Wafer
thin crystalline material sliced from ingot.
See Also: Wafer Thickness, Wafer Failure Analysis, Wafer Edge, Wafer Resistivity, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Inspection, Probe Cards
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AI ANALYZER
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Nanotronics uses artificial intelligence to give our customers’ unprecedented freedom and control for defect detection. We offer an AI based Anomaly Detection Algorithm (ADA) toolkit that automates the work of writing computer vision algorithms to detect and classify defects on bare substrate and epi wafers as well as on thin films, glass and any other material with a uniform background.
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Bond Tester for Wafers 2 - 12 inch
Sigma W12
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Bondtester for wafers or at wafer level 2” – 12” (up to 300 mm)Precise testing and Cold Bump Pull (CBP) testingLarge X/Y stages X: 600mm, Y: 370 mmForce range from 1gf – 10 kgfBump pitch down to 20 µm
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Semiconductor
DieMark
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DieMark Inking Systems are available in Electric and Pneumatic models and utilize convenient, disposable DieMark Ink Cartridges to streamline and optimize the process of marking defective die. With models available for nearly every test platform and configuration, Xandex inking systems are in operation daily in every corner of the world where wafer sort is performed.
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Software Options
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Sonix offers powerful wafer software tools to enhance bonded wafer imaging, accelerate production and adapt AutoWafer and AutoWafer Pro to our customers’ specific requirements.
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Test Contactor/Probe Head
xWave
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Highest performance and most robust RF broadband production solution for package, wafer, or Over-the-Air (OTA) test for 100 GHz.The xWave™ test contactor / probe head utilizes patented hybrid contacting technology to optimize RF performance and provide robustness for production testing of the most challenging cmWave and mmWave devices. Inside the xWave test contactor / probe head are embedded patch antennas and coplanar waveguides for both wireless and wired communication.
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Machine Vision Computers
AIIS Series
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Advantech AIIS Series are closely aligned with Machine Automation applications such as Automated Optical Inspection (AOI), Wafer Inspection, and alignment inspection which heavily rely on machine vision.
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Semiconductor Metrology Systems
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MTI Instruments'' semiconductor wafer metrology tools consist of a complete line of wafer measurement systems for virtually any material including Silicon wafer (Si), Gallium Arsenide wafer (GaAs), Germanium wafer (Ge) and Indium Phosphide wafer (InP). From manual to semi-automated wafer inspection systems, the Proforma line of wafer metrology inspection tools is ideal for wafer thickness, wafer bow, wafer warp, resistivity, site and global flatness measurement. Our proprietary push/pull capacitance probes provide outstanding accuracy throughout their large measurement range, allowing measurement of highly warped wafers and stacked wafers. MTII''s solar metrology tools include off line manual systems for wafer thickness and Total Thickness Variation (TTV), as well as, in-process measurement systems capable of measuring wafer thickness, TTV and wafer bow at the speed of 5 wafers/second.
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Ultra Pure Pressure Switch
W117G
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The W117G Ultra Pure Stainless Steel Pressure Switches have all welded stainless steel interiors which are Helium leak checked to pass 4 x 10-9 Std CC/Sec. These switches are used in silicon wafer ovens, numerous medical devices and other applications where even the slightest impurities are not tolerated.
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Thermal Engineering Projects
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Precision Development Consulting Inc
Open loop temperature controller, LED process tool, Single wafer CVD chamber, Batch CVD Tool, Batch ALD Tool, MOCVD equipment, Device cooler
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Solar Cell PL/EL/IV 3-in-1 Testing System
VS6841
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Industrial Vision Technology Pte Ltd.
This luminescence Analyzer integrates a Photoluminescence (PL), Electroluminescence (EL) , and I-V Measurement Technology, has a Device’s PL image, EL image, as well Device’s I-V characteristics in One system. It is being using to quantitatively map Minority-Carrier Lifetime, and to characterize the defect of silicon wafer & solar wafer, and measure the key parameters from solar cell I-V Curve. It is also a useful tool for scientist to develop other methodology & parameters that can be used as a promising technique for online material monitoring and process control.
