Showing results: 4261 - 4275 of 8598 items found.
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MicroContact AG
With the micro probes and the fine-pitch adapters used on them, you are able to contact the finest test structures. E-tests, functional tests, IC tests or high-current tests are made to be affordable, efficient and with a short cycle time. With the integration of HF adapters we also enable the double-sided testing of HF substrates up to high frequency ranges.
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MS-177 -
Misum Systech Co., Ltd.
This equipment is used for PCM function test to check thestate ofsingle IC PCM as well as dual IC PCM. It is applied for only 1Cell PCM and can consist ofup to 40 Channels.
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Memory Family -
Advantest Corp.
As semiconductors proliferate and continue to increase in complexity, they are found in an ever-expanding array of state-of-the-art applications, including PCs, digital appliances, mobile devices, and automobiles. To meet the demands of this diverse set of end-user requirements and to keep their products differentiated from the competition, device manufacturers continually pursue new technologies, and there are now over 100 IC package types offered. To this end, with time-to-market a critical measure for success, device manufacturers are seeking ways to get better performance from their equipment, while reducing the production time and labor associated with frequent changes in package types.
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Chroma ATE Inc.
Adivic/Chroma Group has been in the development of RF & Wireless test solutions for more than a decade. Take RF Recorder as an example, it has been adapted by all major Japanese & Korean automotive brand names such as Mitsubishi, Honda, Hyundai,.. ,most of the global IC design houses with DTV chips, and also military entities in NATO. With the same customer-proved Software Defined Radio architecture, we have introduced Wi-Fi, Bluetooth tester since 2014. It will soon cover other current/future wireless standards such as 4G/LTE, 802.11ax, 802.11ah, etc.
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PFL780/760 -
Polar Instruments Inc
The PFL780 and 760 use IC clips as a test interface. This makes them ideal for the service and maintenance of legacy systems. If you need to work on high density surface mount PCBs you should consider the GRS500 as a more suitable alternative.
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Logic Family -
Advantest Corp.
To meet the demands of this diverse set of end-user requirements and to keep their products differentiated from the competition, device manufacturers continually pursue new technologies, and there are now over 100 IC package types offered. To this end, with time-to-market a critical measure for success, device manufacturers are seeking ways to get better performance from their equipment, while reducing the production time and labor associated with frequent changes in package types.
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UNIVANS Co., Ltd.
IC Package It is a device to install INTERFACE between TESTER and DEVICE during TEST to check electrical defects such as O / S (Open, Short) test, mounting test, BURN-IN TEST and RLC TEST, The device
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DC3 -
Hilevel Technology, Inc.
The wafer has been fully tested, cut and packaged. Today's IC manufacturers are finding tremendous cost savings in performing just fast DC tests on these packaged parts rather than running the full wafer tests all over again. Until now this required either an expensive full-power IC tester, or a "rack-n-stack" collection of instruments. Enter the HILEVEL DC3 Co-Optive Parametric Tester. No more instruments, no switching matrix, no tricky software. The DC3 combines a high-precision DC-PMU and internal DUT supplies to test up to 2,048 pins, all in a single chassis with Multi-Site capability up to 64 sites. And every DC3 includes our Classic Curve Trace feature, allowing easy curve tracing on every pin.
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ShibaSoku Co., Ltd.
A paradigm shift has been occurred in Japan’s major brand WL25 series tester. Ultimate simple system is available by effective analog pin architecture.This cost performance system is covered analog IC extensively, which are high accuracy, speed and multi-site test function.
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LPDDR4 and LPDDR3 -
Triad Spectrum, Inc.
Testing LPDDR4, LPDDR3 devices is made fast and simple with the "Lower Power" LPDDR4/3 TCE-3200LP IC test system. It can be configured up to 32 sites in parallel and integrated with the customer's selected handler.The TCIII-3200LP system can be used as a production tool as well as an engineering tool. To assist manufacturers and integrators, TurboCATS has developed a heat chamber that can be integrated with the TCE-3200LP, LPDDR4 and LPDDR3 test system. This allows the devices to be tested while being exposed to heat conditions.
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Thermo Fisher Scientific Inc.
Identify and help correct ESD and latch-up susceptibility issues on sensitive integrated circuit components prior to full-scale production with the Thermo Scientific™ MK.2-SE ESD and Latch-Up Test System. The MK.2-SE test system provides advanced capabilities to test high pin count IC devices to Human Body Model (HBM) and Machine Model (MM) ESD standards. The system’s pulse delivery design addresses wave form hazards such as trailing pulse and pre-discharge voltage rise, and performs Latch-Up testing per the JEDEC EIA/JESD 78 Method.
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Winslow Adaptics, Ltd.
Solder down modules to suit any package type provides a cost effective solution for replacement test heads, male or female. The mating top modules can incorporate either a ZIF or standard IC socket and the addition of optional test pins if required from RS Components.
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KayaQ™ (GRL-KAYAQ-FW) -
Granite River Labs Inc.
GRL’s Universal High Speed Bench Test Automation Framework ‘KayaQ™ ’ is an enterprise-quality, Windows 7 PC-based, ready-to-use automation environment for labs overcoming the next generation challenges of bench testing. The world’s leading provider of high speed interface PVT characterization test services, GRL developed KayaQ™ to address the gaps in available tools for high speed interface characterization. KayaQ™ provides a ready-to-deploy automated test solution for testing of high speed interfaces, tailored for the needs of volume bench-level IC PVT characterization.
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Grypper -
Ironwood Electronics
*Package-size PCB footprint: Since the PCB footprint of Grypper is identical to or smaller than the IC package, only one PCB design is required, enabling a seamless transition from test and validation through production and reducing overall cost of test*No lid required: The package snaps directly without a lid, enabling easy probing, scoping and troubleshooting the topside of the device*Excellent signal performance: A short signal path achieves low inductance and low insertion loss, providing a nearly invisible electrical connection
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STAr Technologies, Inc.
STAr provides cost effective semiconductor ATE test systems for linear, power management and mixed signal devices and ensures industry customers attain the highest level of return-on-investments and satisfaction.
