Wafer Thickness
See Also: Wafer, Wafer Failure Analysis, Wafer Edge, Wafer Resistivity, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Inspection, Four Point Probes
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WAFER MVM-SEM
E3300 Family
The E3310 is a WAFER MVM-SEM* for next generation wafers, supporting 1Xnm node process development and volume production at the 22nm node and beyond. With its high-speed carrier system employing a dual arm vacuum robot, and low-vibration platform to improve measurement accuracy, the E3310 delivers high throughput and performance for wafer measurements. Its multi detector configuration and unique 3D measurement algorithm also enable stable, high-accuracy measurement of 3D transistor technologies such as FinFET. The E3310 makes a significant contribution to reducing process development turnaround time and improves productivity for next-generation devices.
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Industrial Protective Coating Thickness Gauge
456 IPC
The Elcometer 456 Industrial Protective Coating Thickness Gauge1 is designed to measure dry film thickness on shot or grit blasted steel substrates.
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Flatness, Bow, Warp, Curvature, Glass Thickness
1D-glass Thickness Profile Measuring Instrument GPM2
Optik Elektronik Gerätetechnik GmbH
Highly accurate automatic measurement of glass thickness distributions. The glass thickness profiler GPM has the function to execute a fast and precise determination of the thickness profile of flat glass samples or another transparent material with a thickness range from 30µm to 700µm (option with sensor type 1) and width to 1200mm. The measuring point distance of the profile measurement can be varied over a micro-step-controlled positioning steering between 0.1mm and 1mm. The measured value accommodation for a scanning point takes place with the help of a special hardware module for image processing algorithms within 40 ms. The entire measuring time for a sample results thus as product from the sample width which has to be measured, the measuring point distance and the measuring time per measuring point.
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Production Wafer Level Burn-in
TV19 VersaTile™ probe cards are designed with Celadon’s patented ceramic technology for superior electrical performance, yet is highly modular due to it’s 28mm x 28mm chassis. Micro-adjustments can be made in seconds with an allen wrench and a microscope. Easily align VersaTile cards for different wafer layouts using a 4.5” compatible 1×3 , 200mm, or 300mm VersAdjust plate.
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Compact Coating Thickness Gauges
MP0R-FP Series
Compact pocket coating thickness gauges with connected cable probe and PC-interface for a convenient, fast and nondestructive coating thickness measurement on virtually all metals
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Handheld Digital Thickness Gauges
HC-210
Shenzhen Chuangxin Instruments Co., Ltd.
HC series of coating thickness gauge is a portable thickness gauge with eddy current thickness method and electromagnetic thickness method. It can be used to quickly and accurately measure the thickness of coating or cladding material without damaging it. As an essential instrument for professional material protection, this coating thickness gauge is widely used in manufacturing industry, metal processing industry, chemical industry and commodities inspection etc., both in the laboratory and in the engineering field. It can measure the thickness of nonmagnetic layer on magnetic metal substrate condition (such as steel, iron, alloy and hard magnetic steel, etc.) and the thickness of conductive layer on nonmagnetic metal substrate condition (such as rubber, paint, plastic, anodic oxidation film, etc.).
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WAFER MVM-SEM® E3300 Series
E3310
The E3310 is a WAFER MVM-SEM®* for next generation wafers, supporting 1Xnm node process development and volume production at the 22nm node and beyond. With its high-speed carrier system employing a dual arm vacuum robot, and low-vibration platform to improve measurement accuracy, the E3310 delivers high throughput and performance for wafer measurements. Its multi detector configuration and unique 3D measurement algorithm also enable stable, high-accuracy measurement of 3D transistor technologies such as FinFET. The E3310 makes a significant contribution to reducing process development turnaround time and improves productivity for next-generation devices.
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Concrete Coating Thickness Gauge
500
The Elcometer 500 Coating Thickness Gauge accurately measures the thickness of coatings on concrete and other similar substrates* - non destructively.
