Antenna & PCB Antenna for selection.
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Product
Dicing Machines
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Dicing machine cut wafers into individual semiconductor chips with blades. ACCRETECH Laser dicing machines use lasers instead of blades to dicewafers at high speed in a completely dry process.
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Product
Universal Counter (225MHz - 9GHz)
S43131
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S43131 series universal counter is the high-precision frequency and time measuring instrument developed by Saluki Technology. It adopts the high-performance single chip microcomputer as the core to conduct function control, survey time sequence control, data processing and result display. Adopt the countdown counting technique and digital interpolation technique to realize high-precision measurement within the whole range.S43131 series universal counter has stable performance, complete function, wide measurement range, high sensitivity, large dynamic range, high precision, small volume and convenient and reliable use. It has wide application in industrial production, scientific research and measurement and other fields, and is the ideal upgraded and renewed product of the traditional electronic counter.
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Product
Module Spectrum
nRF52811 Series
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Raytac nRF52811 module employed MDBT42Q series design is a hardware pin to pin compatible to nRF52832 & nRF52810 solution with both Chip Antenna and PCB Antenna option for selection.
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Product
1D/2D Barcode Reader
UTC-510P-B
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1D/2D:752x480 CMOS2D Barcode Decoder Chip 72MHzRed LED 625±10 nm. 1D Linear:20% minimum reflective differenceTypical 3 mil (Code 39, PCS 0.9)Up to 24 inches on 100% UPC/EAN symbolsUp to 31.5 inches on 20 mil Code 39630nm visible red LED.
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Product
Universal Programmers
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Economical universal programmer is a burner designed to meet the starting customer, to support less than 48 chips, but the support of more than 3000 chips, is the first choice for maintenance, teaching tools. Although the economy as the label, but its performance is no less than other competing products, with DIP48 lock socket, chip pin automatic detection function.
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Product
Rugged SODIMM DDR4 2666/3200 Wide Temperature
SQR-YD4I
Dual In-Line Memory Module (DIMM)
Robust PCB designed with Mounting Hole with Military MIL-810G verified. Extreme Data Transfer rate up to 3200 MT/s, Capacity: up to 32GB. Wide Temperature supported: -40°C ~ 85 °C, Original IC chip (Samsung/Hynix).
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Product
TRA-300 LED Thermal Resistance Structure Analyzer
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Hangzhou Everfine Photo-E-Info Co., LTD
The TRA-300 accurately measures the thermal resistance, junction temperature, optical power, voltage, current and other parameters of LED packaging products.The heating and cooling curves of LED can also be obtained, and the integral and differential thermal structure functions can be obtained by establishing the finite element model.Through the structural function analysis of the TRA-300 special software, the fine thermal resistance structure of the LED (from the chip to the thermal resistance value of each package structure) can be obtained, so as to objectively evaluate the heat dissipation quality and thermal management level of the LED package products, and provide the best verification for the heat dissipation design of the LED.
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Product
NVIDIA Jetson Solutions
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Edge AI Inference computers have NVIDIA Jetson chips for video image applications in surveillance, transportation, and manufacturing sectors.
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Product
100 High Speed Programmer
Commander Accelerator
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The Commander High Speed Programmer (HSP) is low overhead system designed to test Flash Memories, PLA's and Micro-controllers. The parallel multi-module architecture provides the flexibility to program and test multiple devices. It's full-featured capabilities support chip erasing and programming, sector erasing and programming, sector protect and unprotect, and data verification functions.
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Product
Interface RS-232
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The RS-232 specification allows for reliable data transmission from one transmitter to one receiver at data rates of up to 20 kbps over relatively short distances (up to 50 feet). On more recent RS-232 transceiver chips, data rates of up to 1 Mbps are achievable over shorter distances (up to 5 feet). The most common applications for RS-232 transceivers are computers and peripherals, mobile phone data cables, and diagnostic data ports.
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Product
Saluki SEL7 Series Programmable DC Electronic Load (up to 6kW)
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The new SEL7 series programmable DC electronic load is a new generation product designed by Saluki Technology. Incorporating high-performance chips, the SEL7 series delivers high speed and high accuracy with a resolution of 0.1mV and 0.01mA (basic accuracy is 0.03% and basic current rise speed is 2.5 A/μs).SEL7 series have wide application from production lines for cell phone chargers, cell phone batteries, electronic vehicle batteries, switching power supplies, linear power supplies, and LED drivers, to research institute, automotive electronic, aeronautic and astronautic, maritime, solar cell and fuel cell etc. test and measurement applications.
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Product
Chip Scale TVS Arrays
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ProTek's patented* Flip Chip TVS Arrays are designed for small circuit board applications with limited size and space availability. To reduce installation costs, the Flip Chip can be mounted directly onto the printed circuit board; similar to chip resistors and capacitors. These devices are ideal for use in portable electronics such as Cellular Phones, Cellular Phone Accessories, Personal Digital Assistants (PDAs), Laptops and Pagers.
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Product
6U cPCI 1/10/40 GbE Switch
ComEth4050e
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The ComEth 4050e is a cutting-edge 6U cPCI Layer 2/3 Ethernet switch for PICMG 2.16 & VITA 31.1 systems and is powered by the newest Marvell highly integrated system-on-chip (SoC) with programmable packet processors.
