Sonix Inc.
Sonix has pioneered many of the breakthroughs in defect detection and process productivity that have helped semiconductor manufacturers create a world of new possibilities.
- 703-440-0222
- info@sonix.com
- 8700 Morrissette Drive
Springfield, VA 22152
United States of America
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Product
Wafer Inspection System
AutoWafer Pro™
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AutoWafer pro is our most advanced ultrasonic equipment for detecting defects in bonded wafers in a production environment, providing fast, high-resolution scanning of 200mm and 300mm bonded wafers.
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Product
Ultrasonic Flaw Detector
ECHO
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The ECHO scanning acoustic microscope is a nondestructive ultrasonic flaw detector designed to simplify testing, increase yield and maximize productivity in the lab or on the production floor.
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Product
Wafer Inspection Products
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Sonix provides manual and automated wafer inspection and metrology systems for wafers ranging from 100mm to 300mm, with extensive analysis capabilities at both the wafer and device level. These industry-leading automated wafer inspection systems are used by the world’s top manufacturers to ensure quality from development through production.
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Product
EMC Testing EMCD
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Efficient and flexible EMC testing services for product CE marking, UKCA marking and demonstrating compliance with US FCC and Canadian ISED regulations. Our experienced engineers will guide you through the test process, helping you to save time, minimise project costs and get your product to market quickly.
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Product
Ultrasonic Wafer Scanner
AutoWafer
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Installed in more wafer applications than all other automatic ultrasonic testing tools combined, AutoWafer provides a complete, production-ready wafer scanner for wafers from 100mm to 200mm, including multiple sizes in a single batch.
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Product
Software Options
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Sonix offers powerful microscopy analysis software to enhance packaged semiconductor imaging, accelerate production and adapt systems based on the ECHO platform to customer-specific requirements.
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Product
Package Inspection Products
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Image quality. Speed. Uptime. They’re all crucial. Getting all three at the same time in a nondestructive testing (NDT) solution for package inspection is the challenge. It takes continuous innovation, advancing the state of the art to keep pace with the semiconductor industry’s own exponential progress.
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Product
ECHO VS System with Image Enhancement
Echo VS
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The ECHO VS system adds our Image Enhancement Suite to the ECHO platform to provide industry-leading image quality and defect identification capabilities. It’s our most accurate ultrasonic NDT equipment for development labs and for production environments that require the highest precision. The Echo system can be fitted with an optional chuck for manual wafer inspection.
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Product
Software Options
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Sonix offers powerful wafer software tools to enhance bonded wafer imaging, accelerate production and adapt AutoWafer and AutoWafer Pro to our customers’ specific requirements.
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Product
Ultrasonic Transducers
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Sonix S-series ultrasonic NDT transducers are designed in-house to meet the demanding nondestructive testing requirements of semiconductor manufacturing. We offer the collaborative expertise to help customers choose the best ultrasonic NDT transducer for their application, based on three primary considerations.
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Product
Scanning Acoustic Microscope
Echo
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The ECHO scanning acoustic microscope is a nondestructive ultrasonic flaw detector designed to simplify testing, increase yield and maximize productivity in the lab or on the production floor.
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Product
Scanning Acoustic Microscope
Pulse2
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This industry-leading scanning acoustic microscope provides a universal inspection tool for packaged semiconductor development, production and failure analysis. With the ability to detect air defects as thin 0.05 micron and spatially resolve defects down to 10 microns, the ECHO is perfect for bump detection, stacked die (3D packaging) inspection, complex flip chip inspection and more traditional plastic packages.
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Product
Ultrasonic Transducers
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Sonix S-series ultrasonic NDT transducers are designed in-house to meet the demanding nondestructive testing requirements of semiconductor manufacturing. We offer the collaborative expertise to help customers choose the best ultrasonic NDT transducer for their application, based on three primary considerations.
