Wafer
thin crystalline material sliced from ingot.
See Also: Wafer Thickness, Wafer Failure Analysis, Wafer Edge, Wafer Resistivity, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Inspection, Probe Cards
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Full Wafer Contact Test System
Fox 1
Unique cartridge technology uses full-wafer contactors combined with parallel test electronics to achieve single touch, full-wafer test
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Wafer Sorter and Inspection
SolarWIS Platform
Eliminating the opportunity for problematic wafers to enter cell manufacturing lines greatly improves output and yield. ASM AE’s wafer sorter features 3D area inspection capability to inspect wafer thickness, total thickness variation (TTV), saw marks, as well as wafer bow and warpage. SolarWIS also includes modules that can inspect for stain, geometry, micro-cracks, edge chips, resistivity, P or N conductivity and lifetime.
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Wafer Bonder
AML
Wafer bonding has found many applications in the field of MST, MEMS and micro engineering. These include the fabrication of pressure sensors, accelerometers, micro-pumps and other fluid handling devices. The process is also used for first-order packaging of silicon microstructures to isolate package-induced stresses. The OAI AML Wafer Bonder facilitates both the alignment and bonding to be performed in-situ, in a high vacuum chamber. For anodic bonding the wafers are loaded cold and heated in the process chamber. For high accuracy alignment the wafers are aligned and brought into contact only after the process temperature has been reached, thus avoiding differential thermal expansion effects which can compromise alignment. The AML Wafer Bonder is excellent for anodic bonding, silicon direct and thermal compression bonding applications. These features enable the bonder to be used with virtually any processing tool.
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Semi-Automatic Contactless Wafer Detector
NCS-200SA
Semi-Automatically, non-contact measurement of wafer thickness, TTV ,bow,Point and flatness.Portable and easy to set-up, the Proforma 300/G measures all wafer materials including Silicon, Gallium-Arsenide, Indium-Phosphide and wafers mounted to sapphire or tape.the powerful software can test all the data above within several seconds,all the design according to SEMI standard and the ASTM,make sure the data can be easily unify. the system can used for several sample size,like 75 mm, 100 mm, 125 mm, 150 mm, 200 mm
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Wafer Analyzer
RAMANdrive
RAMANdrive is the specialized Raman microscope for wafer analysis equipped with our dedicated 300 mm stage. RAMANdrive gives you an ultra-fast, highest resolution analysis of the whole wafer with unique stability and accuracy
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LED Tester For Chip And Wafer
Electrical Testing: Forward：VF,DVF,VFDReverse：VZ,IROptical Testing: can test LOP in cd/mcd/W/mW/lm... from different optical componentsWavelength λp,λd,λc,hw,purity,(x,y),CCT,CRIFour-wire measurement and contact resistance in case of deviation.Auto polarity identification and preheat function.Compatible mechanical interface.Optional ESD static test system or polycrystalline test system
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Wafer Test
WinWay’s commitment to technology, quality and service ensures our interface solutions go above and beyond to exceed your expectations. Our products and services have a proven track record of delivering customer success in semiconductor testing. The Company offers comprehensive test interface solutions ranging from wafer-level test, package-level test to thermal management.
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Wafer Prober
Prexa MS
The latest fully automated 300mm wafer prober for memory devices. Featuring high rigidity and exceptional thermal control, the system enables full-wafer contact testing.
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Wafer/Dicing Frame Prober
WDF 12DP+
The WDF 12DP is a prober/handler capable of transporting and testing standard 300-mm wafers and dicing frames without need of a changeover kit. To support multiple tests after dicing, it has a special positioning function that differs from former types, as well as image-processing functions such as wafer level packaging.
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Fully Automatic 4 Point Probe System for Silicon Wafer
WS-8800
*Measurement of resistivity, thickness, conductivity(P/N) and temperature*Tester self-test function, wide measuring range*Thickness, measurement position and temperature correction function for silicon resistivity*Number of cassette station can be changed by customers request*Host (CIM) communication and SMIF or FOUP compatible
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WAFER MVM-SEM® E3300 Series
E3310
The E3310 is a WAFER MVM-SEM®* for next generation wafers, supporting 1Xnm node process development and volume production at the 22nm node and beyond. With its high-speed carrier system employing a dual arm vacuum robot, and low-vibration platform to improve measurement accuracy, the E3310 delivers high throughput and performance for wafer measurements. Its multi detector configuration and unique 3D measurement algorithm also enable stable, high-accuracy measurement of 3D transistor technologies such as FinFET. The E3310 makes a significant contribution to reducing process development turnaround time and improves productivity for next-generation devices.
