Wafer Resistivity
See Also: Wafer, Wafer Thickness, Wafer Failure Analysis, Wafer Edge, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Inspection, Four Point Probes
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Product
4-Probe Resistivity and Resistance Tester
HS-MPRT-5
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t used for measuring resistivity of silicon rods and wafers, and sheet resistance of diffused layers, epitaxial layers, LTO conductive films and conductive rubbers, etc.
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Product
Semiconductor Metrology Systems
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MTI Instruments'' semiconductor wafer metrology tools consist of a complete line of wafer measurement systems for virtually any material including Silicon wafer (Si), Gallium Arsenide wafer (GaAs), Germanium wafer (Ge) and Indium Phosphide wafer (InP). From manual to semi-automated wafer inspection systems, the Proforma line of wafer metrology inspection tools is ideal for wafer thickness, wafer bow, wafer warp, resistivity, site and global flatness measurement. Our proprietary push/pull capacitance probes provide outstanding accuracy throughout their large measurement range, allowing measurement of highly warped wafers and stacked wafers. MTII''s solar metrology tools include off line manual systems for wafer thickness and Total Thickness Variation (TTV), as well as, in-process measurement systems capable of measuring wafer thickness, TTV and wafer bow at the speed of 5 wafers/second.
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Product
Hand Held Probe Type Eddy Current Sheet Resistance/resistivity Measurement Instrument
EC-80P (Portable)
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*Auto-measurement start by probe head contacting to sample*3 measurement modes for wafer resistivity, bulk resistivity and sheet resistance*Easy set up to measurement condition by JOG dial*5 types of model for each measuring range*Resistivity probe can be changed by sample’s resistivity range
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Product
Resistivity Cell For N1413 (50 Mm Electrodes)
N1424A
Resistivity Cell
The N1424A is designed to operate specifically with the B2985B/87B Electrometer/High Resistance Meter. It is used to measure surface or volume resistance/resistivity of insulation materials. The N1413A High Resistance Meter Fixture Adapter is required to connect the N1424A to the B2985B/87B.
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Product
High Resistance Measurement Universal Adapter
N1414A
High Resistance Measurement Adapter
N1414A High Resistance Measurement Universal Adapter is used to simplify the connection for high resistance measurements by B2980A series electrometer.
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Product
Resistivity Cell For N1413 (26/50 Mm Electrodes)
N1424B
Resistivity Cell
The N1424B is designed to operate specifically with the B2985B/87B Electrometer/High Resistance Meter. It is used to measure surface or volume resistance/resistivity of insulation materials. The N1413A High Resistance Meter Fixture Adapter is required to connect the N1424B to the B2985B/87B.
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Product
Wafer Prober
Precio XL
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Fully automated 300mm wafer prober. The system achieves high productivity, excellent contact performance, improved cleanliness, and short lead time, and offers a number of high value-added functions as options.
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Product
Wafer Testing
Trio Vertical
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SV TCL's TrioTM is a reliable solution for advanced wafer testing challenges, specifically full array and parallel probing. We offer a complete line of vertical probe card products, each designed for your unique application.
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Product
Wafer Bonder
AML
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Wafer bonding has found many applications in the field of MST, MEMS and micro engineering. These include the fabrication of pressure sensors, accelerometers, micro-pumps and other fluid handling devices. The process is also used for first-order packaging of silicon microstructures to isolate package-induced stresses. The OAI AML Wafer Bonder facilitates both the alignment and bonding to be performed in-situ, in a high vacuum chamber. For anodic bonding the wafers are loaded cold and heated in the process chamber. For high accuracy alignment the wafers are aligned and brought into contact only after the process temperature has been reached, thus avoiding differential thermal expansion effects which can compromise alignment. The AML Wafer Bonder is excellent for anodic bonding, silicon direct and thermal compression bonding applications. These features enable the bonder to be used with virtually any processing tool.
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Product
Wafer Sorter and Inspection
SolarWIS Platform
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Eliminating the opportunity for problematic wafers to enter cell manufacturing lines greatly improves output and yield. ASM AE’s wafer sorter features 3D area inspection capability to inspect wafer thickness, total thickness variation (TTV), saw marks, as well as wafer bow and warpage. SolarWIS also includes modules that can inspect for stain, geometry, micro-cracks, edge chips, resistivity, P or N conductivity and lifetime.
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Product
Wafer Probers
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Devices to align probes to test the electrical properties of IC chips or TEGs (Test Element Groups) formed on wafers. The vast options available will meet various needs, from research to mass production.
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Product
Wafer Test
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Silicon Turnkey Solution, Inc.
Most foundries provide wafers already probed to a set of DC parameters at room temperature to ensure they meet a basic subset of the package-part specification. Beyond this basic set of tests, more rigorous testing is often needed to meet specifications requiring die to be 100 percent probed, identify and segregate devices with higher performance levels and guarantee that parts will perform to a certain specification level.
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Product
Earth Resistance & Resistivity Meter
MRU-200
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MRU-200 is the only meter in the market which uses all measurement methods.Possible measurements:- earth resistance measurment with 2-pole, 3-pole,4-pole method,- impulse earth resistance measurement, two kinds of measuring impulse 4/10s, 10/350s,- earth resistance measurement without disconnecting measured earths (using clamp),
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Product
Wafer Prober
Precio octo
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200mm wafer prober. The system adapts ultra-high speed indexing and high-speed wafer exchange functions to reduce test cost and improve overall equipment effectiveness (OEE) markedly enhancing productivity.
