Chip
Passive or active components test and their interconnected circuitry in silicon or germanium.
See Also: Integrated Circuit, IC
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Product
Chip Manufacturing
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KLA’s advanced process control and process enabling solutions support integrated circuit manufacturing. Using KLA’s comprehensive portfolio of defect inspection, review, metrology, patterning simulation, in situ process monitoring and data analytics systems, IC manufacturers can manage yield and reliability throughout the chip fabrication process - from research and development to final volume production. SPTS provides deposition process solutions for insulating materials and conducting metals that cover a range of chip manufacturing process steps. IC manufacturers use KLA's array of products and solutions to help accelerate their development and production ramp cycles, to achieve higher semiconductor die yield and improved IC quality, and to improve overall profitability in the IC manufacturing process.
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Product
Simics
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With Wind River® Simics® you can simulate anything, chip to system, giving you a path to DevOps and Continuous Integration and Deployment.
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Product
USB-8452, 3.3 MHz I2C, 50 MHz SPI I2C/SPI Interface Device
781964-03
Interface Module
The NI USB‑8452 is a master interface for connecting to and communicating with inter-integrated circuit (I2C) and serial peripheral interface (SPI) devices. With plug‑and‑play USB connectivity, the USB‑8452 is a bus-powered, portable solution to communicate with consumer electronics and integrated circuits. It also includes eight general-purpose digital I/O lines for a variety of applications, such as configuring the address of I2C devices, toggling LEDs, or strobing convert and data ready lines common to analog converter chips. You can physically place the USB‑8452 more closely than PCI interfaces to I2C/SPI devices, which reduces I2C bus length and minimizes noise problems. Additionally, the interface provides +5 V and GND to power circuits with no external power supply.
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Product
Solid State Power Amplifiers
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Skylink SSPAs incorporate state-of-art DPD and well-done Heat Dissipation technologies with available LDMOS, GaN & GaAs Chips. Solutions of SSPA frequency range from 9kHz to 50GHz and output power up to kilowatts and includes basic PA modules to integrated chassis with embedded software for local and remote control and monitoring.
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Product
Resister
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Our ARFC type Film Flat Chip Resistor & ARFCN type Thin Film Chip Resistor Network are high precision Metal Film resistors produced with high purity. Alumina Substrate and Ni-Cr-Si Resistor Film based on high precision Etching Technology. The electrode Terminals are made with Spattering Film and Nickel-Solder Plating, and solderability is very good in all Flow, Reflow and Dipping type soldering for Hybrid IC, SMT, PCB etc. Our ARFC Metal Film Resistor & ARFCN type Thin Film Chip Resistor are being produced under the thorough quality control, and are being used widely in high precision and high reliability electronics circuit such as Measuring Instrument, Medical Instruments, Communication and other Industrial Instruments.
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Product
Reliability Testing
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ELES Semiconductor Equipment SpA
ELES designs and manufacturers reliability test solutions to verify the performance of integrated circuits from concept validation to high volume production during all the test phases. No other company can provide universal equipment for all the reliability tests, or can guarantee a seamless data flow between phases or can apply on chip embedded reliability engineering for data tracking and failure investigation. Clients use our functional test data to proactively analyse variations between lots, between temperature extremes and during lifetime (often these defects escape ATE). The improvements to products and processes needed to arrive at zero defects cannot be driven by the quantity of Big Data alone, the quality of reliability data is a strategic advantage that only ELES can provide.
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Product
13MP MIPI Camera Module
e-CAM130_CUMI1820_MOD –
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e-CAM130_CUMI1820_MOD is a 13MP MIPI Camera Module. This small form factor 13MP camera module comes with S-Mount lens holder. It is based on AR1820HS – an 18MP CMOS Image sensor from Aptina™ / ON Semiconductor® and has a dedicated, high-performance Image Signal Processor chip (ISP) on-board that performs all the Auto functions (Auto White Balance, Auto Exposure control) in addition to complete image signal processing pipeline that provides best-in-class images and video and the optional MJPEG compression. Though the AR1820HS is an 18MP image sensor, the e-CAM130_CUMI1820_MOD supports only up to 13MP resolution.
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Product
2D CMOS Image Sensor
Lince6M5
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Lince6M5 is a single chip, fully digital, high speed CMOS active pixel sensor which is designed for maximum flexibility. It has excellent performance in a large variety of applications, ranging from low noise, high dynamic range surveillance, to high speed slow motion analysis, including high resolution machine vision applications. Lince6M5 incorporates a high speed 6.5MP CMOS active pixel image sensor providing both global and rolling electronic shutter, as well as High Dynamic Range (HDR) features. The sensor array utilizes active CMOS pixels with pinned photodiodes to deliver high image quality whilst maintaining the size, cost, and integration advantage of the CMOS technology.
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Product
UDIMM
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UDIMM (Unbuffered Dual In-line Memory Module) is the most common type of RAM used in desktop computers, laptops, and consumer-grade workstations, designed for high speed and direct communication with the CPU. They are "unbuffered," meaning no buffer sits between the memory controller and chips, offering lower latency.
