Wafer Failure Analysis
Defines the failure mode and then through additional testing determine it's cause.
See Also: Wafer, Wafer Thickness, Wafer Edge, Wafer Resistivity, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Inspection
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Failure Analysis
MicroINSPECT 300FA
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The MicroINSPECT 300FA is an automated wafer inspection tool used for semiconductor wafer failure analysis. Its small footprint, high speed, and low cost relative to its rich features yield a superb cost of ownership and makes this an ideal tool for your fab or failure analysis lab. The MicroINSPECT 300FA combines advanced robotics, wafer sorting, an intelligent wafer inspection microscope together with SiteVIEW Software to produce an integrated failure analysis tool.
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Failure Analysis
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A partial list of our state of the art test equipment, applicable to these testing disciplines, will include the following: Two Scanning Electron Microscopes with EDS (SEM/EDS) Three Differential Scanning Calorimeters (DSC) Three Thermogravimetric Analyzers (TGA) Three Thermo Mechanical Analyzers (TMA) One Dynamic Mechanical Analyzer (DMA) Two Real-Time Fluoroscopic X-ray Systems, including a Microfocus System One Fourier Transform Infrared Microscope (FTIR) (capable of identifying a single particle of an unknown material) Two Ion Chromatographs (IC) (capable of identifying ionic impurities in ppm)
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Benchmark, Competitive and Failure Analysis
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Helping you determine the root cause of product failures and evaluate products against industry competition and standards.We provide third-party verification and support for claims related to performance versus competition, root product failure cause, and benchmark industry performance. As an independent laboratory with over 60 years of product testing experience, our expertise helps you evaluate products for a variety of performance related characteristics. Additionally, we can provide expert witness legal testimony for insurance claims, CPSC filings, and civil/criminal court cases through our testing results and data.
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Failure Analysis
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Failure analysis on electronic components is a continuous challenging task. The smaller transistor dimensions, increasing functional complexity and changing device packaging styles requires new tools and skills for sample preparation, fault localization techniques, high resolution imaging and analysis.
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Failure Analysis Services
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BMP Testing and Calibration Services Inc.
Failure analysis plays a crucial role in product development that enables industries to prevent future product failures and improve them for the end-user. It’s a multi-faceted approach to finding how and why a product failed and involves an in-depth investigation of the circumstances surrounding the failure and discovery of relevant background information, including but not limited to the type of application, environmental factors, service life, and pertinent design information.
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Wafer Prober
Prexa
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The latest fully automated 300mm wafer prober. The system offers excellent productivity and advanced functions, contributing to KGD (known good die) testing for advanced packaging.
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Fatigue Failure Tester
EKT-2002FF
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EKT-2002FF Flexing Fatigue Tester is designed in accordance with ASTM D4482 to test the fatigue life under a tensile strain cycle on different kinds of vulcanized rubber compound to determine the fatigue life at various extension ratios.
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Wafer Test
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WinWay’s commitment to technology, quality and service ensures our interface solutions go above and beyond to exceed your expectations. Our products and services have a proven track record of delivering customer success in semiconductor testing. The Company offers comprehensive test interface solutions ranging from wafer-level test, package-level test to thermal management.
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Wafer Manufacturing
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Scientific Computing International
A procedure composed of many repeated sequential processes to produce complete electrical or photonic circuits on semiconductor wafers in semiconductor device fabrication process.
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Wafer Inspection System
AutoWafer Pro™
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AutoWafer pro is our most advanced ultrasonic equipment for detecting defects in bonded wafers in a production environment, providing fast, high-resolution scanning of 200mm and 300mm bonded wafers.
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Phase Failure Detectors
DSP
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Your product The DSP-1L or DSP-1LM is used to protect your three-phase motors against phase loss, imbalance, or reversal. It continuously monitors each phase of your power supply. In case of a problem, it cuts the power to the control circuit to protect the affected motor.
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Wafer Test
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Silicon Turnkey Solution, Inc.
Most foundries provide wafers already probed to a set of DC parameters at room temperature to ensure they meet a basic subset of the package-part specification. Beyond this basic set of tests, more rigorous testing is often needed to meet specifications requiring die to be 100 percent probed, identify and segregate devices with higher performance levels and guarantee that parts will perform to a certain specification level.
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Batch Wafer Transfer Tools
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Dou Yee Enterprises (S) Pte Ltd
Dou Yee Enterprises Batch Wafer Transfer Tools
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Wafer Prober
Precio XL
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Fully automated 300mm wafer prober. The system achieves high productivity, excellent contact performance, improved cleanliness, and short lead time, and offers a number of high value-added functions as options.
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Die-To-Wafer Bonding Systems
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Several different D2W bonding methods are available and selected depending upon the application and customer requirements. In direct placement D2W (DP-D2W) bonding, the singulated dies are bonded to the target wafer one by one using a pick-and-place flip-chip bonder. Plasma activation and cleaning of the surfaces of the dies on the handler wafer are essential steps for establishing a high-yielding bond and electrical interface between the dies and target wafer. This is where the EVG320 D2W activation system comes in.