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Firmware Engineering Projects
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Precision Development Consulting Inc
Hand control module for teleprompter, Analog data acquisition and filtering, High-Power Arc Lamp Power Supply Controller and RTP gas flow and Vacuum System controller, Disk drive company test racks, Disk Drive Spindle Motor Tester, Disk Drive Head Stack Tester, Wafer photoresist coating and development system control PC boards, Nuclear Plant secondary water temperature monitor
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Infrared Microscope
DDR200 & DDR300
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The McBain DDR200 and DDR300 for 200mm and 300mm wafer defect detection and review are unmatched in value and features in this special application and price category. The systems offer significant and unique advantages for both production and engineering use, and provide an ideal solution when both defect detection and dimensional metrology are required.
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In-situ Wafer Temperature Monitoring
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CI Semi's family of noncontact temperature monitors (the NTM line), offers high end pyrometry products for the measurement of wafer temperatures during process. CI Semi’s flag ship of the line, the NTM Delta, incorporates real-time, same point emissivity measurement and compensation making it the ideal solution for in situ monitoring for processes such as RTP, CVD and PVD. The NTM family is sold to leading tool manufacturers.
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Non-Contact Mapping Life Time System
MWR-2S-3
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The device is designed for express non-destructive contactless local measurement of non-equilibrium charge carrier effective lifetime in silicon substrates, epi-wafers and solar cells at different stages of manufacturing cycle. It can be used for incoming and outcoming inspection of silicon ingots and wafers, tuning and periodic inspection of semiconductor and solar cell technology quality. Lifetime determination is based on measuring photoconductivity decay after pulselight photo-exciting with usage of reflected microwave as a probe.
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Manual Semiconductor Metrology System
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Front USB port enables easy storage of measurements and other data to flash drivesMTI Instruments’ Proprietary Capacitance Circuitry for Outstanding Accuracy and DependabilityNon-contact measurements76-300 mm diameter wafer rangeOptional wafer measurement ringsWafer stops for exact centeringEthernet interfaceFull remote control software (Windows compatible)Optional calibration wafers
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Probe Series
CAPELLA Series
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MPI Photonics Automation is the industry leading provider of turnkey test solutions for the LED / Mini LED manufacturing industry. With more than 10,000 MPI probers installed worldwide, the CAPELLA series of probers have a proven track record of superior performance and reliability. The CAPELLA series probers support electrical and optical characterization of all LED product types (Vertical chip, Lateral chip, Flip-chip) from wafer to packaged die level. Whether you need a high-performance, cost-effective or specialty prober system, MPI PA has the most comprehensive range of LED wafer/chip probers to meet your exacting requirements.
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WATOM
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Wafer edge and notch profile measurementThe use of smaller and smaller patterns in the semiconductor industry calls for increasingly advanced materials of extremely high quality. In response to the steady improvements in the quality of wafers, KoCoS Automation has developed WATOM, a wafer edge and notch profile measurement tool which heralds a new era of extremely precise wafer geometry measurement.WATOM supports quality assurance throughout the wafer manufacturing process, starting at the very beginning and continuing on through to wafer reclaim.The WATOM Edge and Notch Wafer Geometry Analyser sets the worldwide benchmark for the quality assurance of geometrical measurements in semiconductor wafer manufacturing, combining the highest quality standards with top-class service. These high-precision, laser-based edge profile measurement tools are specially designed for optimum integration in manufacturing lines within the semiconductor industry.
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Impulse Semiconductor High Current Integrated
Transmission Line Pulse Test System
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The Impulse Semiconductor High Current Transmission Line Pulse (TLP) test system is the tool of choice for extracting ESD parameters for transient protection devices in a package, or at wafer level. With accuracy better than 100 milliohms at 40 amps peak current, the Impulse high current TLP is specially tailored to the needs of today's ESD device designers who must accurately measure low values dynamic resistance irrespective of breakdown voltage.
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Wafer-Level Parametric Test
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Wafer-level reliability engineers need to reduce test time without sacrificing measurement quality and accuracy.
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Probe Cards
Direct Dock
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Direct dock style wafer probing allows for a higher bandwidth, increased pin density and testing more devices in parallel. Direct dock probe cards also support the growing movement of traditional final test to wafer probe which allows for known good die (KGD) and reduced cost of ownership.
