Wafer
thin crystalline material sliced from ingot.
See Also: Wafer Thickness, Wafer Failure Analysis, Wafer Edge, Wafer Resistivity, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Inspection, Probe Cards
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Product
WDXRF Wafer Analyzer
2830 ZT
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The 2830 ZT wavelength dispersive X-ray fluorescence (WDXRF) wafer analyzer offers the ultimate capability for measuring film thickness and composition. Designed specifically for the semiconductor and data storage industry, the 2830 ZT Wafer Analyzer enables the determination of layer composition, thickness, dopant levels and surface uniformity for a wide range of wafers up to 300 mm.
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Product
Non-contact Measurement Wafer Sorting System (Robot Hand Tranceportation)
NC-3000R
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*High accuracy measurement system for large diameter wafer*Non-contact measurement of resistivity, thickness and conductivity (P/N)*Compact design of Two-stage by measuring area and transfer area*Number of cassette station can be changed by customers request Option : Add wafer flattness measurement system(FLA-200)
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Product
Probe Needles for Wafer Sort and Test Applications
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Advanced Probing Systems, Inc.
APS is the global leader in the manufacture of probe needles used in cantilevered probe cards. All probe needles used in wafer sort are manufactured according to customer specifications using stringent in-process quality assurance procedures.
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Product
Wafer Inspection Machine
IV-W2000
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The IV-W2000 is a wafer inspection machine that features on-the-fly scanning and inspection as well as automatic handling of 6/8/12-inch wafers. With the option to have a Chinese language UI, this machine is also known for being intuitive and user-friendly.
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Product
Batch Wafer Transfer Tools
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Dou Yee Enterprises (S) Pte Ltd
Dou Yee Enterprises Batch Wafer Transfer Tools
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Product
Wafer Cathodoluminescence Microscope
Säntis 300
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Attolight’s Quantitative CL-SEM offers “No Compromise” large field fast scanning simultaneous acquisition of SEM images, hyperspectral CL maps, and optical spectra. Smaller diameter wafers, or miscellaneously shaped substrates are manually loaded on intermediary 300mm susceptors subsequently handled automatically by the tool.
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Product
Non-contact Inline P/N Checker Module For Solar Wafer
PN-100BI
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*Principle: Photovoltaic effect with the laser diode*Suitable for production line and tranceportation system*Connect to host PC by LAN to send measurement command and data
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Product
WAFER MVM-SEM® E3300 Series
E3310
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The E3310 is a WAFER MVM-SEM®* for next generation wafers, supporting 1Xnm node process development and volume production at the 22nm node and beyond. With its high-speed carrier system employing a dual arm vacuum robot, and low-vibration platform to improve measurement accuracy, the E3310 delivers high throughput and performance for wafer measurements. Its multi detector configuration and unique 3D measurement algorithm also enable stable, high-accuracy measurement of 3D transistor technologies such as FinFET. The E3310 makes a significant contribution to reducing process development turnaround time and improves productivity for next-generation devices.
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Product
Semiconductor Wafer Microscope Inspection System
MicroINSPECT
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MicroINSPECT Semiconductor Wafer Defect Microscope Inspection System combines state-of-the-art robotics, intelligent microscopes and SITEview software to provide a flexible, easy-to-operate defect inspection platform for either micro or macro defect wafer inspection.
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Product
Wafer Chucks
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American Probe & Technologies, Inc.
High Performance Chuck for your needs Introducing the American Probe & Technologies’ HC-6000 series of thermal chucks,
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Product
Wafer Back Side Cooling System
GR-300 Series
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The GR-300 Series can control gases used to cool the back side of wafers that are fixed in position by an electrostatic chuck system.The stability and accuracy of the GR-300 makes it ideal for controlling the flow of Helium and Argon in wafer cooling systems.
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Product
Sapphire/SIC Wafer Flatness and Surface Appearance System
FM200
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Sapphire/SIC wafer flatness and surface appearance system provide a previous surface flatness testing solution, though non-contract lighting testing to record the whole information of the surface, rapid and fast measurement for various of surfaces, line and all kinds of surface information.
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Product
NUV-PL SiC Defect Inspection System
VS6845E
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Industrial Vision Technology Pte Ltd.
Comply with IEC63068-3 Standard: Test method for defects using photoluminescence, Model VS-6845 SiC Wafer defect inspection system has capability on Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices.
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Product
Device Parameter Analysis
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bsw TestSystems & Consulting AG
The complexity of DC Parametric Characterisations has significantly increased with the level of miniaturisation in the semiconductor industry. The demand is not only on the precision of the measurements. New measurement methods have emerged to gain insight into phenomena previously unknown or only of marginal relevance. One example is "Pulsed IV" which is now widely in use. The modular concept of the Keysight B1500A allows users to tailor their instrument exactly to their needs. Flexible upgrades ensure the investment for many years. Together with bsw AG you will get an optimum solution for your application. Our experts provide not only support for the instrument itself but have also working knowledge of all the solutions surrounding it. This includes Cabeling and Adapters, Fixturing for packaged Parts and of course Wafer Probing. We help customers from replacements of broken or worn-out parts to planning and deployment of turn-key-systems.
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Product
WLCSP Probe Heads
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Smiths Interconnect offers Wafer Level Chip Scale Package (WLCSP) Probe Heads utilizing spring probe technology which provide high parallelism in test, superior signal integrity and high speed / RF testing capability.
