Chip
Passive or active components test and their interconnected circuitry in silicon or germanium.
See Also: Integrated Circuit, IC
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Product
32GB DDR4-3200 2GbX8 1.2V Samsung Chip
AQD-D4U32GN32-SB
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32GB, Speed 3200MHz, 30u" Gold Plating Thickness, Anti-sulfurization resistance, Unbuffered.
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Product
SMARC® Short Size Module with Intel® Atom™ Processor E3800 Series System-on-Chip
LEC-BTS
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- Single, dual or quad-core Intel® Atom™ Processor E3800 Series System-on-Chip- Up to 4 GB DDR3L at 1066/1333 MHz (non-ECC)- HDMI and LVDS- GbE, camera interface- 1x SATA 3Gb/s, 1x USB 3.0, 3x USB 2.0, max. 12x GPIO- Extreme Rugged™ operating temperature: -40°C to +85°C
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Product
8G SO-DDR3-1600 204Pin 512MX8 1.35V ECC Samsung Chip
AQD-SD3L8GE16-SG
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DDR3-1600 ECC SO-DIMM, 204-Pin, 512MX8,Samsung Chip,
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Chip Tester
TL2000
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ficonTEC’s series of testing machines is focused on automated electro-optical characterization ofsemiconductor chips. The ficonTEC TL2000 is a fully automated test and inspection system for unmountedlaser diode bars, single chips and chips on submounts.
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Product
16G DDR5-4800 288Pin 2GX8 1.1V Registered Samsung Chip
AQD-D5V16GR48-SB
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Samsung Original Chip, Dual 32-bit Subchannels. Increased Banks and Burst Length, DDR5 4.8GT/s. Same-Bank Refresh, On-die ECC for Enhanced RAS.
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Product
Current Sensing Chip Resistors
CS
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*3W rating in 1W size, 1225 package*High purity alumina substrate for high power dissipation*Long side terminations with higher power rating
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Product
Defect Inspection and Review
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KLA’s defect inspection and review systems cover the full range of yield applications within the chip and wafer manufacturing environments, including incoming process tool qualification, wafer qualification, research and development, and tool, process and line monitoring. Patterned and unpatterned wafer defect inspection and review systems find, identify and classify particles and pattern defects on the front surface, back surface and edge of the wafer. This information allows engineers to detect, resolve and monitor critical yield excursions, resulting in faster yield ramp and higher production yield.
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Product
Flexible Pick & Place Machine W/ 64-feeder Capacity
MC400
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The MC400 Pick and Place machine places an enormous range of components, quickly and accurately, from 0201s through 100 x 150 mm SMDs, including BGAs, MBGAs, CSPs, µBGAs, MLFs, flip chips, odd form components and ultra-fine-pitch parts down to 15 mil. The system is easy to program and operate and comes standard with universal CAD conversion and teach-in capability.
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Product
Machine With A History
PAS 5500
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In 1991, seven years after the company was founded, we launched the PAS 5500, which turned out to be our breakthrough platform. This system was able to dramatically reduce manufacturing times for our customers, and its modular design enabled them to produce multiple generations of advanced chips using the same system.
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Product
(IoT) Wireless Module
SX-59HLS
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The SX-59HLS is an ultra-low power Hosted Dual Band 1x1 802.11a/b/g/n Internet-of-Things (IoT) wireless module based on the Qualcomm QCA4012-2 System-on-Chip (SoC). The SX-59HLS is a first in its class to provide enterprise security for today’s high performing networks.
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Product
Clock Distribution Devices
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Analog Devices offers ultralow jitter clock distribution products that fan out given signals for wireless infrastructure, instrumentation, broadband, ATE, and other applications demanding subpicosecond performance. Our clock products are ideal for clocking high performance analog-to-digital converters (ADCs) and digital-to-analog converters (DACs). ADI clock ICs integrate PLL cores, dividers, phase offset, skew adjust, and clock drivers in small chip scale packages.
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Product
8GB SO-DIMM DDR5-4800 262Pin 1GX16 1.1V
AQD-SD5V8GN48-SC
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Samsung Original Chip, Dual 32-bit Subchannels, Increased Banks and Burst Length, DDR5 4.8GT/s, Same-Bank Refresh.
