Wafer Thickness
See Also: Wafer, Wafer Failure Analysis, Wafer Edge, Wafer Resistivity, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Inspection, Four Point Probes
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Coating Thickness Gauges
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Non-destructive coating thickness measurement of non-magnetic coatings, e.g. paint, enamel, chrome on steel, and insulating coatings, e.g. paint and anodizing coatings on non-ferrous metals.
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Silicon & Compound Wafers
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Compound semiconductors are undergoing a major expansion addressing many new applications and using various materials such as SiC, GaN, GaAs and others, to improve the performance of new devices in several segments such as Power and Face Recognition.
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UPG-07 Ultrasonic Precision Thickness Gages - Color
UPG-07
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100K thickness datalogger with export to Excel 8 0z. Operates on 2 AA batteries Measures all engineering material Store and Recall setup for use with multiple materials All software options are field-upgradeable Vibrate and color change on alarm Illuminate the keypad on alarm condition Inform the operator when to replace the transducer Simple user-interface
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Wafer Test Solutions
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Wafer Test Solutions has established leadership positions in developing and deploying application-specific test solutions for MEMS devices, offering wafer and frame probing stations suitable for R&D, Wafer Sort, and Final Test. We offer state-of-the-art solutions to test environmental and motion sensors in wafer and other advanced packages.
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High Performance Fluorescent X-ray (XRF) Coating Thickness Gauge
FT150 Series
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Hitachi High-Technologies Corp.
The FT150 is a high-end fluorescent X-ray coating thickness gauge equipped with the polycapillary X-ray focusing optics and Vortex silicon drift detector. The improved X-ray detection efficiency enables high throughput and high precision measurement. Furthermore, new design to secure wide space around sample position gives exellent operability.
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Ultrasonic Wall Thickness
UTG
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The PosiTector UTG measures the wall thickness of materials such as steel, plastic and more using ultrasonic technology. Ideal for measuring the effects of corrosion or erosion on tanks, pipes or any structure where access is limited to one side. Multiple echo (UTG M) Thru-Paint models measure the metal thickness of a painted structure without having to remove the coating.
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Coating Thickness Meter for Ferrous Substrates
CM8821
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- Operating principle: magnetic induction (F)- Measuring range:0-1000um - Resolution; 0.1/1- Accuracy: 鍗?-3%n or 鍗?.5um- Min. measuring area: 6mm- Min. sample thickness: 0.3mm- Battery indicator: low battery indicator- Metric/ imperial: convertible- Power supply: 4x1.5V AA (UM-3) battery- Auto power off- Operating conditions:0-+45閳?/span>(32閳?/span>-104閳?/span>),閳?0%RH- Dimensions: 160x68x32mm- weight: 250g(not including battery)- Optional accessories: other range 0-200um to 15000um
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Non-contact Inline P/N Checker Module For Solar Wafer
PN-100BI
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*Principle: Photovoltaic effect with the laser diode*Suitable for production line and tranceportation system*Connect to host PC by LAN to send measurement command and data
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Drone Thickness Gauge
Multigauge 6000
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The Multigauge 6000 Drone Thickness Gauge has been designed specifically to mount onto a drone or UAV. This new technology has already had many successful installations on various models of drone and this is the first dedicated drone thickness gauge available worldwide.
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Wafer Testing
Trio Vertical
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SV TCL's TrioTM is a reliable solution for advanced wafer testing challenges, specifically full array and parallel probing. We offer a complete line of vertical probe card products, each designed for your unique application.
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Product
Batch Wafer Transfer Tools
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Dou Yee Enterprises (S) Pte Ltd
Dou Yee Enterprises Batch Wafer Transfer Tools
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Electrostatic Capacitance-Type Non-Contact Thickness Meter
CL-5610 series
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The CL-5610/5610S is used to perform non-contact thickness measurement of objects under measurement including conductors, semiconductors and insulators in combination with the new-developed VE series capacitance type gap detector. The CL-5610/5610S can be connected up to 2 gap detectors and also used as 2-ch displacement meter.
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Thickness and Flaw Inspection
OmniScan MX ECA/ECT
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With thousands of units being used throughout the world, the OmniScan® MX is a field-proven, reliable instrument that is built to withstand harsh and demanding inspection conditions. Compact and lightweight, its two Li-ion batteries provide up to 6 hours of manual or semi-automated inspection time.