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MultiSite Test sockets and Wafer Level
multi-site sockets include anything from strip test sockets to test sockets for wafer test to multi-position, singulated devices. The advantages of these sockets can be enormous as test time can be decreased by a factor of ten over conventional one up testing. In most cases, the throughput is only limited by tester capabilities and/or handling capacity.
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Semiconductor Wafer Defect Inspection Management Software
ProcessGuard
Microtronic ProcessGUARD Software is the desktop client for the EagleView auto macro wafer defect inspection system. ProcessGUARD is a high volume, high speed semiconductor wafer defect inspection management solution that provides an easy-to-use, customizable and extensible platform and interface to automate your fabs defect inspection process. ProcessGUARD is feature rich (see below) and its newest releases include complete wafer randomization software, a user-defined defect library, and an integrated trainer and knowledge base.
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High Resolution Wafer Thickness & Thickness Variation Gauge
MX 10x series
The MX10x series measure thickness and thickness variation on silicon wafers. It has a resolution of 10 nanometers and can be adapted to different thickness ranges within a few seconds.
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Wafer Lifetime Measurement with Photoluminescence Detector
WCT-120PL
Measure the calibrated carrier-recombination lifetime of a silicon wafer using both the standard method and the photoluminescence meth
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Camera Endpoint Monitor based on Real Time Laser Interferometry
LEM Series
Our Real Time Interferometric Process Monitor provides high precision detection of film thickness and trench depth during the etching/deposition process.Depending on applications, LEM camera includes a 670 or 905 or 980 nm laser and when mounted on any dry etch/deposition process chamber with a direct top view of the wafer this generates a small laser spot on the sample surface.Interference occurs when monochromatic light hits the sample surface, resulting in different optical path lengths due to film thickness and height variations in the film.This allows the etch/deposition rate and thus thickness to be monitored in real time, also fringes counting or more complex analysis, providing enhanced process control Endpoint for a wide variety of processes. Additionally interfaces can be detected by their change in reflectivity.
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Automated Wafer Prober for Magnetic Devices and Sensors
Hprobe design and fabricate turnkey automated testing equipment (ATE) for electrical characterization and testing of integrated circuits under magnetic field such as MRAM (Magnetic Random Access Memory) and sensors. In each phase of the technology and product development as well as during mass manufacturing, a dedicated magnetic tester is available.
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Automatic Online Flatness and Surface Appearance System
UltraSort200
The UltraSort continues our 25 year tradition of providing metrology solutions to semiconductor wafer manufacturers. Designed for volume wafer production, this automated system offers superior performance in rapid, repeatable, accurate, noncontact qualification of silicon and alternative substrate wafers.
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Wafer Defect observing instrument
HS-WDI
Application■Semiconductor wafer■Solar wafer■Solar Cell■Thin-film Cell
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±6 kV ANSI/ESDA/JEDEC HBM Test System
HBM-TS10-A
High Power Pulse Instruments GmbH
*±6 kV Human-Body-Model (HBM) tester according ANSI/ESDA/JEDEC JS-001 standard with C = 100 pF, R = 1.5 kΩ discharge network*Wafer, package and system level HBM testing*True HBM: the classical discharge network of the HBM-S1-A according the standard ensures compliant waveforms for all load conditions*No trailing pulses*Integrated 10 kΩ charge removal resistor*Integrated DUT HBM current sensor for real time transient current monitoring with 1V/A output sensitivity into 50 Ω digital oscilloscope input*Integrated DUT HBM voltage sensor for real time transient voltage monitoring with 1/200V/V output sensitivity into 50 Ω digital oscilloscope input*Integrated overvoltage protection of the DUT voltage sensor, DUTcurrentsensor and DC test interface for efficient overload protection of the digital oscilloscope and SMU during high voltage HBM testing*Integrated DC test DUT switch with automatic switch control*Integrated 50 Ω precision hardware trigger output for high speed digital oscilloscopes*Fast HBM measurements, typically 0.5s per pulse including one-point DC measurement between pulses*Eficient sofware for system control and waveform data management (fully compatible with TLP measurement data)*The sofware can control automatic probers for fast measurements of complete wafers*Compact size 145 mm x 82.5 mm x 44 mm of the integrated HBM pulse generator probehead*System controller size 483 mm x 487 mm x 133 mm*High performance and high quality components*Optionally available hardware upgrades to all HPPI fully integrated HBM/HMM/TLP/VF-TLP test systems TLP-3010C, 4010C, 8010A, and 8010C
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EpiStride SiC CVD System
Veeco’s latest technology for the compound semiconductor market enables high-performance chemical vapor deposition of Silicon Carbide for both 6 and 8-inch wafer production. The platform enables a return to production in under 5 hours after routine cleaning maintenance. The EpiStride system’s high uptimes, short cycle times and overall stable performance lead to the lowest cost of ownership per wafer compared to competitive systems.