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Product
KV CAPS
200 V
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Macom Technology Solutions Holdings Inc.
The MACOM KV CAPSTM Si high voltage capacitors feature very high working voltage ratings, very low loss and excellent stability by virtue of their novel internal construction and very high-quality dielectric layers. These capacitors are available as unpackaged chips. The chips have gold bonding surfaces on both terminals to enable excellent bonding and minimum contact resistance.
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Product
16GB SO-DIMM DDR5-5600 262Pin 2GX8 1.1V Unbuffered Hynix Chip
AQD-SD5V16GN56-HB
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Hynix Original Chip, Increased Banks and Burst Length, DDR5 5.6GT/s. Same-Bank Refresh, On-die ECC for Enhanced RAS.
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Product
PC/104 Low-Power SBC with Vortex86DX CPU and Data Acquisition
HELIOS
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Helios is a low power, mid-range performance PC/104 form factor single board computer combining a highly integrated CPU with Diamond Systems’ renowned high-accuracy data acquisition circuitry on a single board, reducing size and cost while increasing ruggedness. Helios utilizes a Vortex integrated single chip CPU operating at 800MHz or 1GHz, and 256MB of DRAM soldered on-board.
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Product
Combination Board Tester
ATE QT2256-640 PXI
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Qmax Test Technologies Pvt. Ltd.
Most commercial ATEs does only functional test and do not carry out DC/AC parameter testing, which are very essential in increasing the fault coverage and for achieving near zero field returns. The testing challenges get worse when the boards are equipped with BS compatible components, DSP chips and CPUs or micro controller based boards. ATE QT2256-640 PXI system is designed as a combination board tester capable of testing highly complex and PCBs employing various techniques on a single platform. It can be easily upgraded to 640 digital channels and with programmable UUT power supplies, IEEE or PXI external instrumentation, Bus cycle signature system, ICE and integrated Boundary scan Test AC/DC parametric testing. The ATE is interfaced to an external host PC using a PCI express interface card allowing a maximum data transfer rate. Most commercial ATEs does only functional test and do not carry out DC/AC parameter testing, which are very essential in increasing the fault coverage and for achieving near zero field returns. The testing challenges get worse when the boards are equipped with BS compatible components, DSP chips and CPUs or microcontroller based boards.
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Product
High Performance Netlist Debugging and Netlist Viewing
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GateVision PRO is the third generation of graphical gate-level netlist analyzers and netlist viewers from Concept Engineering. Please check out the Demo Video: Basic Features. Completely rewritten to run on modern 32/64bit platforms, GateVision PRO provides the designer of even the largest chips and SoCs with intuitive design navigation, netlist viewing, waveform viewing, logic cone extraction, interactive logic cone viewing for netlist debugging and design documentation.
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Product
Ethernet
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Arasan Chip Systems has a complete portfolio of Fast (10/100) Mbps and Gigabit (10/100/1000) Mbps and now 10Gigabit Ethernet IP. Our high quality IP has completed the rigorous interoperability tests at UNH-IOL laboratories and has been widely licensed. Arasan also provides a portable Ethernet driver.
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Product
Automotive System-on-Chip (SoC)
R-Car
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"R-Car" is the nickname for Renesas' system-on-chip (SoC) family for car information systems designed for the next-generation of automotive computing for the age of autonomous vehicles.
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Fully Compliant ASi-5 Transceiver ASSP
ASI4U-V5
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The ASI4U-V5 is the industry’s first silicon solution to fulfill the ASi-5 (Actuator-Sensor-Interface version 5) standard for industrial network equipment that enables comprehensive Industry 4.0 applications. The ASI4U-V5 ASSP comes with a completely verified and field-proven firmware that fully implements ASi-5. Hence, integration of ASi-5 into any application is very easy, as the complexity of the fieldbus is hidden by the chip and the firmware.
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Product
COM Express Compact Size Type 6 Module Intel Atom® E3900 series, Pentium®, and Celeron® SoC (formerly Apollo Lake)
cExpress-AL
Computer on Module
The cExpress-AL is a COM Express® COM.0 R3.0 Type 6 module supporting the Intel Atom® processor, Intel® Pentium® processor and Intel® Celeron® processor system-on-chip (SoC). The cExpress-AL is specifically designed for customers who need optimized processing and graphics performance with low power consumption in a long product life solution.
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Receivers
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SDR receivers (Software Defined Radio) perform all signal processing in software, offering multi-standard support, access to all data in the channel, and advanced RF measurements.DekTec's other receivers are based on standard demodulator chips and therefore do not take cycles from the host CPU. These can be used if the SDR features are not required.
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Product
3D-IC Solution
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Consumer demand for increased bandwidth and low power in smaller form factor has forced design teams to pursue design and manufacturing alternatives to single system-on-chip (SoC) approaches. Moving to advanced geometries like 20nm/14nm is a natural progression; however, it has its own cost, yield, manufacturing, and IP reuse challenges.
