Wafer Thickness
See Also: Wafer, Wafer Failure Analysis, Wafer Edge, Wafer Resistivity, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Inspection, Four Point Probes
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Ultrasonic Wall Thickness Measurement Meters
The LaserLinc UltraGauge+™ series of ultrasonic meters and gauges measure wall thickness, layer thickness, and concentricity of plastic, rubber, glass, and metal products. Typical applications include tubing, hose, pipe, insulated wire, cable, and certain multi-layer products.
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Ambient Temperature Vacuum Wafer Chucks
6" (152mm) Vacuum Wafer Chuck for General Purpose Ambient Temperature testing with a Stainless Steel vacuum wafer surface
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EHC-09 Ultrasonic Corrosion Thickness Gage - Monochrome
EHC-09
Danatronics most popular thickness gages are those in our EHC-09 series. With thousands of units in the field, our durable, custom molded case with raise rubber keypad is IP54 rated and has proven it can handle your toughest jobs (this is bad help fix). The EHC-09 series is available in 6 models to suit every budget and application. What’s best is our simple upgrade path where all gages are capable of quickly and easily (directly from the keypad) adding any software options. Features include a graphic display with multiple languages, vibrate on alarm, fast minimum, echo to echo to ignore coatings, 100K reading Datalogger with export to excel, B-scan and live A-scan with waveform adjust.
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Wafer Testing
Trio Vertical
SV TCL's TrioTM is a reliable solution for advanced wafer testing challenges, specifically full array and parallel probing. We offer a complete line of vertical probe card products, each designed for your unique application.
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Wafer Test
Silicon Turnkey Solution, Inc.
Most foundries provide wafers already probed to a set of DC parameters at room temperature to ensure they meet a basic subset of the package-part specification. Beyond this basic set of tests, more rigorous testing is often needed to meet specifications requiring die to be 100 percent probed, identify and segregate devices with higher performance levels and guarantee that parts will perform to a certain specification level.
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Passive and Active Resistor Trimming for Thick and Thin Film
LRT 2000L
*Travel: 6" x 6"*Laser : Fiber Laser Ytterbium 1064 nm*Kerf: 30 to 80 micron Adjustable*Pulse width : 80 nano second*Rap Rate: 1 to 1 million Pulse Per Second*Average Power: 20 watts*Target: Electric crosshair on monitor
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Automated Semiconductor Wafer Optical Inspection and Metrology
SITEview Software
Microtronic SITEview Software is designed from the end-user operator’s perspective and is easy to use, fully featured, and modular. Applications include visual wafer inspection, OCR sorting, wafer defect review, second optical inspection, image storage and retrieval, laser marking, microscope interface, and GEM/SECS II communication and seamlessly integrates with EAGLEview, MicroINSPECT and MicroSORT.
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Precision Thick Film Chip Resistors
Panasonic Industrial Devices Sales Company of America
An AEC-Q200 Compliant SeriesPanasonic components specified as AEC-Q200 Compliant are consistently designed into automotive systems. However, today’s Design Engineers are specifying AEC-Q200 components to meet the high-quality standards of devices beyond automotive applications.
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Wafer Manufacturing
Scientific Computing International
A procedure composed of many repeated sequential processes to produce complete electrical or photonic circuits on semiconductor wafers in semiconductor device fabrication process.
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Wafer ESD Tester lineup
Hanwa Electronic Ind. Co.,Ltd.
◆Correspond to 300mm Wafer. This tester can measure LED or the large sizes Wafer, such as a system LSI. And Zap of HBM/MM can be performed. The Automatic destructive judging by V/I measurement can also be performed after Zap.◆Waveform guarantee in Zap needles. HED-W5100D carries out the calibration before shipment in the place of Zap needles. Therefore, Correlation of the Result of a Package Device becomes clear easily.◆Correspondence to Standards This Tester corresponds to the Standard of JEITA, ESDA, and JEDEC. A Zap unit adopts the plug-in system and also has the waveform of Customer's requests.◆Connection with TLP This Tester is the best for TLP Testing with deep relation of ESD. The protection circuit of a device with an ESD problem is investigated.