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Optoelectronics and Photonics
SemiProbe has developed probe stations for a wide variety of optoelectronic and photonic device applications, including light emitting diodes (LEDs), vertical cavity surface emitting lasers (VCSEL) and photo diodes. Testing and handling small, fragile, thin wafers with thousands of die on them poses unique challenges that require innovative solutions.
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Custom Assembly, Packaging and Qualification
DPACI specializes in providing Turn-Key Solutions. We offer comprehensive manufacturing, assembly, qualification, testing, and certification of high reliability EEE components. We have a dedicated, self-contained Class 10,000 clean room with Class 100 laminar flows certified to QML Q (Military) and V (Space) levels to perform all assembly operations from wafer processing to final hermetic package seal
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Probe Cards
PICOPROBE® PROBE CARDS by GGB Industries, Inc., allows for more chip design flexibility because each probe card is custom configured to your circuit for testing wafers on either manual or automatic probe stations. Probe cards with complex layouts consisting of numerous DC contacts and multiple microwave probes with operating frequencies of 40, 50, 67, or 110 GHz can be custom fabricated quickly and inexpensively.
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Data Analytics
KLA’s data analytics systems centralize and analyze the data produced by inspection, metrology and process systems. Using advanced data analysis, modeling and visualization capabilities, our comprehensive suite of data analytics products support applications such as run-time process control, defect excursion identification, wafer and reticle dispositioning, scanner and process corrections, and defect classification. By providing chip and wafer manufacturers with relevant root cause information, our data management and analysis systems accelerate yield learning rates and reduce production risk.
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Process & Material Characterization System
TriboLab CMP
Bruker’s TriboLab CMP Process and Material Characterization System has been designed from the ground up specifically for reliable, flexible, and cost-effective bench characterization of waferpolishing processes. Small R&D-scale specialty system for CMP. Reproduces full-scale wafer polishing process conditions without downtime on production equipment. Provides unmatched measurement repeatability and detail. Allows testing on small coupons for substantial cost savings over whole-wafer testing.
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Portable Wafer Probe Station
PS-5026B
High Power Pulse Instruments GmbH
The PS-5026B is a rugged portable wafer probing solution which has been designed for high reliability, compact size and minimum cost.
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Semiconductor
Engineered ceramics are used in the semiconductor industry because of their excellent material properties. Ultra-pure ceramics are often used in the whole cycle of semiconductor manufacturing including Semiconductor Wafer & Wafer Processing, Semiconductor Fabrication (Front End), and Semiconductor Packaging (Back End).
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Sensor
Lepton
The FLIR Lepton™ is the most compact longwave infrared (LWIR) sensor available as an OEM product. It packs a resolution of 80 × 60 or 160x120 pixels into a camera body that is smaller than a dime. This revolutionary camera core is poised to equip a new generation of mobile and handheld devices, as well as small fixed-mount camera systems, with thermal imaging capabilities never seen before. Lepton contains a breakthrough lens fabricated in wafer form, along with a microbolometer focal plane array (FPA) and advanced thermal image processing. In order to support the lepton and make it easy to use, we have developed a breakout board to support the module along with example source code. Please see the Lepton Thermal Camera Breakout Datasheet for more information.
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ECHO VS System with Image Enhancement
Echo VS
The ECHO VS system adds our Image Enhancement Suite to the ECHO platform to provide industry-leading image quality and defect identification capabilities. It’s our most accurate ultrasonic NDT equipment for development labs and for production environments that require the highest precision. The Echo system can be fitted with an optional chuck for manual wafer inspection.
