Wafer Failure Analysis
Defines the failure mode and then through additional testing determine it's cause.
See Also: Wafer, Wafer Thickness, Wafer Edge, Wafer Resistivity, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Inspection
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Gas Analysis
HPR-40 DSA
Hiden Analytical offers class-leading gas monitoring solutions designed to obtain and quantify complex species in liquid samples. Our ultra-precision HPR-40 DSA is a compact membrane inlet mass spectrometer (MIMS) and a versatile instrument suited to dissolved and evolved species analysis. Direct probes, flow through probes and large circular membrane cells are available to address a broad application range in sediment, sea water, sludge and groundwater studies.
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Gas Analysis
Si-CA 130
The Si-CA 130 features a touch-screen display and comes with PC-based management software (in addition to the smartphone app) for more in-depth combustion gas analysis. The three field-replaceable cells and sensors offer expanded measurement capability.
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Sematech Analysis and SEMI Standards Analysis
Rocky Mountain Laboratories, Inc.
Rocky Mountain Laboratories, Inc. provides SEMI Standards analyses that conform to the following SEMATECH and SEMI Standards for testing of passivated 316L stainless steel components being considered for installation into a high-purity gas distribution system:SEMASPEC #90120401B-STD (SEM Analysis)SEMASPEC #90120402B-STD (EDS Analysis)SEMASPEC #90120403B-STD (XPS Analysis)SEMASPEC #91060573B-STD (Auger (AES) Analysis)SEMI F60-0306 (based on F60-0301) (XPS Analysis)SEMI F72-1102 (Auger (AES) Analysis)
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Root Cause Failure Analysis
Maintenance Reliability Group, LLC
Root Cause Analysis of Grease Lubricated Components: Root cause analysis includes a complete root-cause failure report and recommendations for further monitoring and corrective actions. MRG will test for grease consistency, oxidation, product contamination and wear metals utilizing Grease Thief® Analyzer die extrusion test, FTIR, RULER and RDE Spectroscopy. Testing includes Analytical Ferrography and Rheometer testing. Testing can include the submission of a failed component for extraction of grease from failed component and visual inspection for Root Cause Analysis.Root Cause Analysis of Grease Lubricated Components: Root cause analysis includes a complete root-cause failure report and recommendations for further monitoring and corrective actions. MRG will test for grease consistency, oxidation, product contamination and wear metals utilizing Grease Thief® Analyzer die extrusion test, FTIR, RULER and RDE Spectroscopy. Testing includes Analytical Ferrography and Rheometer testing. Testing can include the submission of a failed component for extraction of grease from failed component and visual inspection for Root Cause Analysis.
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Image Analysis
In today's demanding environment where quality assurance is an everyday requirement Aprotec have sought to find present day retrofit solutions that compliment fully functional older machinery.
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N/Protein Analysis
Elementar Analysensysteme GmbH
The determination of the total protein content is an essential tool for quality control and protein declaration according to international labeling laws in the food & feed industry and research facilities. Since the protein content can directly correspond to product properties, highly precise, matrix-independent protein analyses are required in all application areas.Our N/protein analyzers use the high-temperature combustion method according to Dumas, which has clear advantages over Kjeldahl regarding laboratory safety, sample throughput, labor time, amount of chemical waste and thus cost-per-analysis. Our analyzers for the determination of nitrogen and protein are dedicated instruments serving today’s customer needs in regards to price-per-sample, throughput and sensitivity.
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Wafer Flatness Measurement System
FLA-200
*Measures Thickness, TTV, Bow, Warp and site and global Flatness (ASTM compliance)*Measures all materials including Si, GaAs, Ge, InP, SiC*Full 500 micron thickness measurement range without re-*calibration2-D /3-D Mapping software
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CS/ONH-Analysis
G4 ICARUS Series 2
The combustion analyzer G4 ICARUS Series 2 with high frequency (HF) induction furnace and HighSense™ detection sets new standards in for a rapid and precise carbon (C) and sulfur (S) analysis in inorganic solids.
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Semiconductor Wafer Microscope Inspection System
MicroINSPECT
MicroINSPECT Semiconductor Wafer Defect Microscope Inspection System combines state-of-the-art robotics, intelligent microscopes and SITEview software to provide a flexible, easy-to-operate defect inspection platform for either micro or macro defect wafer inspection.
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Testability analysis
Using TestWay, ASTER provides advanced Testability report, Rules checking for In-Circuit Test, Functional Test and Boundary-Scan test. Test point optimization – Up to 70% of test points saved, automated backannotation to CAD system and CAD/CAM/CAT tools.
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Wafer Auto Line Integration
The line is used for semiconductor wafer grinding. It carries out material matching and distribution, automatic loading and unloading, auto focusing and positioning and many other functions. The grinding precision is 2μm(3-sigma). It is also capable of collecting and analyzing real-time production data and interfacing with MES system.
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Testability Analysis
TurboCheck
TurboScan is an advanced full-scan and partial-scan test suite. It includes a Scan Synthesizer and an Automatic Test Pattern Generator (ATPG). TurboScan automatically repairs testability violations to make your design highly testable.