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Product
8GB DDR4 SODIMM-3200 1GbX8 SAM
AQD-SD4U8GN32-SE
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DDR4 3200Mhz Unbuffered SO-DIMM, 30u" Gold Plating Thickness, Anti-sulfurization resistance, 1.2V power consumption. Samsung original chip, 100% tested for stability, compatibility and performance.
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Product
Receivers
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SDR receivers (Software Defined Radio) perform all signal processing in software, offering multi-standard support, access to all data in the channel, and advanced RF measurements.DekTec's other receivers are based on standard demodulator chips and therefore do not take cycles from the host CPU. These can be used if the SDR features are not required.
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Product
5MP MIPI Camera Module
E-CAM55_CUMI0521_MOD
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e-CAM55_CUMI0521_MOD is a small form factor, 5 MP fixed focus camera module based on AR0521 CMOS image sensor from ON Semiconductor® has a dedicated, high-performance Image Signal Processor chip (ISP) on-board that performs all the Auto functions (Auto White Balance, Auto Exposure control) in addition to complete image signal processing pipeline that provides best-in-class images and video. This low light camera module can stream uncompressed VGA (640 x 480) at 75 fps, HD (1280 x 720) at 100 fps, 1280 x 960 at 75 fps, FHD (1920 x 1080) at 65 fps, 2560 x 1440 at 38fps, 2592 x 1944 at 28 fps.
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Product
Universal Programmer Superpro 7500
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Until now,Support 396 IC manufacturer, 94596 pcs devices and keeps growing.Support devices with Vcc from 1.2V to 5V. The programming speed up further increase 30% compared to SUPERPRO 5000.The programmer support files up to 256 GBytesBuilt with 144 universal pin-drivers.Universal adaptors are available for varies packages up to 144 pins. New device support will be easier. PC hosted mode and stand-alone mode. Under PC hosted mode the programmer is controlled by a PC via USB2.0 (high speed) to program a chip. Under stand-alone mode the programmer is controlled via the 6-KEY keypad and the 20 character by 4 line LCD display. A SD card is used to store the project files.User can operate multiple units to construct a concurrent multiprogramming system thank for the stand-alone mode. Only IC manufacturer approved programming algorithms are used for high reliability. (+5%~-5%) and (10%~-10%) Vcc verification enhances programming reliability.Advanced and powerful functions.Production mode start chip operation at the moment the chip is inserted in the socket properly.Project function simplifies processes such as device selection, file loading, device configuration setting, program option, and batch file setting into one touch step.Password can be set for project files and production volume controlBatch command combines device operations like program, verify, security into a single command at any sequence.Serial numbers generators are available as standard or customer-specific functions.Log file is useful for quality tracking. Over-current and over-voltage protection for safety of the chip and programmer hardware. WINDOWS XP/Vista/Win7/Win8/Win10 32/64bit compatibility
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Product
Thermal Test Chip
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Thermal Engineering Associates, Inc.
Thermal Test Chips (TTC) are used in many different Applications: Package Thermal Characterization, Heat Source Simulator, Temperature Reference Platform, Transient Analysis, System Thermal Management Design, Thermal Interface Material (TIM) Measurement & Characterization, Heat Sink Measurement & Characterization.
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Product
68-Pin PLCC with Die Flipped-to-68-Pin PGA for 87C196 IC and Others
68-304538-10
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68P PLCC WITH DIE FLIPPED TO 68 PGA FOR 87C196 IC AND OTHERS. Correct-A-Chip technology solves problems associated with the use of alternative ICs (due to availability, obsolescence, need for better performance, etc.) by eliminating the need for new PCBs.
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Automotive Audio Bus (A2B®)
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Analog Devices Automotive Audio Bus (A2B®) technology provides critical support to the vehicle infotainment systems of tomorrow. Our A2B products deliver high fidelity audio while increasing fuel efficiency, thanks to upward of 75% less cabling weight. The A2B portfolio helps enables multiple applications such as voice recognition and active noise cancellation. A2B is a single-master, multiple-slave system where the transceiver chip at the host controller is the master.