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Product
Data Acquisition & Control
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Blue Chip Technology have been designing and manufacturing data acquisition and control boards since 1986. The current range of boards have digital and analog IO and an excellent record for reliability in the harshest of environments.
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Product
RF Coaxial Probes & Probe Positioner
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Fairview Microwave’s line of coaxial RF probes and RF PCB probe positioner are ideal for use with chip evaluations, signal integrity measurements, coplanar waveguide, substrate characterization, gigabit SERDES and test fixture applications. The RF coaxial probes provide return loss better than 10 dB and a maximum operating frequency of 20 GHz. The probes have a 3.5mm female interface, a pitch of 800 or 1500 micron and they can be cable-mounted. They feature gold-plated contacts and can be used by hand, with or without a probe positioner. Compliant coaxial GSG (or GS) pogo pins allow for a broad range of probing angles. The RF PCB probe positioner can hold coaxial probes, has articulated joints and delivers multi-axis positioner control. This positioner also boasts a magnetic mounting plate with on-off positioner switch.
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Product
Balanced Measurements
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The unbalanced interface of a VNA is not very well suited for measuring balanced circuits like antennas, transmission lines or chip impedances. In fact it is nearly impossible to get a decent calibration on a balanced 2-port measurement using coax cables.
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Product
Digital Receiver Exciter (DREX)
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CAES provides high performance, compact, rugged, DREX modules utilizing surface mount and hybrid chip and wire technology as required by the end application. End applications span radar, electronic warfare, missile, and space applications.
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Product
Thermal Test Vehicles
TTV
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Thermal Engineering Associates, Inc.
Using the TTC-1002 Thermal Test Chip as a basis, TEA offers TTVs in flip-chip, bare die, BGA packages for a variety of thermal simulation, reliability, qualification, heat sink characterization, and TIM characterization activities. Selective unused balls are sequentially connected together for daisy-chain applications.
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Product
Packaging Manufacturing
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KLA’s extensive portfolio of packaging solutions accelerates the manufacturing process for outsourced semiconductor assembly and test (OSAT) providers, device manufacturers and foundries for a wide range of packaging applications. Innovations in advanced packaging, such as 2.5D/3D IC integration using through silicon vias (TSVs), wafer-level chip scale packaging (WLCSP), fan-out wafer-level packaging (FOWLP) and heterogeneous integration as well as a wide range of IC substrates create new and evolving process requirements. KLA offers systems for packaging inspection, metrology, die sorting and data analytics focused on meeting quality standards and increasing yield before and after singulation. SPTS provides a broad range of etch and deposition process solutions for advanced packaging applications. Orbotech offers a portfolio of technologies that includes automated optical inspection (AOI), automated optical shaping (AOS), direct imaging (DI), UV laser drilling, inkjet/additive printing and software solutions to ensure manufacture of the highest quality of IC substrates.
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Product
Module Spectrum
nRF52805 Series
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Raytac nRF52805 tiny and low cost modules spectrum covers MDBT42TV-192K & MDBT42TV-P192K series with both Chip Antenna and PCB Antenna option for selection
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Product
Computer-On-Module
CM12001
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LinkedHope Intelligent Technologies Co.,Ltd.
CM12001 integrates the complete functionality of vertex86DX,offering a CPU, system BIOS, 16bit DRAM up to 512MB, keyboard controller, real-time clock, and IDE compatible onboard Flash hard disk up to 16GB. The solution includes a highly integrated embedded CPU chip made by DMP. It has x86 Compatible Processor Core.This module is designed for embedded applications. The pin out of its’ Dimm-pc bus connector corresponds in large part to the pin out of a standard ISA bus. It offers peripheral functions such as USB, PS2, LPT, COM interface...
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Product
Chip Inspection System
GEN3000T
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GEN3000T is an inspection system that performs automatic inspection of individual semiconductor chips.This revolutionary chip surface inspection system was achieved by combining the chip handling technology cultivated by Toray with the inspection algorithm used in the "INSPECTRA®" wafer defect inspection system.
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Product
PXI-2535, 544-Crosspoint, 1-Wire PXI Matrix Switch Module
778572-35
Matrix Switch Module
544-Crosspoint, 1-Wire PXI Matrix Switch Module—The PXI‑2535 is a high-density 4x136 PXI matrix switch module that is ideal for routing low-power DC signals in validation test systems of mass produced devices such as semiconductor chips and printed circuit boards (PCBs). Featuring field-effect transistor (FET) relays, the PXI‑2535 offers unlimited mechanical lifetime and switching speeds up to 50,000 crosspoints/s. It also features onboard relay counting for relay monitoring and deterministic operation with hardware triggers to improve test throughput.
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Product
Empowering Traditional Mass Spec
ZipChip
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The ZipChip™ separations platform uses integrated microfluidic technology to prepare, separate and electrospray biological samples directly into traditional mass spectrometers (MS). In less than 3 minutes per sample, the cost-effective ZipChip system enables analysis of a broad range of matrices from growth media to cell lysates, blood, plasma, urine, and biopharma products. Each chip provides answers on analytes from small molecules up to intact proteins, antibodies and antibody drug conjugates (ADCs). This platform provides better separation quality than most liquid chromatography (LC) instruments – in a fraction of the time – all with full MS identification behind every separations peak.
