Wafer Thickness
See Also: Wafer, Wafer Failure Analysis, Wafer Edge, Wafer Resistivity, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Inspection, Four Point Probes
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Product
Portable Wafer Probe Station
PS-5026B
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High Power Pulse Instruments GmbH
The PS-5026B is a rugged portable wafer probing solution which has been designed for high reliability, compact size and minimum cost.
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Product
Customized Semiconductor Wafer Inspection, Sorting & Metrology Equipment | Systems
Customized Solutions
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Unique Needs? Need better wafer inspection throughput, accuracy, versatility? Need a wafer defect inspection expert who’s not a sales person? We’ve been providing complete semiconductor wafer inspection, sorter, and microscopes solutions to semiconductor wafer manufacturers since 1994.
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Product
Wafer Probe Test System
STI3000
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The STI3000 is a wafer-level MEMS and mixed signal ASIC probe test system that combines several functional STI test equipment blocks for testing gyros, accelerometers, pressure sensors, microphones, resonators, and mixed signal ASICs.
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Product
Wafer Probe Heads
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WLCSP test is the applying final test conditions at Wafer Level. WLCSP testing is driven in lowering the cost of test of devices through economical methods of manufacturing and testing.
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Product
Industrial Protective Coating Thickness Gauge
456 IPC
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The Elcometer 456 Industrial Protective Coating Thickness Gauge1 is designed to measure dry film thickness on shot or grit blasted steel substrates.
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Product
Benchtop Unit for Universal Coating Thickness Measurement
FISCHERSCOPE MMS PC2
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Multifaceted for coating thickness measurement and material testing. Universal multi-measuring system for parallel coating thickness measurement and material testing with up to eight measuring modules.
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Product
Coating Thickness Gauge
456
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The Elcometer 456 dry film thickness gauge is available in four different models. Each thickness gauge provides the user with increasing functionality - from the entry level Elcometer 456 Model E, to the top of the range Elcometer 456 Model T.
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Product
In-situ Wafer Temperature Monitoring
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CI Semi's family of noncontact temperature monitors (the NTM line), offers high end pyrometry products for the measurement of wafer temperatures during process. CI Semi’s flag ship of the line, the NTM Delta, incorporates real-time, same point emissivity measurement and compensation making it the ideal solution for in situ monitoring for processes such as RTP, CVD and PVD. The NTM family is sold to leading tool manufacturers.
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Product
Wafer & Die Inspection
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SemiProbe wafer inspection system (WIS) examines, locates and identifies defects created during wafer manufacturing, probing, bumping, dicing or general handling. This provides microelectronic device manufacturers with accurate, timely quality assurance and process information. The WIS has single sided and double sided wafer mapping capabilities and can improve efficiency, reduce manufacturing costs, increase yields and shorten time to market.
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Product
Ultrasonic Thickness Gauge
TI-45 Series
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You can instantly measure the thickness of a material simply by positioning a probe. This innovative gauge is widely used and is capable of measuring a variety of materials including iron, stainless steel, glass and ceramics.
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Product
Thickness Measurement Testing
DRK3011B
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Shandong Drick Instruments Co., Ltd.
It is used for the durability test of children's mattress surface rolling and the test of the height of the cushion surface.
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Product
Metal Thickness Tester
Multigauge 5500 Waist
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Mounts onto a belt or chest harness for hands free use. Bright LED display. Top display for convenient viewing.
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Product
Full Wafer Contact Test System
Fox 1
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Unique cartridge technology uses full-wafer contactors combined with parallel test electronics to achieve single touch, full-wafer test
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Product
Flatness, Bow, Warp, Curvature, Glass Thickness
Standard Warp Measuring System
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Optik Elektronik Gerätetechnik GmbH
Optical, non contact measurement of warp and bow of specimen with size up to (1600 x 1200) mm. The system is designed for the contactless, optical measurement of the curvature (Warp) horizontal, coated float glass substrates. For that measurement the heights on different measuring points is evaluated.
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Product
Digital Thickness Gauges Paint Gauge Meter
HC-200
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Shenzhen Chuangxin Instruments Co., Ltd.
HC series of coating thickness gauge is a portable thickness gauge with eddy current thickness method and electromagnetic thickness method. It can be used to quickly and accurately measure the thickness of coating or cladding material without damaging it. As an essential instrument for professional material protection, this coating thickness gauge is widely used in manufacturing industry, metal processing industry, chemical industry and commodities inspection etc. ,both in the laboratory and in the engineering field. It can measure the thickness of nonmagnetic layer on magnetic metal substrate condition (such as steel, iron, alloy and hard magnetic steel, etc.) and the thickness of conductive layer on nonmagnetic metal substrate condition (such as rubber, paint, plastic, anodic oxidation film, etc.).
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Product
Wall Measurement Thickness Gauge Wall Thickness Test Instrument
HS160
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Shenzhen Chuangxin Instruments Co., Ltd.
