Wafer
thin crystalline material sliced from ingot.
See Also: Wafer Thickness, Wafer Failure Analysis, Wafer Edge, Wafer Resistivity, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Inspection, Probe Cards
-
-
Product
Surface Defect Inspection System
-
Wafer for inspection of surface condition of specular flat substrate, glass substrate, others φ 100 ~ φ 300 compatible
-
Product
The Lorlin© Impact Series
-
Discrete Component Tester is designed to test small signal and power semiconductor components in both single and multi-device packages or hybrids.. The automatic test system can be used in all test applications including incoming inspection, wafer probe, QC, engineering, production, final test, and high reliability. The system tests most all discrete semiconductors with reliable, accurate, and repeatable results.
-
Product
LOAD BOARD
-
The semiconductor manufacturing process is divided into a front process (WAFER) and a post process (PACKAGE). The LOAD BOARD is an INTERFACE device for inspecting the function and performance of a package state IC, which is a post process, It is an INTERFACE key device for inspection. In particular, LOAD BOARD is widely used in non-memory semiconductor inspection equipment.
-
Product
Process XRR, XRF, and XRD metrology FAB tool
MFM310
-
Thickness, density, roughness & composition of films on blanket and patterned wafers. The Rigaku MFM310 performs high-precision measurements not possible by optical or ultrasonic techniques. This sophisticated X-ray metrology tool makes it practical to perform high-throughput measurements on product and blanket wafers ranging from ultrathin single-layer films to multilayer stacks.
-
Product
300 Mm Semiconductor Processes
-
With the Center Nanoelectronic Technologies (CNT), the Fraunhofer IPMS conducts applied research on 300 mm wafers for microchip producers, suppliers, equipment manufacturers and R&D partners. In the field of FEoL and BEoL we offer the following technology developments and services at Ultra Large Scale Integration level (ULSI):
-
Product
High Throughput 1 ns Pulsed IV Memory Test Solution
NX5730A
-
Precise and fast characterization of new memory, such as spin transfer torque magneto resistive random access memory (STT-MRAM) from DC to high-speed pulsed IV measurement on silicon wafers Apply accurate and high-speed pulsed voltages (down to 1 ns pulse) to magnetic tunnel junction (MTJ) for STT-MRAM and precisely measure the resistance of MTJ Perform all typical MTJ characterization tests in one solution10 to 100 times faster cycle test, such as a bit error rate test (BERT)Capture and visualize MTJ switching waveforms clearly during the writing pulse Dedicated solution with Keysight Technologies’ technical expertise
-
Product
Mixed Signal Test Systems
MTS1020i
-
The MTS-1020i is a cost effective production ATE designed for testing high-volume linear and mixed signal semiconductor devices (Op Amps, high-voltage drivers, DAC, ADC, etc.), both at the wafer sort and final test stages of the manufacturing process
-
Product
MPI SiPH Probe Systems
-
MPI Advanced Semiconductor Test
MPI designed dedicated SiPH upgrades for its well known 200 and 300 mm probe systems, which includes:*Various options of high-precision fiber alignment systems for ultra-fast scanning routines*Multiple measurement capabilities for O-O, O-E, E-O and E-E device configuration*Integrated Z-sensing for detecting the fiber to wafer contact point*Crash protection when using two optical fiber arms*Wide temperature range from -50°C to 200°C*Optional dark box for testing in light tight environment*Extensive software package for supporting easy integration to operator’s test executive*Probe system compatibility: TS2000-IFE, TS2000-SE, TS3000, TS3000-SE, TS3500 and TS3500-SE
-
Product
Wafer Thickness Measurement System
MPT1000
-
Laser based Wafer Thickness and Roughness Measurement System designed by Chapman Instrument Inc., USA and OEM by Creden Mechatronic Sdn Bhd. A non-contact measurement system measures several parameters in a single system. (wafer & tape thickness, roughness, TTV, bump height, bow and warp measurements)
-
Product
Component Testers
-
After a wafer is tested through front-end test and back-end test, the component tester tests this final component or package assuring its quality for the semiconductor makers. DDR, DDR2, DDR3 memory component testers.