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Product
DC Parametric Test System with Curve Trace
DC3
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The wafer has been fully tested, cut and packaged. Today's IC manufacturers are finding tremendous cost savings in performing just fast DC tests on these packaged parts rather than running the full wafer tests all over again. Until now this required either an expensive full-power IC tester, or a "rack-n-stack" collection of instruments. Enter the HILEVEL DC3 Co-Optive Parametric Tester. No more instruments, no switching matrix, no tricky software. The DC3 combines a high-precision DC-PMU and internal DUT supplies to test up to 2,048 pins, all in a single chassis with Multi-Site capability up to 64 sites. And every DC3 includes our Classic Curve Trace feature, allowing easy curve tracing on every pin.
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Product
Wafer Internal Inspection System
INSPECTRA® IR Series
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An infrared internal defect inspection system has been added to the INSPECTRA® series.It is now possible to inspection with both infrared and visual light in one system.
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Product
CMP
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CMPs remove unevenness on wafer surfaces that occur during the production process. Applications are growing due to the increase of layers in semiconductor devices and the growing variety of wiring materials.
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Product
Wet Oxidation System For VCSEL Fabrication
VIXEL-320
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The VIXEL-320 is a wet oxidation system intended for the fabrication of Vertical Cavity Surface Emitting Lasers. It is an atmospheric-pressure oxidation system with in-situ monitoring of oxide aperture formation. It accommodates single wafers of up to 150mm (6") in diameter.
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Product
High Resolution Wafer Thickness & Thickness Variation Gauge
MX 10x series
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The MX10x series measure thickness and thickness variation on silicon wafers. It has a resolution of 10 nanometers and can be adapted to different thickness ranges within a few seconds.
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Product
Wafer Prober
Prexa MS
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The latest fully automated 300mm wafer prober for memory devices. Featuring high rigidity and exceptional thermal control, the system enables full-wafer contact testing.
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Product
Total Reflection X-ray Fluorescence (TXRF) Services
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A highly surface-sensitive technique, TXRF is optimized for analyzing surface metal contamination on semiconductor wafers.
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Product
Wide Measurement Range Model Of Semi-automatic 4 Point Probe Sheet Resistance/resistivity Measurement
RT-3000/RG-2000 (RG-3000)
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*User programable measurement pattern & programmable measuring pattern*Tester self-test function, wide measuring range*Thickness, edge, temperature correction for silicon wafer*Film thickness conversion function from sheet resistance*2 types measuring tester (S version: Standard type, H version: High range resistivity measurement type)
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Product
High Power Devices
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SemiProbe configures our PS4L Adaptive Architecture into the Voltarus (TM) family of probe stations to fulfill the unique requirements of testing high power devices at wafer level prior to packaging. Voltarus probe stations are available in manual, semiautomatic, and fully automatic configurations that can test and characterize power devices up to 10 KV or 200 Amps (pulsed).
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Product
Vacuum Handling Systems
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RECIF Technologies history started in 1982 offering its first wafer handling solution: Vacuum handling Systems.Based on this historical technical mastery, Recif Technologies provides today a full range of single wafer manual vacuum handling solutions adapted to our customers’ and current Semiconductor industry’s’ requirements.
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Product
Defect Inspection and Review
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KLA’s defect inspection and review systems cover the full range of yield applications within the chip and wafer manufacturing environments, including incoming process tool qualification, wafer qualification, research and development, and tool, process and line monitoring. Patterned and unpatterned wafer defect inspection and review systems find, identify and classify particles and pattern defects on the front surface, back surface and edge of the wafer. This information allows engineers to detect, resolve and monitor critical yield excursions, resulting in faster yield ramp and higher production yield.
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Product
Absolute Contamination Standards (ACS)
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The Absolute Contamination Standard (ACS) is used to calibrate instruments which size and detect particles on the surface of bare silicon wafers. Use ACS to characterize particles, before particles characterize products.
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Product
Light and Energy Meter
Model 659
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UV Light and Energy Meter for use with all wafer steppers. For over 45 years, OAI is a world leader in UV Light and Energy Measurement Instrumentation used for reliable accurate calibrated control of the photolithography processes in the Semiconductor, MEMS, Wafer Packaging and Wafer Bumping Industries. The New Model 659 is an advanced UV exposure analyzer specifically designed for use with all wafer steppers including high intensity wafer steppers. This meter averages up to 400 exposure readings, has Ethernet and USB interface for downloading recorded measurements, and has intensity range of up to 7,500mW/cm2. Probes are available in wavelength of 365nm, 400nm, 420nm & 436nm. OAI has a complete certified calibration lab to maintain the performance, quality and reliability of our meters. The Model 659 meter is traceable to NIST standards.
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Product
2D/3D Wafer Metrology System
7980
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Chroma 7980 provides accurate and reliable profile information. 7980 adopts new BLiS technology and specially designed platform to achieve 2D/3D nanoscale measurement.
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Product
MASK MVM-SEM® E3600 Series
E3640
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Ongoing semiconductor process shrinks are driving new demand for stable, highly precise measurement of pattern dimensions for photomask and wafer production. The E3640 satisfies these requirements with industry-leading precision measurement capabilities and upgraded functionality that enhances mask R&D and production efficiency.
