Wafer Thickness
See Also: Wafer, Wafer Failure Analysis, Wafer Edge, Wafer Resistivity, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Inspection, Four Point Probes
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Non Rotating Spindle Type Tooth Thickness Micrometer
Measures the "root tangent length" of gears. Compatible modules differ depending on the model.
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Wall Measurement Thickness Gauge Wall Thickness Test Instrument
HS160
Shenzhen Chuangxin Instruments Co., Ltd.
HS160 Wall measurement thickness gauge, wall thickness measuring equipment apply to measure the thickness of all kinds of material, through which the ultrasonic wave can propagate at a constant speed and can get reflection from the back. This instrument can be used for a variety of plate and all kinds of machining parts for accurate measurement. Another important function of this gauge is to monitor all kinds of pipelines and pressure vessels used in the production equipment, monitoring their degree of corroded thinning during the using process. It's widely used in petroleum, chemical industry, metallurgy, shipbuilding, aviation, aerospace and other fields.
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Terahertz Coating Thickness Analysis
TeraCota
TeraView presents a film thickness gauge designed for the automotive industry. The sensor can determine the individual thickness of multiple paint layers on both metallic and non-metallic substrates and offers significant benefits over existing techniques.
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Surveyor Datalogger Thickness Meter
Multigauge 5750
Has a choice of Multiple Echo, Echo to Echo or Single Echo to cover all requirements. Measurements can be stored on the gauge and wirelessly transferred to the PC.
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Semiconductor Wafer Defect Inspection Management Software
ProcessGuard
Microtronic ProcessGUARD Software is the desktop client for the EagleView auto macro wafer defect inspection system. ProcessGUARD is a high volume, high speed semiconductor wafer defect inspection management solution that provides an easy-to-use, customizable and extensible platform and interface to automate your fabs defect inspection process. ProcessGUARD is feature rich (see below) and its newest releases include complete wafer randomization software, a user-defined defect library, and an integrated trainer and knowledge base.
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Wafer Chip Inspection System
7940
Chroma 7940 wafer chip inspection system is an automated inspection system for postdiced wafer chip inspection.
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Coating Thickness Meter for Ferrous and Non-Ferrous Substrates
CM8829
- Operating principle: magnetic induction/eddy current (F/NF)- Measuring range:0-1250um/0-50mil- Resolution; 0.1/1- Accuracy: 閸?-3%n or 閸?.5um- Min. measuring area: 6mm- Min. sample thickness: 0.3mm- Battery indicator: low battery indicator- Metric/ imperial: convertible- Power supply: 4x1.5V AAA(UM-4)battery- Auto power off- Operating conditions:0-+45闁?/span>(32闁?/span>-104闁?/span>),闁?0%RH- Dimensions: 126x65x27mm- weight: 81g(not including battery)- Optional accessories: other range 0-200um to 15000um
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Surface Thickness Gauges
The Cygnus range of ultrasonic surface thickness gauges are non-destructive testing (NDT) instruments that enable an accurate metal thickness measurement to be obtained from one side only, without the removal of protective coatings or damage to test materials.
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Ultrasonic Thickness Gauge
27MG
The Olympus 27MG is an affordable ultrasonic thickness gauge designed to make accurate, measurements from one side on internally corroded or eroded metal pipes, tanks, and other equipment. It weighs only 12 oz. (340 g) and is ergonomically designed for easy, one-hand operation. Despite its compact size, the 27MG has many innovative measurement features utilizing the same technologies that are available on our more advanced thickness gauges.
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Flaw Detector & Thickness Gauge
DFX-8+
Measurement Gates: Two independent gates (Flaw), and three gates (thickness). Start & width adjustable over full range. Amplitude 5-95%, 1% steps. Positive or negative triggering for each gate with audible and visual alarms.
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Inline Wafer Electrical quality Inspection
ILS-W2
the Ultimate Wafer Electrical Quality Inspection Unit for Wafer Inspection Systems
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Thick Film Bleeder
GBR-350
GBR-350 series resistors are made in a thick film technology, on ceramic substrates (Al2O3 - 96%). High voltage resistors have an application as bleeders, which have a task to unload electric charge after disconnection of supply voltage.
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Thickness Gauge
Multigauge 5300 GRP
Designed to check the condition of Glass Reinforced Plastic (GRP) or Engineering Plastics. It can also be used on uncoated metal
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Thick Film Bleeder
GBR-351
GBR-351 series resistors are made in a thick film technology, on ceramic substrates (Al2O3 - 965). High voltage resistors have an application as bleeders, which have a task to unload electric charge after disconnection of supply voltage.
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Wafer & Die Inspection
SemiProbe wafer inspection system (WIS) examines, locates and identifies defects created during wafer manufacturing, probing, bumping, dicing or general handling. This provides microelectronic device manufacturers with accurate, timely quality assurance and process information. The WIS has single sided and double sided wafer mapping capabilities and can improve efficiency, reduce manufacturing costs, increase yields and shorten time to market.
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Epi Thickness & Composition System
Element
The Element system is the tool of record for wafer suppliers for high speed impurity mapping and epi thickness measurement. It is the only tool on the market with the unique combination of transmission and reflection based technology. This system is the industry standard for dielectric monitoring.