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Stand Alone Wafer Sorter
MicroSORT
The Microtronic MicroSORT semiconductor wafer sorter is designed to maximize throughput while minimizing wafer handling in a user-friendly operating environment. This stand-alone semiconductor wafer sorter enables sophisticated semiconductor wafer sorter routines for up to 4 wafer-cassette platforms. MicroSORT semiconductor wafer sorter reads OCR scribes from the top, bottom, or simultaneously, allowing for enhanced semiconductor wafer tracking and sorting. The MicroSORT semiconductor wafer sorter’s basic functions include the ability to move, compress, randomize, find, align, verify, and split semiconductor wafer lots. With our virtual tweezer mode, an operator can click on wafer icons to move wafers between cassettes, read semiconductor wafers, and swap wafer positions.
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Thick Film Passive Element
GBR-250
GBR-250 series high voltage resistors are made in a thick film technology on ceramic substrates (Al2O3 96%). These elements are used in high voltage applications.
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Underwater Thickness Gauge
Multigauge 4000
The Multigauge 4100 and 4400 ROV Underwater Thickness Gauges mount onto most types ROV. There are two models in the range, the Multigauge 4100 which has a depth rating of 1000m and the Titanium Multigauge 4400 which has a depth rating of 4000m.
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Electrostatic Capacitance-Type Non-Contact Thickness Meter
CL-5610 series
The CL-5610/5610S is used to perform non-contact thickness measurement of objects under measurement including conductors, semiconductors and insulators in combination with the new-developed VE series capacitance type gap detector. The CL-5610/5610S can be connected up to 2 gap detectors and also used as 2-ch displacement meter.
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Layer Thickness Meter
CHY 113
It is usded to measure the thickness of metallic coatings (eg paint) only on substrates with ferromagnetic alloys (eg steel). The meter is designed to provide easy operation in one hand.
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Semiconductor Wafer Microscope Inspection System
MicroINSPECT
MicroINSPECT Semiconductor Wafer Defect Microscope Inspection System combines state-of-the-art robotics, intelligent microscopes and SITEview software to provide a flexible, easy-to-operate defect inspection platform for either micro or macro defect wafer inspection.
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Thickness Measurement
Thickness Tester is a high precision mechanical contact method thickness tester, which can be used to thickness measurement of films, sheeting, paper, corrugated paperboard, textiles, non-woven fabrics, and solid insulation materials, etc.
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Coating Thickness Gauge
Meter MEGA-CHECK -Basic
The new generation of MEGA-CHECK devices first used probes in which an own microcontroller, the analog sensor signals are digitized to the device outputs. This new technique is extremely trouble-free and even allows accurate and repeatable readings. The probe cable is both sides (control unit and probe) and therefore particularly service-friendly, as if a cable breaks, the device must not be returned, but only the cable is replaced. The units are equipped with a large, clear and illuminated graphic display. A variety of Fe, ferrous and dual
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Thickness Gauges
Our digital thickness gauges offer a range of features for advanced performance. Explore different options to suit your application needs, from simple handheld gauges to advanced models. All Olympus ultrasonic thickness gauges can measure thickness from one side of a part.
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Wafer Probe Loadboards/PIB
DTS has a full line of standard PIBs for all major tester platforms. Custom PIB designs can accommodate any test head, prober and manipulator configuration, including probe card changers, overhead direct dock setups and cable interfaces. DTS wafer test loadboards are compatible with a variety of pogo pin interface towers. All PIBs are constructed with impedance control, precision matched line lengths, full power and ground planes and both analog and digital resources to provide high quality signal integrity directly to the device.
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Wafer Inspection System
JRT Photovoltaics GmbH & Co. KG
In close cooperation with well-known providers of inspection systems, we provide modular systems for quality control and classification of raw wafers.
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Wafer Chucks
ARC, in addition to fabricating Wafer Chucks from aluminum, is also known for its ability to work in hard to machine materials such as hardened (50-62 Rockwell) metal alloys, fired ceramics, e.g. SiC and glasses. These materials are often ideal for semiconductor equipment applications due to their ability to hold critical dimensions and tolerances. ARC specializes in surface grinding and lapping these materials to precision flatness and parallelism specifications needed for semiconductor wafer chuck requirements.