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EasyEXPERT Group+ Software (for PC)
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Keysight Easy EXPERT group+ GUI based characterization software is available for Keysight Precision Current-Voltage Analyzer Series. It is available on your PC or the B150xA's embedded Windows 7 platform with 15-inch touch screen to accelerate the characterization tasks. It supports efficient and repeatable device characterization in the entire characterization process from measurement setup and execution to analysis and data management either interactive manual operation or automation across a wafer in conjunction with a semiautomatic wafer prober. EasyEXPERT group+ makes it easy to perform complex device characterization immediately with the ready-to-use measurements (application tests) furnished, and allows you the option of storing test condition and measurement data automatically after each measurement in a unique built-in database (workspace), ensuring that valuable information is not lost and that measurements can be repeated at a later date. Keysight Precision Current-Voltage Analyzer Series provides the complete solution for device characterization with these versatile capabilities.
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Test Contactor/Probe Head
cBoa
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cBoa™ test contactors and probe heads are the solutions for contacting high-frequency devices for package test or final test at wafer. The robust design and materials of the cBoa probe withstand the rigors of high-volume test by providing longer life and higher yield. The homogeneous DUT side plunger provides longer run times between cleaning and increased probe life.The cBoa features a stainless-steel spring for tri-temp testing and performs in operating temperatures of -55°C to +155°C and bandwidth of up to 35 GHz @ -1 dB.
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Silicon Heavy-doped Pen Tester
HS-MPRT
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Heavy doped testing, especially good for purchase the material.■ Not only sound alarm, but also Led light alarm , to guarantee sorting work accurately.■ adaptable for sorting little granular material, little broken IC Wafer and other little silicon material.■ Can set alarm ranges from 0.0 to 1.0Ω﹡㎝.
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X-ray Inspection Performance
MXI Quadra 7
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Ultimate image quality and magnification, Quadra 7 reveals quality defects as small as 0.1 µm. Ideal for root cause failure analysis, wire bond integrity checking, component cracking, MEMS inspection and wafer level components including TSV and wafer bumps.
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Automatic Online Flatness and Surface Appearance System
UltraSort200
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The UltraSort continues our 25 year tradition of providing metrology solutions to semiconductor wafer manufacturers. Designed for volume wafer production, this automated system offers superior performance in rapid, repeatable, accurate, noncontact qualification of silicon and alternative substrate wafers.
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The Lorlin© Impact Series
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Discrete Component Tester is designed to test small signal and power semiconductor components in both single and multi-device packages or hybrids.. The automatic test system can be used in all test applications including incoming inspection, wafer probe, QC, engineering, production, final test, and high reliability. The system tests most all discrete semiconductors with reliable, accurate, and repeatable results.
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IC Test Services
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With knowledge gathered from decades of supporting Tier 1 and emerging industry leaders, Amkor understands test solutions must address advanced technology, quality, performance and cost of test. We offer full turnkey solutions including wafer processing, advanced bump, wafer probe, assembly, final test, system-level test, burn-in and end-of-line services.
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Control Systems Projects
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Precision Development Consulting Inc
Fast Open Loop temperature control system, Batch CVD temperature control system, Single Wafer Temperature control system, Disk Drive Spindle Motor Control, Wafer Indexer Motor Control
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On-Wafer Measurements
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Accurate DC/CV (and RF) statistical modeling of semiconductor devices requires collecting a significant amount of measured data from different wafers across several temperatures. Keysight Technologies recommends IC-CAP WaferPro as a turn-key DC/CV and RF automated characterization solution to help modeling and device engineers achieve more efficient on-wafer measurements across temperature. This new breakthrough solution is based on IC-CAP modeling software and efficiently controls DC/CV analyzers, network analyzers, probers, switching matrixes, and temperature chucks, as well as the powerful 407x and 408x Series of Keysight parametric testers.
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Multiple Angle Reflectometry
FilmTek 4000
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Scientific Computing International
Fully-automated wafer metrology optimized for photonic integrated circuit manufacturing. Delivers unmatched measurement accuracy, with a 100x performance advantage over the best non-contact method and 10x that of the best prism coupler contact systems. Designed to enable optical component manufacturers to increase functional yield of their products, reliably and at lower cost.





