HS160 Wall measurement thickness gauge, wall thickness measuring equipment apply to measure the thickness of all kinds of material, through which the ultrasonic wave can propagate at a constant speed and can get reflection from the back. This instrument can be used for a variety of plate and all kinds of machining parts for accurate measurement. Another important function of this gauge is to monitor all kinds of pipelines and pressure vessels used in the production equipment, monitoring their degree of corroded thinning during the using process. It's widely used in petroleum, chemical industry, metallurgy, shipbuilding, aviation, aerospace and other fields.
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Product
Wafer Bonder
AML
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Wafer bonding has found many applications in the field of MST, MEMS and micro engineering. These include the fabrication of pressure sensors, accelerometers, micro-pumps and other fluid handling devices. The process is also used for first-order packaging of silicon microstructures to isolate package-induced stresses. The OAI AML Wafer Bonder facilitates both the alignment and bonding to be performed in-situ, in a high vacuum chamber. For anodic bonding the wafers are loaded cold and heated in the process chamber. For high accuracy alignment the wafers are aligned and brought into contact only after the process temperature has been reached, thus avoiding differential thermal expansion effects which can compromise alignment. The AML Wafer Bonder is excellent for anodic bonding, silicon direct and thermal compression bonding applications. These features enable the bonder to be used with virtually any processing tool.
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Product
Wafer Prober
Precio octo
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200mm wafer prober. The system adapts ultra-high speed indexing and high-speed wafer exchange functions to reduce test cost and improve overall equipment effectiveness (OEE) markedly enhancing productivity.
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Product
Precision Coating Thickness Gauge Probe Range
Elcometer 355
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Unique probe modules allow the Elcometer 355 Coating Thickness Gauge to be versatile and flexible for any coating thickness measurement application.
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Product
Tooth Thickness Micrometer
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Measures the "root tangent length" of gears. Compatible modules differ depending on the model.
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Product
Mechanical Coating Thickness Gauges
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Mechanical Coating Thickness Gauges are suitable for working in high risk areas such as high temperature or flammable atmospheres, underwater or where the risk of explosion is high and could be triggered by the use of an electronic instrument. From the simplest coating thickness gauge Elcometer 101 which will provide you with quick and immediate results to the more accurate coating thickness gauge Elcometer 211, also called the "banana gauge" which is ideal for cold and underwater surfaces.
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Product
Pfund Thickness Gauge
3233
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Available in aluminium or stainless steel this instrument consists of two concentric cylinders, one sliding inside the other. A spherical glass lens, which has engraved measurements, is fitted to the end of the central cylinder and when pressed into the wet film, leaves a circular trace.The diameter of the mark on the lens is measured and, using the supplied conversion table, the thickness of the coating can be easily assessed.Ideal for measuring the thickness of wet translucent products such as varnishes, oils etc.Measurement range of 2.25 - 360μm (0.09 - 14.17mils)
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Product
Non Rotating Spindle Type Tooth Thickness Micrometer
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Measures the "root tangent length" of gears. Compatible modules differ depending on the model.
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Product
Compact Coating Thickness Gauges
MP0 Series
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Ultra compact pocket coating thickness gauges for simple, fast and nondestructive coating thickness measurement on virtually all metals or only on steel/iron
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Product
Thickness Gauges
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Bristol Instruments'' optical thickness gauges are a simple and non-destructive way to precisely measure thickness of a variety of transparent and semi-transparent materials. Thickness information is critical in the development and production of materials such as contact and intraocular lenses, and medical products including balloon catheters, stents, bags, and tubing. Bristol combines high accuracy with straightforward operation and rugged design to make these instruments ideal for both laboratory and manufacturing environments.
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Product
Terahertz Coating Thickness Analysis
TeraCota
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TeraView presents a film thickness gauge designed for the automotive industry. The sensor can determine the individual thickness of multiple paint layers on both metallic and non-metallic substrates and offers significant benefits over existing techniques.
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Product
Flaw Detector & Thickness Gauge
DFX-7
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Automatic: probe zero, probe recognition, and Temperature compensation.Measurement: Variety of modes to address a number of applications.Large data storage with multiple formats: Alpha numeric grid and sequential w/auto identifier.Windows PC interface software.2 year limited warranty.
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Product
Film Thickness Probe
FTPadv
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The SE 500adv combines ellipsometry and reflectometry to eliminate the ambiguity of measuring layer thickness of transparent films. It extends the measureable thickness to 25 µm. Therefore the SE 500adv extends the capability of the standard laser ellipsometer SE 400adv especially for analyzing thicker films of dielectrics, organic materials, photoresists, silicon, and polysilicon.
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Product
Wafer Defect observing instrument
HS-WDI
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Application■Semiconductor wafer■Solar wafer■Solar Cell■Thin-film Cell
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Product
Flatness, Bow, Warp, Curvature, Glass Thickness + Optics Test Equipment
Mobile Wedge Angle Sensor WAS 160
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Optik Elektronik Gerätetechnik GmbH
Portable sensor for measurement of radius and wedge angle. Application: windshields of cars, helicopters, airplanes.





