-
Product
IR Inspection System
EVG®20
-
The EVG 20 offers a fast inspection method, especially for fusion bonded wafers. A live imageof the entire wafer via IR transmission supports void detection down to a radius of 0.5 mm. The infrared inspection system is a perfect match for fusion bonding processes either as the stand-alone EVG 20 tool or as a station in EVG''s integrated bonding systems.
-
Product
Microelectronic Services
-
Services for ASIC houses and Integrated Device Manufacturers are IC Wafer / Final Test, IC assembly, Test Program development, product engineering, Flash / EEPROM programming, characterisation / capability studies, yield enhancement, design verification and failure / yield analysis. Das Test Haus are specialists for wafer test, low power, mixed signal and eeprom test.
-
Product
MPI PA Wafer Probers
-
MPI Photonics Automation is the industry-leading provider of turnkey wafer test and measurement solutions. We offer a complete line of high-performance wafer probers designed to address the diverse and complex needs of the Photonics, Optoelectronic, Semiconductor, and Laser industries.
-
Product
Exposure Systems
Model 2012AF & 2012SM
-
The Model 2012AF Flood Exposure System provides a cost-effective method for automated flood exposure. Designed to accommodate wafers from 8” to 300mm, the tool features automated FOUP loading. Mask and substrate changeover can be accomplished quickly and easily adding to both versatility and high-volume throughput of this production tool.The Model 2012SM Automated Edge-bead Exposure System provides a cost-effective method for edge-bead removal using standard shadow mask technology. Designed to accommodate wafers from 8” to 300mm, the tool features automated FOUP loading. Mask and substrate changeover can be accomplished quickly and easily adding to both versatility and high-volume throughput of this production tool.
-
Product
Nano-focus X-ray Inspection System
X-eye NF120
-
Nano-focus Tube of 400 nano resolution is installed which is specialized for Semiconductor Packaging, Wafer Level Packaging(WLP) requiring detection of Sub-micron defects.Able to trace and inspect defected area precisely by precise movement of axis with Anti-vibration table.Tomography is available if 3D CT module is added and Wafer Bump Automatic Inspection is available from loading to inspection with wafer handler systems.
-
Product
Metrology System
IVS
-
The IVS 220 system is the latest generation in the IVS series and has been designed for ultimate precision, TIS (tool induced shift) and throughput on 200mm wafers. The cornerstone of the system’s reliability and stability is its mean time between failure (MTBF) of 2,100 hours. The IVS 280 provides the same capability in a package designed for overhead track handling with full E84 GEM300 capability.
-
Product
Memory Test System
T5835
-
The new T5835 has full testing functionality, from package testing to high-speed wafer testing, for any memory ICs with operating speeds up to 5.4 Gbps, including all next-generation memories from NAND flash devices to DDR-DRAM and LPDDR-DRAM. It can handle 768 devices simultaneously for final package-level testing. It additionally features functions such as an enhanced programmable power supply (PPS) for advanced mobile memories, and a real-time DQS vs. DQ function to improve yield.
-
Product
STDF Test Data Analysis Tool
DataView
-
DataView is a low‐cost test data analysis tool that is used by test and product engineers to perform characterization of integrated circuit devices. DataView reads in industry standard STDF or ATDF files and can produce reports, histograms, and wafer maps in multiple formats including Excel. DataView is ideal for the test or product engineer who needs a fast and simple tool to analyze characterization data.
-
Product
Dicing And Lapping Systems
-
In semiconductor fabrication, clean die separation and smooth surfaces can make all the difference. While these steps might come late in the process, they play a major role in how well a device ultimately performs. Dicing and lapping bring the necessary level of precision to cut wafers into individual dies and polish surfaces so everything fits, functions and holds up the way it should in real world scenarios.
