Wafer Edge
See Also: Wafer, Wafer Thickness, Wafer Failure Analysis, Wafer Resistivity, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Inspection
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Product
Wafer Edge Profile Measurement
WATOM
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WATOM can carry out fully automatic, non-contact measurements of the edge profiles and diameter in accordance with SEMICON standards. A special feature is the system's ability to make measurements of the mark cut into the edge of the wafer to indicate the crystal orientation. Because of its high measurement accuracy of less than 1.5 µm, leading wafer manufacturers across the world use WATOM for shop-floor geometrical quality control.
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Product
WATOM
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Wafer edge and notch profile measurementThe use of smaller and smaller patterns in the semiconductor industry calls for increasingly advanced materials of extremely high quality. In response to the steady improvements in the quality of wafers, KoCoS Automation has developed WATOM, a wafer edge and notch profile measurement tool which heralds a new era of extremely precise wafer geometry measurement.WATOM supports quality assurance throughout the wafer manufacturing process, starting at the very beginning and continuing on through to wafer reclaim.The WATOM Edge and Notch Wafer Geometry Analyser sets the worldwide benchmark for the quality assurance of geometrical measurements in semiconductor wafer manufacturing, combining the highest quality standards with top-class service. These high-precision, laser-based edge profile measurement tools are specially designed for optimum integration in manufacturing lines within the semiconductor industry.
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Product
High-Performance All-In-One Gateway For Battery Energy Storage Systems
ECU-1170
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Quad-core Cortex-A55 processor, 1.8GHzConnectivity: 4 GbE, 8 RS-232/485, 2 CAN, 1 mPCle and 1 M.2I/O: 20 DI, 6 DO, 8 Relay, 2 AIBattery-powered RTC, Watchdog, and optional TPM supportWide operating temperature range: -40~70°COptional 5 sec power backup with SupercapacitorSupports IEC 61850, IEC 104, DNP3, Modbus, MQTT, and OPC UAPreloaded with Yocto Linux and EdgeLink or Ubuntu Linux
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Product
Edge Gateway
EPC-R4710
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EPC-R4710 is an Arm based Box Computer powered by a high-performance Rockchip RK3399 ARM dual Cortex-A72 and quad Cortex-A53 high performance processor which supports 4K display from HDMI. It offers both rich display as dual HDMI and rich IO as dual GbE/6serials/6USB/5GPIO. EPC-R4710 also features Mini-PCIe, M.2, and SIM card slots for integrating Wi-Fi, Bluetooth, and 3G/4G modules. It is an ideal solution for Kiosk, POS, and Vending machine application.
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Product
Ultra Slim Digital Signage
DS-015
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Power by Nvidia 6-core & 8-core Arm® Cortex-A78AE v8.2 64-bit. Multiple AI workloads up to 157 TOPS (INT8) Ultra-slim design with intelligent fan cooling. Connectivity: 3 × USB 3.2 Gen 1 ports, 1 × USB Type-C (for download mode only) Display & Camera Support: HDMI 4K@60 output and GMSL camera interfaces.
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Product
AI Inference System
MIC-741-AT
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AI Inference System Powered by NVIDIA® Jetson Thor™. Embedded with NVIDIA® Jetson T4000™ up to 1200 TFLOPS (FP4). Supports 1 x SFP28 (1 x 25GbE). Supports 2 x 1GbE, 2 x 10GbE4, 6 x USB 3.2 Gen 2, 2 x M.2 2280, 1 x M.2 Ekey (Support both WiFi AEKey), 1 x M.2 Bkey (LTE,5G).
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Product
1U 19” Edge Computing Platform with Intel® Xeon® D Processor
MECS-6120
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- 1x Intel® Xeon® D-17XX Series family processor- 3x DDR4-2666 RDIMM ECC REG up to 192GB- 2x 2.5” SATA bays and 2x M.2 M Key interfaces- 420mm depth 1U 19” rackmount form factor- Built-in Intel® QAT: SSL (20G), Compression (15G)- Intel® eASIC by card for FEC acceleration- EMC grade: Class B & Advanced chassis management, IPMI v2.0 compliant
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Product
Industrial IoT Edge Gateway
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Advantech IoT Edge Gateways help bridge data from edge devices to cloud, acting as protocol converters, data collectors, or data loggers.
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Product
Edge Gateway
EPC-R3220
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EPC-R3220 is a RISC-based box computer integrated with the TI Sitara AM3352 Cortex-A8 0.8GHz processor. It is designed for applications that require multiple connectivity points and low power consumption. The EPC-R3220 offers dual RS-232/485 serial ports with Modbus/OPC-UA protocol support for date collection, 6GPIOs for indication or device control, dual 10/100/1000 Ethernet ports, one wifi/BT onboard solution and one Mini-PCIE that can expand to an LTE solution. EPC-R3220 supports wide-ranging power input and temperature and supports both DIN-rail and wall mounting.
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Product
Edge AI HPC System
AIR-500D
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Edge AI HPC system powered by Intel® Xeon® D-1700 Series processors with support for up to 4 PCIe slots. Intel® Xeon® D-1700 series processor 4x DDR4 SO-DIMM sockets support ECC/nonECC memory up to 128GB.
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Product
NXP I.MX8MPlus Cortex-A53 Edge AI Box Computer
EPC-R3720
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NXP i.MX8M Plus Cortex-A53 Quad/Dual up to 1.8GHz.On-board LPDDR4 6 GB, 4000MT/s memory.HDMI up to 3840 x 2160 at 30Hz resolution.Dual GbE LAN, 1 USB2.0 and 1 USB 3.2 Gen 1.1 Micro SD Socket & 1 Nano SIM Slot.1 mini-PCIe for 3G/4G, 1 M.2 2230 Key E Slot.Supports Windows 10 IoT Enterprise on Arm, Yocto Linux and Android BSP.4 Kinds of Rear I/O for Each Vertical Focus: IEM, Self Service, Automation and Networking.