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Product
Probing Machines
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Probing machine is a wafer transfer and positioning device used for testing the electrical characteristics of chips formed on wafers. This wafer test is used to sort out good and defective chips.
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Product
Integrated Potentiostat and Multiplexer
EmStatMUX8
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Based upon the EmStat range, there are two types of multiplexers to suit most types of sensor array work. The MUX8 is the most flexible offering the ability to connect arrays made of up to eight working electrodes in two or three electrode cell types and chips sharing a reference electrode and/or counter electrode.
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Product
3U OpenVPX High Density Multifunction I/O Board
68CB6
Multifunction I/O
The 68CB6 is a Configurable Open Systems Architecture™ (COSA®) 3U OpenVPX™ board that is preconfigured with 10 different “inboard” I/O, measurement and communication functions. This Combination-function Board (CB) provides a full suite of some of the most common & useful function interfaces supporting many different applications. The 68CB6 features a wide but dedicated selection of functions: Standard Functionality Discrete I/O (DT1); Successive Approximation Register (SAR) ±100 V Analog-to-Digital (AD); Isolated High Voltage Analog-to-Digital (ADF); ±10 V Digital-to-Analog (DA); Thermocouple (TC1) or Resistance Temperature Detector (RT1); Full-bridge Strain Gauge (SG1); Transmission/gear box Chip Detection and Fuzz Burn (CD1); LVDT-to-Digital linear (LD6) displacement (position) measurement, AC Reference Source output (AC2); CAN bus communication (CB8). The 68CB6 offers unparalleled programming flexibility, a wide range of operating characteristics, and a unique design that eliminates the need for external intermediate circuit considerations such as pull-up resistors or mechanical configuration jumpers. Inboard functions are software controlled and memory addressed, accessed in similar COSA® modular fashion to maintain seamless common NAI Software Support Kit & API/library structures.
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Product
Embedded Development Kit
TySOM
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The TySOM Embedded Development Kit is for the embedded designer who needs a high-performance RTL simulator/debugger for their embedded applications such as IoT, Factory Automation, UAV and Automotive. The kit includes Riviera-PRO Advanced Verification Platform and a Xilinx Zynq development board that contains single Zynq chip (FPGA + Dual ARM Cortex-A9), memories (DDR3, uSD), communication interfaces (miniPCIe, Ethernet, USB, Pmod, JTAG) and multimedia interfaces (HDMI, audio, CMOS camera).
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SMARC® Short Size Module with Intel® Pentium™ and Celeron™ Processor N3000 Series SoC (codename: Braswell)
LEC-BW
Computer on Module
The LEC-BW Computer-On-Module (COM) combines the SMARC® 1.1 standard with the Intel® Pentium® and Celeron® N-series System-on-Chip (SoC), providing an ideal solution for low power consumption and high performance requirements. The module provides the high integration, high performance, low power, and ruggedness favored by Internet-of-Things (IoT) applications such as retail transactional clients, digital signage, and in-vehicle infotainment systems.
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Product
AMC GBit link card/VITA 57 FMC carrier
SIS8100
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The SIS8100 will be a single width mid height AdancedMC card. It will interface with a single PCI Express lane over a PLX Technology PEX811 PCI Express to local bus bridge chip and have an on board Virtex IV FPGA. The default stuffing option has a Small Form Factor (SFF) optical link medium that can be operated at 1, 2.5 and 4 GBit/s.
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Receiver Conformance Test Application for IEEE 802.3bm
M8091BMCA
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IEEE 802.3bm Receiver Test Application for 25GAUI-1 Chip-to-Module, Chip-to-Chip, Cable and Backplane.
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OEM CCD Camera
Syncerity BI-NIR Camera
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The TE-cooled back illuminated 2048 x 70 CCD Camera combines affordability, performance and versatility for OEM applications. With peak QE of 84% @ 700nm and 20% at 1050nm, Syncerity BI-NIR offers a relatively broad response and addresses multiple applications. In the near-NIR, this detector is a much lower cost alternative to a deep depleted CCD, with no etaloning. Syncerity’s flexible design allows our OEM-dedicated team to quickly adapt the camera for industrial requirements, ranging from alternate CCD chips to electronics
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8GB DDR4-3200 1GbX8 1.2V Samsung Chip
AQD-D4U8GN32-SE
Memory Module
8GB, DDR 4 3200MHz, 30u" Gold Plating Thickness, Anti-sulfurization resistance, Unbuffered.
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Product
NVM Express
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NVM Express is a scalable host controller interface designed to address the needs of Enterprise, Data Center and Client systems for supporting chip-to-chip, board-to-board, adapter and distance solutions. The protocol can efficiently use interconnect and fabric technologies such as PCI Express, Ethernet and Fibre Channel. Teledyne LeCroy provides protocol analysis, emulation, exerciser and other test equipment to service all NVMe storage applications.