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Product
Resistance & Resistivity Probes
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Surface and/or volume resistance measurements are key parameters in describing materials' electrical properties. ETS offers a variety of probes to support numerous industry requirements and applications.
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Product
Wafer Probe Heads
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WLCSP test is the applying final test conditions at Wafer Level. WLCSP testing is driven in lowering the cost of test of devices through economical methods of manufacturing and testing.
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Product
Wafer Auto Line Integration
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The line is used for semiconductor wafer grinding. It carries out material matching and distribution, automatic loading and unloading, auto focusing and positioning and many other functions. The grinding precision is 2μm(3-sigma). It is also capable of collecting and analyzing real-time production data and interfacing with MES system.
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Product
Wafer Inspection System
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JRT Photovoltaics GmbH & Co. KG
In close cooperation with well-known providers of inspection systems, we provide modular systems for quality control and classification of raw wafers.
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Product
4 Wire Earth Resistance & Resistivity Tester
4236 ER
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Standard Electric Works Co., Ltd
● Microprocessor-controlled.● Earth resistivity (ρ) test.● Earth testing at 20Ω, 200Ω, 2kΩ.● Earth voltage measuring : 0-300V AC.● Automatic C spike check.● Automatic P spike check.● 2-Wire test, 3-Wire test, 4-Wire test.● LCM display.● Auto ranging.● Auto power OFF.● Data hold.● 200 measurement results can be saved in the memory and recalled on the display.● Interval between auxiliary earth spikes is 1.0~50.0m.● Optical USB to RS-232 data transmission.● The stored data can be transferred to a PC.● 2 optical LEDs are built-in for data transfer.
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Product
Contactless Wafer Gauge for Resistivity, Thickness
MX 60x
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The MX60x series measure Resistivity or Sheet Resistance of silicon and other materials.
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Product
Resistance Meters
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ACL provides surface resistance/resistivity meters and digital megohmmeters to quickly and accurately measure resistivity.
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Product
Wafer Internal Inspection System
INSPECTRA® IR Series
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An infrared internal defect inspection system has been added to the INSPECTRA® series.It is now possible to inspection with both infrared and visual light in one system.
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Product
Wafer Back Side Cooling System
GR-300 Series
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The GR-300 Series can control gases used to cool the back side of wafers that are fixed in position by an electrostatic chuck system.The stability and accuracy of the GR-300 makes it ideal for controlling the flow of Helium and Argon in wafer cooling systems.
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Product
Ground Resistance
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Provide accurate and reliable measurements of both ground resistance and soil resistivity for installation and troubleshooting.
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Product
Resistance Meter
MS8-2L
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M-module MC8-2L is a mezzanine module designed to measure resistance using a two-wire measurement scheme in eight channels (eight-channel digitizer). М-module МС8-2Л is installed on the mezzanine carrier - NM module and is connected to it via a local information highway. Up to four m-modules of various types can be installed on the HM module. The NM module, together with the m-modules installed on it, forms a VXI module of size C-1 and is used to create information measuring VXI systems.
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Product
Full Wafer Test System
FOX-1P
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Enables High Throughput, Single Touchdown, Full Wafer Production Testing. Capable of simultaneously testing up to 16,000 die in a single wafer touchdown. Resource configurable up to 16,384 " Universal Channels " - each programmable as anI/O, Clock, Pin Parametric Measurement Unit ( PPMU ) or Device Power Supply ( DPS ). Software-enabled per site flexibility to support small and large device pin count test needs. Comprehensive functional and parametric test capabilities Deep functional pattern data and capture memory optimized for BIST/DFT testing. Per channel PMU for per site parametric testing Individual channel over-current protection to protect wafers and probe cards. Configured for high volume production. Compatible with industry standard probers and probe cards. Available as an integrated test cell with prober, probe cards and 16,384 channel probe I/F. Configurable as a single or dual system integrated test cell.
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Product
Wafer Test
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WinWay’s commitment to technology, quality and service ensures our interface solutions go above and beyond to exceed your expectations. Our products and services have a proven track record of delivering customer success in semiconductor testing. The Company offers comprehensive test interface solutions ranging from wafer-level test, package-level test to thermal management.
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Product
Low Resistance Ohmmeters
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Some times know as Ducter testers, these are highly accurate, easy to operate instruments that measure resistance with resolution as fine as 0.1 micro-ohm. Digital micro-ohmeters and DLROs measure contact resistance of switch and circuit breakers, aircraft frame bonds, and rail and pipeline bonds just to name a few of the applications. Megger has models available for testing using test currents from 0.5 mA to 200 amps covering a multitude of applications that require precise low-resistance measurements.
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Product
Winding Resistance Meter
TRM 104
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TRM104 is a portable winding resistance meter, designed to work in live EHV switchyards. Winding resistance values of large transformers up to 500 MVA and rotating machines are directly displayed. The meter is protected against the back emf offered by large inductive winding. A back-lit 4 line LCD with a user-friendly menu sets up the instrument for the test. Winding resistances and safety messages are also shown on this display. It is possible to measure the resistance of two windings simultaneously.The meter contains a special power source for rapid stabilization of test results.
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Product
Resistance Measurement Meters
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Shanghai Beha Electronics Co., Ltd.
The meter digital milli-ohmmeter is a battery operated instrument wich supply a low current to the circuit under test, with which, stable, accurate measurement of low resistance can be made, still, over a wide range of values.