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Product
Compact Fanless System With Intel® Core™ Ultra 5/7/9 Processors (Series 2)
MIC-780
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Intel® Core™ Ultra 5/7/9 Processors (Series 2)CPU type: Socket (LGA1851)Chipset: Intel® W880/H810DDR5 Memory up to 128GB 6400MT/sMIC-780W: 3 x displays – 2 x HDMI/1 x DP, 4 x GbE LAN, 4 x USB 3.2 Gen2x1 (10G), 2 x COM, 1 x NVMe M.2 (PCIe Gen4 x4)MIC-780H: 3 x displays – 2 x HDMI/1 x DP, 2 x GbE LAN, 2 x USB 3.2 Gen 2x1 (10G), 2 x USB 3.2 Gen 1x1 (5G) , 2 x COM
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Product
Edge AI Inference System
AIR-120
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Edge AI inference system powered by Intel® Atom® processor with Hailo-8 AI acceleration module.
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Product
Edge AI Inference System
AIR-021
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Edge AI Inference system powered by NVIDIA® Jetson Orin™ NX/Nano and Super mode. Compact and high performance AI box. NVIDIA® Jetson Orin NX 16GB/8GB and Orin Nano 8GB Modules. 12~24V wide power and -20~50 °C (NX) -10~50°C (NANO) supported.
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Product
Edge Card Adapter, Universal, for .062 PCB
111107138
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VPC provides two types of Edge Card Adapter Kits for 10, 25 and 50 Module ITA Enclosures. Both kits are designed for various sized cards.The Universal Edge Card Adapter Kit’s card guides are hinged and can be folded for storage by releasing the holding latches on either side of the card.
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Product
Edge Gateway
EPC-R4760
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EPC-R4760 is an ARM based Box Computer powered by Qualcomm ARM® Cortex®-A53 APQ8016 processor that supports full HD display and intergrades on board wireless solution – Wi-Fi, BT and GPS. EPC-R4760 also features in mini PCIe, M.2, and SIM card slots for expanding connectivity capability, like 3G, 4G/LTE modules. Equipped with complete Android, Linux and Win10 IoT core BSPs, this box computer enables customers to easily develop unique application on specific OS.
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Product
Edge Gateway
EPC-R4680
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EPC-R4680 is an ARM based Box Computer powered by Rockchip ARM Cortex-A17 RK3288 Quad core high performance processor, which supports 4K display and 4Kx2K multiformat video decoding via HDMI. It also features M.2, Mini-PCIe and SIM card slots for WIFI, BT and 4G connectivity. EPC-R4680 also offers rich interfaces such as 6 USB2.0, 6 UART, 1 GbE and 8 GPIO. It is an ideal solution for Kiosk, Vending machine and Digital signage application.
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Product
Wafer Prober
Prexa
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The latest fully automated 300mm wafer prober. The system offers excellent productivity and advanced functions, contributing to KGD (known good die) testing for advanced packaging.
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Product
Wafer Test
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WinWay’s commitment to technology, quality and service ensures our interface solutions go above and beyond to exceed your expectations. Our products and services have a proven track record of delivering customer success in semiconductor testing. The Company offers comprehensive test interface solutions ranging from wafer-level test, package-level test to thermal management.
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Product
Wafer Manufacturing
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Scientific Computing International
A procedure composed of many repeated sequential processes to produce complete electrical or photonic circuits on semiconductor wafers in semiconductor device fabrication process.
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Product
Wafer Inspection System
AutoWafer Pro™
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AutoWafer pro is our most advanced ultrasonic equipment for detecting defects in bonded wafers in a production environment, providing fast, high-resolution scanning of 200mm and 300mm bonded wafers.
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Product
Edge Gateway
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The Edge Gateway provides a solution to manage distributed wireless sensors. On the one hand, new sensors can be added to the measurement systems easily and on the other hand, the gateway is powerful enough to evaluate the measurements and detect irregularities.
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Product
Edge Compute Solutions
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Innovate in real time. With the world’s largest serverless compute platform, Akamai puts your code closer to your users.
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Product
Wafer Test
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Silicon Turnkey Solution, Inc.
Most foundries provide wafers already probed to a set of DC parameters at room temperature to ensure they meet a basic subset of the package-part specification. Beyond this basic set of tests, more rigorous testing is often needed to meet specifications requiring die to be 100 percent probed, identify and segregate devices with higher performance levels and guarantee that parts will perform to a certain specification level.
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Product
Batch Wafer Transfer Tools
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Dou Yee Enterprises (S) Pte Ltd
Dou Yee Enterprises Batch Wafer Transfer Tools
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Product
Wafer Prober
Precio XL
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Fully automated 300mm wafer prober. The system achieves high productivity, excellent contact performance, improved cleanliness, and short lead time, and offers a number of high value-added functions as options.
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Product
Die-To-Wafer Bonding Systems
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Several different D2W bonding methods are available and selected depending upon the application and customer requirements. In direct placement D2W (DP-D2W) bonding, the singulated dies are bonded to the target wafer one by one using a pick-and-place flip-chip bonder. Plasma activation and cleaning of the surfaces of the dies on the handler wafer are essential steps for establishing a high-yielding bond and electrical interface between the dies and target wafer. This is where the EVG320 D2W activation system comes in.
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