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Coating Thickness Gauge for Ferrous and Non-Ferrous Materials
CM8856
* It meets the standards of both ISO2178 and ISO 2361 as well as DIN, ASTM and BS. It can be used both in the laboratory and in harsh field conditions.* The F probes measure the thickness of non-magnetic materials (e.g. paint,plastic, porcelain enamel, copper, zinc,aluminum , chrome etc.) on magnetic materials (e.g. iron, nickel etc.) . often used to measure the thickness ofgalvanizing layer, lacquer layer, porcelain enamel layer, phosphide layer, copper tile, aluminum tile, somealloy tile, paper etc.The N probes measure the thickness of non - magnetic coatings on non-magnetic metals .It is used on anodizing, varnish, paint, enamel,plastic coatings, powder, etc. appliedto aluminum, brass, non-magnetic stainless steel, etc.* Automatic substrate recognition.* Manual or automatic shut down.* Two measurement mode: Single andContinuous* Wide measuring range and highresolution.* Metric/Imperial conversion.* Digital backlit display gives exactreading with no guessing or errors.* Can communicate with PC computerfor statistics and printing by theoptional cable.* Can store 99 groups of measurements.* Statistics is available.2.SPECIFICATIONSDisplay: 4 digits LCD, backlitRange: 0~1250 μm/0~50mil(other ranges can be specified )Min.radius workpiece: F: Convex 1.5mm/Concave 25mmN: Convex 3mm/ Concave 50mmMin. measuring area: 6mmMin.Sample thickness : 0.3mmResolution: 0.1 μm (0~99.9μm);1 μm (over 100μm)Accuracy: ±1~3%n or 2.5 μm or 0.1mil(Whichever is the greater)Bttery Indicator: Low batter indicator.PC interface: with RS-232C interfacePower supply: 2x1.5 AAA(UM-4) batteryOperating condition: Temp. 0~50℃ .Humidity <95% .Size: 126x65x35 mm; 5.0x2.6x1.6 inchWeight: about 81g(not including batteries)Standard accessories:Carrying case ...................1 pc.Operation manual ............ 1 pc.F probe in built .................1 pc.NF probe in built...............1 pc.Calibration foils ..............1set.Substrate (Iron) ................1 pc.Substrate (Aluminium)......1 pc.Optional accessories: RS-232C cable & software:1.USB adaptor for RS-232C2.Bluetooth interface
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Coating thickness XRF Standards
We manufacture high accuracy reference standards capable of calibrating virtually any X-Ray Fluorescence (XRF) coating thickness and composition analysis system.
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Thick Film Divider
GBR-391
GBR-391 series high-voltage resistive dividers are made in a thick film technology on ceramic substrates (Al2O3 - 96%) with leads for through-hole mounting. Dividers are characterized by very high maximum voltage, and standard voltage division.
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Non-contact Measurement Wafer Sorting System (Robot Hand Tranceportation)
NC-3000R
*High accuracy measurement system for large diameter wafer*Non-contact measurement of resistivity, thickness and conductivity (P/N)*Compact design of Two-stage by measuring area and transfer area*Number of cassette station can be changed by customers request Option : Add wafer flattness measurement system(FLA-200)
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Coating Thickness Meter for Ferrous and Non-Ferrous Substrates
CM8822
- Operating principle: magnetic induction/eddy current (F/NF)- Measuring range:0-1000um- Resolution; 0.1/1- Accuracy: 卤1-3%n or 卤2.5um- Min. measuring area: 6mm- Min. sample thickness: 0.3mm - Battery indicator: low battery indicator- Metric/ imperial: convertible- Power supply: 4x1.5V AA(UM-3)battery- Auto power off- Operating conditions:0-+45鈩?/span>(32鈩?/span>-104鈩?/span>),鈮?0%RH- Dimensions: 160x68x32mm- weight: 250g(not including battery)- Optional accessories: other range 0-200um to 15000um
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Wafer Inspection System
AutoWafer Pro™
AutoWafer pro is our most advanced ultrasonic equipment for detecting defects in bonded wafers in a production environment, providing fast, high-resolution scanning of 200mm and 300mm bonded wafers.
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Film and Paper Thickness Gauges
Economical, Accurate, Easy-to-Operate, our line of off-line paper / film thickness gauges are manufactured to meet TAPPI specifications for paper or ASTM specifications for film.
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Coating Thickness Measurement
The Calotest instruments from Anton Paar provide quick, simple and inexpensive determination of coating thicknesses. Employing the simple ball-cratering method, the thickness of any kind of single or multi-layered coating stack is accurately checked in a short time, in full compliance with relevant international standards.
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Hall Effect Thickness Gage
Magna-Mike 8600
The Magna-Mike® 8600 is a portable thickness gage that uses a simple magnetic method to make reliable and repeatable measurements on nonferrous materials. Operation of the Magna-Mike is very simple. Measurements are made when its magnetic probe is held or scanned on one side of the test material and a small target ball (or disk or wire) is placed on the opposite side or dropped inside a container.