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Ultrasonic Wafer Scanner
AutoWafer
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Installed in more wafer applications than all other automatic ultrasonic testing tools combined, AutoWafer provides a complete, production-ready wafer scanner for wafers from 100mm to 200mm, including multiple sizes in a single batch.
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Inspects MEMS and Wafer Level Devices
NorCom 2020-WL
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The NorCom 2020-WL is specifically designed for wafer-level inspection and leak tests up to 1000 devices per cycle. The system can inspect up to an 8” wafer on or off a saw frame. It is designed to test MEMS and other wafer level devices that have a cavity.
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Ultrasonic Thickness Gauge
TI-100K
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TI-100K inherits high performance of predecessors including popular TI-45NA, and also have memory function and statistical processing performance.
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Hand Held Ultrasonic Thickness Meter
Multigauge 5600
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On screen user information such as probe frequency and remaining battery. Colour LCD display. Easy to use keypad and menu system.
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Contactless Wafer Gauge for Resistivity, Thickness
MX 60x
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The MX60x series measure Resistivity or Sheet Resistance of silicon and other materials.
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ITA, G10, 10 Module, 0.5" Standard thickness
410104123
ITA
ITA, G10, 10 Module, 0.5" Standard ThicknessUses VPC 90 Series Modules.
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ITA, G10, 10 Module, 0.88" Thickness
410104375
ITA
ITA, G10, 10 Module, 0.88" ThicknessCompatible with VPC 90-Series modules.
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Digital Coating Thickness Gauges
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The Elcometer range of digital coating thickness gauges has been specifically designed to provide highly accurate, reliable and repeatable coating thickness measurements on almost any substrate, whether ferrous or non-ferrous. Dry Film Thickness can be measured on either magnetic steel surfaces or non-magnetic metal surfaces such as stainless steel or aluminium using a digital coating thickness gauge. The principle of electromagnetic induction is used for non-magnetic coatings on magnetic substrates such as steel. The eddy current principle is used for non-conductive coatings on non-ferrous metals substrates.
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Coating Thickness Meters
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PCE Instruments' accurate, affordable coating thickness gauge, thickness meter, surface testing and film gauge devices are used for material testing, manufacturing quality control and automotive paint inspection applications. Choose from a variety of coating thickness gauge, mil gage or paint meter products used for the non-destructive measurement of nonmagnetic coating, insulating layer and dry film thickness (DFT) on ferrous and / or non-ferrous metal substrates such as steel and aluminum.
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Wafer Flatness Measurement System
FLA-200
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*Measures Thickness, TTV, Bow, Warp and site and global Flatness (ASTM compliance)*Measures all materials including Si, GaAs, Ge, InP, SiC*Full 500 micron thickness measurement range without re-*calibration2-D /3-D Mapping software
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ECHO 7 Ultrasonic Precision Thickness Gage
ECHO 7
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ECHO 7 represents our most advanced thickness gage ever. ECHO 7 offers a 3.5” high resolution sunlight readable color display with live A-Scan, use of a wide variety of contact, delay line and immersion probes from 1-20 Mhz as default and custom created and stored applications setups, B-Scan, datalogger with up to 32GB of SD card memory and interface to Microsoft excel. The ECHO 7 is available in 4 models including the ECHO 7, ECHO 7DL, ECHO 7W and ECHO 7DLW.
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Leather Thickness Gauge
Crockmeter UI-TX50
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Crockmeter (Crock Meter) is used to test color transfer of colored textile (leather, fabric and etc,) to other surface due to rubbing. It is test of colour fastness to rubbing, one of physical testing of textiles.
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Semiconductor Technology, Micro Scriber + Flatness, Bow, Warp, Curvature, Glass Thickness
FLATSCAN
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Optik Elektronik Gerätetechnik GmbH
Non contact automated 2D- or 3D measurement of warp, bow, slope and surface curvature with software module for calculation of thin film stress (wafer stress) of wafers and glass substrates.
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Wafer Chucks
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American Probe & Technologies, Inc.
High Performance Chuck for your needs Introducing the American Probe & Technologies’ HC-6000 series of thermal chucks,
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Thickness Gauge
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Hildebrand Prüf- und Meßtechnik GmbH
You can select a Thickness Gauge based on a specific standard, a specifiy material or foot diameter and weight/pressure.