-
Product
Tabletop Mask Aligner
Model 200
-
The OAI Model 200 Mask Aligner is a cost-effective high performance mask Aligner that has been engineered with industry proven components that have made OAI a leader in the photolithography capital equipment industry. The Model 200 is a tableop mask Aligner that requires minimal cleanroom space. It offers an economic alternative for R&D, or limited scale, pilot production. Utilizing an innovative, air bearing / vacuum chuck leveling system, the substrate is leveled quickly and gently, for parallel photo mask alignment and uniform contact across the wafer during contact exposure. The system is capable of one micron resolution and alignment precision.
-
Product
NI STS
-
RF Test and Measurement Solutions, LLC
RFTMS is a leader in configuring systems to meet your needs, as well as designing load board, writing SW, and integrating the final solution. We do this for wafer test, packaged parts, and modules. RFTMS can address any level of integration that your parts employ, from a single functional block, i.e., Power Amplifier (PA) to System-on-a-Chip (SOIC). We test all sorts of RFICs.
-
Product
Optical Thin-Film Metrology for Advanced Thin Films
FilmTek 6000 PAR-SE
-
Scientific Computing International
Production-proven metrology system for film thickness, refractive index and stress measurement for a broad range of film layers at the 1x nm design node and beyond. Accommodates 200 or 300 mm wafer metrology. Combines spectroscopic ellipsometry and DUV multi-angle polarized reflectometry with a wide spectral range to meet the challenging demands associated with multi-patterning and other leading-edge device fabrication techniques.
-
Product
Equipment Front End Module Wafer Handler
Sigma EFEM
-
Integration transforms the bond tester into a fully automated system. We offer various types of EFEM (Equipment Front End Module) wafer handlers, to combine with a Sigma W12 for operator-free bond testing.
-
Product
Automated Semiconductor Wafer Optical Inspection and Metrology
SITEview Software
-
Microtronic SITEview Software is designed from the end-user operator’s perspective and is easy to use, fully featured, and modular. Applications include visual wafer inspection, OCR sorting, wafer defect review, second optical inspection, image storage and retrieval, laser marking, microscope interface, and GEM/SECS II communication and seamlessly integrates with EAGLEview, MicroINSPECT and MicroSORT.
-
Product
Advanced Probe Card / V type
VC Series
-
Japan Electronic Materials Corp.
*Vertical contact Probe Card*No limitation by Pad layout*Large probe area (Suitable for 200mm wafer 1-shot)*Small scrub mark*Suitable for High/Low Temperature Test
-
Product
Translating process images into significant tool-defect reduction
Trans-Imager
-
Real-time, tool-specific defectivity data. Now there is a way to monitor defectivity on individual processing tools – automatically – in real-time. Microtronic’s new Trans-Imager software module is able to take high-resolution images directly from your processing equipment and immediately detect and displaymacro wafer defects – transferring all of that information into our powerful and long-proven ProcessGuard software which provides a wealth of defect management and analysis. This new capability is called ProcessGuard Xtensis (PGX) because it extends the power of ProcessGuard software to fab tools that previously had no way to detect defects. This provides an important new stream of defect data.
-
Product
Defect Inspection System
NovusEdge
-
The NovusEdge System provides high sensitivity inspection for the edge and backside of bare unpatterned wafers for current and advanced nodes. Multiple modules can be configured on the same automation platform for increased throughput while maintaining a small footprint for an improved cost of ownership.
-
Product
Optical Metrology
YieldStar
-
Our YieldStar optical metrology solutions for the semiconductor industry can quickly and accurately measure the quality of patterns on a wafer.
-
Product
Probe Cards
-
PICOPROBE® PROBE CARDS by GGB Industries, Inc., allows for more chip design flexibility because each probe card is custom configured to your circuit for testing wafers on either manual or automatic probe stations. Probe cards with complex layouts consisting of numerous DC contacts and multiple microwave probes with operating frequencies of 40, 50, 67, or 110 GHz can be custom fabricated quickly and inexpensively.