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Paper Thickness Tester
DRK107B
Shandong Drick Instruments Co., Ltd.
DRK107B Paper Thickness Tester is applied to testing the thickness of paper specimens.
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Ultrasonic Material Thickness Gauges
MTG
The Elcometer Ultrasonic Material Thickness Gauges have all the features and functionality necessary for measuring material thickness and velocity on virtually any material - for a wide range of applications.
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Full Wafer Test System
FOX-1P
Enables High Throughput, Single Touchdown, Full Wafer Production Testing. Capable of simultaneously testing up to 16,000 die in a single wafer touchdown. Resource configurable up to 16,384 " Universal Channels " - each programmable as anI/O, Clock, Pin Parametric Measurement Unit ( PPMU ) or Device Power Supply ( DPS ). Software-enabled per site flexibility to support small and large device pin count test needs. Comprehensive functional and parametric test capabilities Deep functional pattern data and capture memory optimized for BIST/DFT testing. Per channel PMU for per site parametric testing Individual channel over-current protection to protect wafers and probe cards. Configured for high volume production. Compatible with industry standard probers and probe cards. Available as an integrated test cell with prober, probe cards and 16,384 channel probe I/F. Configurable as a single or dual system integrated test cell.
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LED Type Wafer Alignment Sensor Controller
HD-T1
Panasonic Industrial Devices Sales Company of America
The HD-T1 Series is a new Wafer Alignment Sensor that uses a safe red LED light beam, with a resolution of 30µm, to achieve the same high level performance as Laser Sensors. The HD-T1 Sensor is best suited to detect wafer eccentricity, notches and orientation flats. Using linear image Sensor methodology and high-speed sampling technology, a wide variety of objects can now be stably measured with great precision at ultra-high speeds. This CCD style Sensor is developed for use in almost all fields of industry, e.g. tire manufacturing or Semiconductor production (Wafer Printed Circuit Boards).
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Ultrasonic Wafer Scanner
AutoWafer
Installed in more wafer applications than all other automatic ultrasonic testing tools combined, AutoWafer provides a complete, production-ready wafer scanner for wafers from 100mm to 200mm, including multiple sizes in a single batch.
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In-Line Wafer Surface Defect Inspection
ALTO-SD-150/200
ALTO-SD SERIES IS AN IN-LINE INSPECTION SYSTEM SUPPLYING HIGH THROUGHPUT, FULL SURFACE DEFECT INSPECTION FOR ALL KINDS OF WAFERS INCLUDING SILICON, QUARTZ, SAPPHIRE, COMPOUND AND MEMS WAFERS. HIGH-RESOLUTION CAMERA OPTICS PLUS LED ILLUMINATION GUARANTEE RELIABLE DETECTION OF ALL LOCAL DEFECTS. IT INSPECTS DEFECT SIZE OF 1~ 10 MICRONS, CONFIGURABLE INSPECTION RESOLUTION TO OPTIMIZE DEFECT SIZE VS. THROUGHPUT. THE SYSTEM COMBINES HIGH-PRECISION MEASUREMENT, POWERFUL DATA ANALYSIS AND USER-FRIENDLY OPERATIONS.
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Semiconductor Technology, Micro Scriber + Flatness, Bow, Warp, Curvature, Glass Thickness
FLATSCAN
Optik Elektronik Gerätetechnik GmbH
Non contact automated 2D- or 3D measurement of warp, bow, slope and surface curvature with software module for calculation of thin film stress (wafer stress) of wafers and glass substrates.
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Digital Coating Thickness Gauges
The Elcometer range of digital coating thickness gauges has been specifically designed to provide highly accurate, reliable and repeatable coating thickness measurements on almost any substrate, whether ferrous or non-ferrous. Dry Film Thickness can be measured on either magnetic steel surfaces or non-magnetic metal surfaces such as stainless steel or aluminium using a digital coating thickness gauge. The principle of electromagnetic induction is used for non-magnetic coatings on magnetic substrates such as steel. The eddy current principle is used for non-conductive coatings on non-ferrous metals substrates.
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Wafer Edge Profile Measurement
WATOM
WATOM can carry out fully automatic, non-contact measurements of the edge profiles and diameter in accordance with SEMICON standards. A special feature is the system's ability to make measurements of the mark cut into the edge of the wafer to indicate the crystal orientation. Because of its high measurement accuracy of less than 1.5 µm, leading wafer manufacturers across the world use WATOM for shop-floor geometrical quality control.