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Thickness and Flaw Inspection
MultiScan MS5800
Eddy current testing is a noncontact method used to inspect nonferromagnetic tubing. This technique is suitable for detecting and sizing metal discontinuities such as corrosion, erosion, wear, pitting, baffle cuts, wall loss, and cracks in nonferrous materials.
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Ultrasonic Thickness Gauge
TI-45 Series
You can instantly measure the thickness of a material simply by positioning a probe. This innovative gauge is widely used and is capable of measuring a variety of materials including iron, stainless steel, glass and ceramics.
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Thickness Tester
Shenzhen UYIGAO Electronic Technology Co., Ltd
The coating thickness gauge is designed for non-destructive, fast and precise coating thickness measurement.
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Wafer Prober Networking System
PN-300
The Wafer Prober Networking System PN-300 utilizes a database to facilitate data access from other systems and provides an environment that enables the user to edit data and handle processing. The system achieves wide-ranging compatibility by adopting standard hardware and operating system. In addition, it is equipped with an N-PAF (Network-based Prober Advanced Function) to provide robust support for wafer prober operation and maintenance.
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Coating Thickness Gauge
Dalian Taijia Technology Co.,Ltd
In built probe(s)● Operating principle: magnetic induction/eddy current (F/NF)● Measuring range:0-1250um/0-50mil● Resolution; 0.1/1● Accuracy: ±1-3%n or ±2.5um● Min. measuring area: 6mm● Min. sample thickness: 0.3mm● Battery indicator: low battery indicator● Metric/ imperial: convertible● Power supply: 4x1.5V AAA(UM-4)battery● Auto power off● Operating conditions:0-+45℃(32℉-104℉),≤90%RH● Dimensions: 126x65x27mm● Weight: 81g(not including battery)● Optional accessories:● other range 0-200um to 15000um● RS-232C cable & software: 1.USB adaptor for RS-232C 2.Bluetooth interface
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Thickness Gauges
Precision Thickness Gauge is specifically designed to quickly and accurately measure the thickness of a variety of substrates including film, paper, board, foil, tissue and textiles.Operated via an intuitive touch screen interface the instrument will allow the user to define batch size, dwell time & measuring speed.Full test statistics can be easily viewed or printed to label for easy documentation control.
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Photonics Wafer Probing Test System
58635
The advancement of the photonics device technology continues to enable broader and more demanding applications in the industry.
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Ultrasonic Thickness Gauge
MMX-6
The MMX-6 is a simple to use hand-held Ultrasonic Thickness Gauge with the ability to measure through paint and coatings and eliminate the thickness of the paint or coating. The MMX-6 uses a dual element style transducer. With the single press of a button, the MMX-6 can be switched between pit or flaw mode ( pulse-echo), and through paint/coatings mode (echo-echo) for maximum inspection efficiency. The MMX-6 is equipped with a bundle of features to make your job easier: Alarm mode, high speed scanning, and data send are the main features of the MMX-6. The MMX-6 comes as a complete kit, ready to use, and is backed by Dakota Ultrasonics 5 year limited warranty.
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Wafer Auto Line Integration
The line is used for semiconductor wafer grinding. It carries out material matching and distribution, automatic loading and unloading, auto focusing and positioning and many other functions. The grinding precision is 2μm(3-sigma). It is also capable of collecting and analyzing real-time production data and interfacing with MES system.
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Instruments for Coating Thickness Measurement
Instruments for Coating Thickness Measurement according to the Coulometric Method by anodic dissolution (DIN EN ISO 2177). For electroplated coatings like tin, zinc, nickel, chromium, copper, brass, silver, gold can on metals or non-metals.
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ECHO 7 Ultrasonic Precision Thickness Gage
ECHO 7
ECHO 7 represents our most advanced thickness gage ever. ECHO 7 offers a 3.5” high resolution sunlight readable color display with live A-Scan, use of a wide variety of contact, delay line and immersion probes from 1-20 Mhz as default and custom created and stored applications setups, B-Scan, datalogger with up to 32GB of SD card memory and interface to Microsoft excel. The ECHO 7 is available in 4 models including the ECHO 7, ECHO 7DL, ECHO 7W and ECHO 7DLW.
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Batch Wafer Transfer Tools
Dou Yee Enterprises (S) Pte Ltd
Dou Yee Enterprises Batch Wafer Transfer Tools
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Wafer Flatness Measurement System
FLA-200
*Measures Thickness, TTV, Bow, Warp and site and global Flatness (ASTM compliance)*Measures all materials including Si, GaAs, Ge, InP, SiC*Full 500 micron thickness measurement range without re-*calibration2-D /3-D Mapping software
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ECHO 9 Advanced Corrosion Thickness Gages
ECHO 9
ECHO 9 offers a 3.5” high resolution sunlight readable color display with live A-Scan, echo to echo to ignore coatings, B-Scan, datalogger with up to 32GB of SD card memory and interface to Microsoft excel. The ECHO 9 is available in 4 models including the ECHO 9, ECHO 9DL, ECHO 9W and ECHO 9DLW.