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Wafer and Cells PL System
HS-PL
Photoluminescence (PL) Imaging is a unique non-invasive inspection tool as it can be used in-line at many different steps of the cell manufacturing process. This facilitates the direct comparison of data obtained at one process step to data obtained at another. Additionally, PL imaging can be compared to electroluminescence (EL) imaging on finished cells using comparable equipment.
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Thickness Gauge
EV 01
EV 01 Thickness gauge series are special thickness gauges, with the possibility of many different applications, measuring foot and table.
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Coating Thickness Meter for Automobiles - Ferrous and Non-Ferrous Substrates
CM8828FN
- Operating principle: magnetic induction/eddy current (F/NF)- Measuring range:0-1250um/0-50mil- Resolution; 0.1/1- Accuracy: 卤1-3%n or 卤2.5um- Min. measuring area: 6mm - Min. sample thickness: 0.3mm- Battery indicator: low battery indicator- Metric/ imperial: convertible- Power supply: 4x1.5V AAA(UM-4)battery- Auto power off- Operating conditions:0-+45鈩?/span>(32鈩?/span>-104鈩?/span>),鈮?0%RH- Dimensions: 126x65x27mm- weight: 81g(not including battery)- Optional accessories: other range 0-200um to 15000um
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Non-contact Film Thickness Measurement
ALTO-IRT-7000
ALTO-IRT-7000 (IMPEDANCE RESONANCE TECHNOLOGY ) FILM THICKNESS METROLOGY TOOL UTILIZES NON-CONTACT CAPACITIVE AND EDDY CURRENT TECHNOLOGY TO ANALYZE MICRO SECTORS ON COATED SURFACES THAT ARE 1000 TIMES SMALLER THAN ANY COMPARABLE EDDY CURRENT PRODUCTS. BUT MOST IMPORTANTLY, THIS UNIQUE IRT TECHNOLOGY ALLOWS FOR SOPHISTICATED ANALYSES OF THE CONTINUOUS AND DISCRETE FILMS BELOW 50 ANGSTROMS, DRAMATICALLY IMPROVING THE ACCURACY OF QUALITY CONTROL READINGS.
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Optics Test Equipment + Flatness, Bow, Warp, Curvature, Glass Thickness
Wedge Angle Scanner For Car Windshields
Optik Elektronik Gerätetechnik GmbH
Scanning of complete car windshields for measurement of wedge angle and thickness distribution, in particular in the HUD area.
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Flaw Detector & Thickness Gauge
DFX-7+
Measurement Gates: Two independent gates (Flaw), and three gates (thickness). Start & width adjustable over full range. Amplitude 5-95%, 1% steps. Positive or negative triggering for each gate with audible and visual alarms.
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Benchtop Unit for Universal Coating Thickness Measurement
FISCHERSCOPE MMS PC2
Multifaceted for coating thickness measurement and material testing. Universal multi-measuring system for parallel coating thickness measurement and material testing with up to eight measuring modules.
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Inline OEM High Resolution Thickness & Resistivity Module for PV / Solar Sorters
MX 152
To allow three thickness scans during belt transport at different wafer sizes, two measuring bars, one from top and one from bottom, hold 3 sensors each.
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ITA, G10, 10 Module, 0.5" Standard thickness
410104123
ITA, G10, 10 Module, 0.5" Standard ThicknessUses VPC 90 Series Modules.
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ECHO 8 Ultrasonic Corrosion and Precision Thickness Gage
ECHO 8
Danatronics offers our newest ultrasonic precision thickness gage line, the ECHO 8 series. ECHO 8 represents our most advanced thickness gage ever combining dual and single element transducers all in one small package. ECHO 8 offers a 3.5” high resolution sunlight readable color display with live A-Scan, use of a wide variety of dual, contact, delay line and immersion transducers from 1-20 Mhz as default and custom created and stored applications setups, B-Scan, datalogger with up to 32GB of SD card memory and interface to Microsoft excel. The ECHO 8 is available in 4 models including the ECHO 8, ECHO 8DL, ECHO 8W and ECHO 8DLW. The vibrate on alarm feature is the world’s first and is great for loud environments