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Wafer Inspection Products
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Sonix provides manual and automated wafer inspection and metrology systems for wafers ranging from 100mm to 300mm, with extensive analysis capabilities at both the wafer and device level. These industry-leading automated wafer inspection systems are used by the world’s top manufacturers to ensure quality from development through production.
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Reservoir Analysis
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Reservoir Analysis Instruments determine the flow-related properties of the reservoir fluids and formation so that producers can optimize their production and recovery techniques.
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Gas Analysis
QIC BioStream
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A gas analysis system for continuous analysis of gases and vapours from multiple fermentation reactors with multi off gas and multi reactor dissolved gas species analysis capability. A high-performance Proteus multi-stream valve supplied with 20, 40 or 80 inlet streams is included with programmable sequence control software for analysis of multiple reactors. Streams can be allocated for either dissolved species analysis or off gas analysis.
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Wafer Test Solutions
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Wafer Test Solutions has established leadership positions in developing and deploying application-specific test solutions for MEMS devices, offering wafer and frame probing stations suitable for R&D, Wafer Sort, and Final Test. We offer state-of-the-art solutions to test environmental and motion sensors in wafer and other advanced packages.
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Gas Analysis
HPR-20 R&D
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The Hiden HPR-20 R&D specialist gas analysis system is a bench-top mass spectrometer for real time gas analysis of evolved gases and vapours.
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Gas Analysis
HPR-90
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The HPR-90 automated package cracking analysis system is a complete system optimized to analyse gas within sealed volumes such as light bulbs.
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Production Wafer Level Burn-in
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TV19 VersaTile™ probe cards are designed with Celadon’s patented ceramic technology for superior electrical performance, yet is highly modular due to it’s 28mm x 28mm chassis. Micro-adjustments can be made in seconds with an allen wrench and a microscope. Easily align VersaTile cards for different wafer layouts using a 4.5” compatible 1×3 , 200mm, or 300mm VersAdjust plate.
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N/Protein Analysis
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Elementar Analysensysteme GmbH
The determination of the total protein content is an essential tool for quality control and protein declaration according to international labeling laws in the food & feed industry and research facilities. Since the protein content can directly correspond to product properties, highly precise, matrix-independent protein analyses are required in all application areas.Our N/protein analyzers use the high-temperature combustion method according to Dumas, which has clear advantages over Kjeldahl regarding laboratory safety, sample throughput, labor time, amount of chemical waste and thus cost-per-analysis. Our analyzers for the determination of nitrogen and protein are dedicated instruments serving today’s customer needs in regards to price-per-sample, throughput and sensitivity.
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Light Analysis
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Welcome to Thorlabs; below you will find links to detectors and instrumentation that measure the various properties of light, a subset of our entire line of photonics products. Thorlabs offers an extensive selection of instruments that measure the properties of light. Our versatile power and energy meters can be used with over 25 different sensors in order to make NIST-traceable power and energy measurements. If the convenience of a meter is not desired, our selection of detectors includes basic photodiodes (uncalibrated and calibrated), photodetectors (biased, amplified, and avalanche), CCD and CMOS arrays, position detectors, integrating spheres, and photomultiplier tubes. The Beam Characterization category contains beam profilers (camera and scanning slit), a wavefront sensor, spectrometers, and interferometers, while the Polarimetery link leads to a selection of instruments used to measure and control the polarization of light.
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Wafer Testing
Trio Vertical
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SV TCL's TrioTM is a reliable solution for advanced wafer testing challenges, specifically full array and parallel probing. We offer a complete line of vertical probe card products, each designed for your unique application.
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Signal Analysis
CPB (Constant Percentage Bandwidth) Analysis
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The program is used for transfer fractional octave (1/1, 1/3, 1/12, and 1/24 octave) spectral analysis of signals coming from the input channels of FFT spectrum analyzers (in real time or recorded time realization view mode), as well as for viewing various spectral characteristics of signals.
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Soil Analysis
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We offer a full spectrum of analytical technologies, and sample clean up and moisture extraction reagents, designed to provide reliable, accurate, and precise results that make compliance easier and help you reduce regulatory risks. Organic Elemental Analysis, Trace Elemental Analysis, X-Ray Fluorescence (XRF) Spectrometry, Automated Discrete Photometry, Gas Chromatography Mass Spectrometry (GC-MS), Accelerated Solvent Extraction (ASE).
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CS/ONH-Analysis
G4 ICARUS Series 2
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The combustion analyzer G4 ICARUS Series 2 with high frequency (HF) induction furnace and HighSense™ detection sets new standards in for a rapid and precise carbon (C) and sulfur (S) analysis in inorganic solids.
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Product
WAFER MVM-SEM® E3300 Series
E3310
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The E3310 is a WAFER MVM-SEM®* for next generation wafers, supporting 1Xnm node process development and volume production at the 22nm node and beyond. With its high-speed carrier system employing a dual arm vacuum robot, and low-vibration platform to improve measurement accuracy, the E3310 delivers high throughput and performance for wafer measurements. Its multi detector configuration and unique 3D measurement algorithm also enable stable, high-accuracy measurement of 3D transistor technologies such as FinFET. The E3310 makes a significant contribution to reducing process development turnaround time and improves productivity for next-generation devices.