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Wafer Lifetime Measurement with Photoluminescence Detector
WCT-120PL
Measure the calibrated carrier-recombination lifetime of a silicon wafer using both the standard method and the photoluminescence meth
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Signal Analysis
FFT Analysis
The program FFT (Fast Fourier Transform) Analysis is used for narrow-band spectral processing of signals coming from the input channels of ADC modules and FFT spectrum analyzers (in real-time or recorded time realization view mode), as well as for viewing various spectral characteristics of signals.
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Signal Analysis
Super-Resolution Spectrum
Super-resolution Spectrum is used for spectral signal analysis with high frequency resolution. The program is used in diagnostics and monitoring systems of buildings and for analyzing non-stationary signals. The Software enables solving the following tasks:
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Industrial Gas Analysis
I Series
For years, MIDAC has provided customized solutions for demanding gas analysis applications. This accumulated experience uniquely qualifies us to provide "total solutions" for virtually any gas analysis need - from environmental to industrial process applications. The versatility of I-Series gas analysis systems enables us to work with you to configure a system that will deliver precisely the information you need.
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Combustion Analysis System
DS-3000 Series
With the ongoing research and development for improving combustion technologies (HCCI, EGR, etc.), new power sources (HEV and PHEV) and new fuels (biodiesel and natural gas) , development of more fuel-efficient and smaller engines are demanded. The DS-3000 series Engine Combustion Analyzer meets such growing expectations with the new, more powerful hardware.
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Real-Time Broadcast Analysis
Mediaproxy provides a comprehensive suite of software-based analysis applications to help you attend to on-air issues quickly and resolve them efficiently. Employing the latest user interface technologies, complex analysis tasks are made easy and seamless, including your mobile devices.
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Wafer and Cells PL System
HS-PL
Photoluminescence (PL) Imaging is a unique non-invasive inspection tool as it can be used in-line at many different steps of the cell manufacturing process. This facilitates the direct comparison of data obtained at one process step to data obtained at another. Additionally, PL imaging can be compared to electroluminescence (EL) imaging on finished cells using comparable equipment.
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Self-Discharge Analysis Software
BT2155A
The Keysight BT2155A self-discharge analysis software, controlling the BT2152A or BT2152B self-discharge analyzer, measures and records Li-Ion cell self-discharge current and cell voltage. The software configures the analyzer’s channel settings, such as initial voltage and current matching, channel limits (OVP, OCP, UVP), measurement intervals, and test duration.
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WDS Analysis System
Lambda
The Lambda™ Wavelength Dispersive Spectrometry (WDS) Analysis System combines the EDAX WDS software with state-of-the-art spectrometers for improved accuracy and precision, guaranteeing the best results for your materials analysis.
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Wafer Bonder
AML
Wafer bonding has found many applications in the field of MST, MEMS and micro engineering. These include the fabrication of pressure sensors, accelerometers, micro-pumps and other fluid handling devices. The process is also used for first-order packaging of silicon microstructures to isolate package-induced stresses. The OAI AML Wafer Bonder facilitates both the alignment and bonding to be performed in-situ, in a high vacuum chamber. For anodic bonding the wafers are loaded cold and heated in the process chamber. For high accuracy alignment the wafers are aligned and brought into contact only after the process temperature has been reached, thus avoiding differential thermal expansion effects which can compromise alignment. The AML Wafer Bonder is excellent for anodic bonding, silicon direct and thermal compression bonding applications. These features enable the bonder to be used with virtually any processing tool.
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Data Analysis
Power Monitoring and Diagnostic Technology Ltd.
PMDT Engineers are always available to review your test samples and to provide guidance to users in the field. Our PD experts have the ability to accurately analyze various types of field test data based on PRPD/PRPS spectrums, waveforms and audio files collected during a field test.
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Thermal Testing And Analysis
Response Dynamics Vibration Engineering, Inc.
We have consulted on thermal issues ranging from conduction issues in TECs, thermal radiation modeling, and countless air cooled system issues relating to system performance, vibration, and acoustics noise. We use a wide array of thermocouple instrumentation, thermal imaging, flow measurements, as well as finite element analysis and analytic modeling to measure, design, and debug thermal and related issues. We often work on customer products in our Response Dynamics lab where we characterize the system, engineer solution options, and prototype solutions. We then work with the customer to work the winning solution into their quality control and manufacturing process.
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ESPI Analysis Application
TP601010
First released by Intel in June 2013, the Enhanced Serial Peripheral Interface (“eSPI”) is designed as a replacement for the Low Pin Count (“LPC”) bus. eSPI supports communication between Embedded Controller (EC), Baseboard Management Controller (BMC), Super-I/O (SIO) and Port-80 debug cards. eSPI was available in the Sky Lake chipset (2015) and is available in the Kaby Lake [current] chipset. Cannonlake will support eSPI and is slated for release the second half of 2017. Icelake is scheduled for release in 2019 and it will mark the first chipset when eSPI becomes mandatory.
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Wafer Sort
TestEdge offers complete wafer sort solutions. Our range of wafer sort capabilities demonstrates our ability to handle a wide range of devices and device characteristics. State of the art Electroglas probers Sort experience with high probe count Less than 4 mil pitch on probes Experience with C4 Bump and Aluminum pad Experience on Bipolar, CMOS, GaAs, & SiGe Overhead sort or cable harness sort Microsite testing capability