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Single Channel Detectors
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Infrared detectors for gas analysis, flame detection and radiometry in TO18 or TO39 packages.Housing types TO18 and TO39Voltage or current modeSignal processing with JFET or operational amplifierThermally compensated (optional)With special chip holder for reducing the microphonic sensitivity (optional)
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Product
32+2 Channel 12bit 5 GS/s Switched Capacitor Digitizer
V1742
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12 bit @ 5 GS/s, 1-unit wide 6U VME64 module, Switched Capacitor technology based on the DRS4 chip (designed at Paul Scherrer Institute) 1024 capacitor cells per channel (acquisition window of ~ 200 ns @ 5 GS/s)
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Product
COM Express Basic Size Type 7 Module with Up to 16 Cores Intel Xeon D and Pentium D SoC (formerly codename: Broadwell-DE)
Express-BD7
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The Express-BD7 is a COM Express COM.0 R3.0 Basic Size Type 7 module supporting the 64-bit Intel Xeon processor D and Intel Pentium D processor system-on-chip (SoC) (formerly "Broadwell-DE"). The Express-BD7 is specifically designed for customers who need excellent computing performance with balanced power consumption and multiple 10G Ethernet connectivity in a long product life solution.
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Product
Data Loggers
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Premier Electrosystems has a wide range of data loggers to suit your needs. All our data loggers can be customized as per requirement. Data loggers are electronic devices which automatically monitor and record environmental parameters over time, allowing conditions to be measured, documented, analysed and validated. The data logger contains a sensor to receive the information and a computer chip to store it. Then the information stored in the data logger is transferred to a computer for analysis.
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Product
High Temperature Chip Resistors
ERJ-Hxx Series
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Panasonic Industrial Devices Sales Company of America
Panasonic’s ERJ-Hxx Series Automotive Grade Thick Film Chip Resistors feature a maximum Category Temperature of 175°C and a maximum Rated Operating Temperature of 105°C. The ERJ-Hxx Series is AEC-Q200 compliant, ensuring strict quality control standards are in place to enforce optimal quality and reliability. The ERJ-Hxx Series Resistors offer a small size, higher power Resistor alternative that provides enhanced flexibility of PCB design by reducing solder-joint crack risk. This series is ideal for use in automotive, ICT, general industrial applications, and more.
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Product
Embedded Antennas
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Pulse’s broad customizable portfolio of embedded antenna solutions will have your device connected regardless of the circumstances. Pulse embedded technologies results in robust board-mounted antenna designs making them exceptionally suitable across many solutions. Our in-house manufactured embedded antenna line; ceramic chip, patch, stamped metal, FPC, composite antennas and active GNSS antennas are some of the world’s smallest, compact and most efficient. Our embedded antenna line is manufactured for a variety of applications and frequencies such as Cellular, WiFi, BT, ISM, GPS/GNSS/Bediou and many more. You can search through our selection of catalog embedded products using the table below to find the right product for you.
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Product
FEC Accelerator Based On Intel® VRAN Dedicated Accelerator ACC100
PCIe-ACC100
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ADLINK’s PCIe-ACC100 is a PCIe interface accelerator adapter developed based on Intel's vRAN Dedicated Accelerator ACC100 eASIC chip. It supports 4G and 5G codec acceleration, checksum rate matching, onboard 4G ECC memory, and hybrid automatic repeat request technology (HARQ). The PCIe form factor HHHL (half-height, half-length) can meet the needs of most application scenarios.
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Product
LED’s
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Marktech offers the complete line of both CREE LED’s High Brightness LEDs and Marktech’s custom designed components and assemblies which utilize CREE LED’s chips. Our main focus has always been in the area of application solutions to optimize your products performance. Our team of design engineers and R&D scientist are committed to providing you with unsurpassed technical support.
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Product
RF/Microwave Assembly Capability
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Teledyne Labtech offers a comprehensive build-to-print microwave module and microwave components manufacturing service. This includes MMIC placement, Au wire bonding, SMT assembly and test.Our microwave MIC production facility is housed in a class 10,000 clean room that accommodates manual chip placement and semi-automatic wire bond assembly. Dedicated microwave components manufacturing is undertaken within production cells established to meet specific customer or product requirements.
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Actuators, Adjusters, & Transducers
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We offer a wide range of adjustment screws, micrometers, and kinematic positioners, as well as stepper motor, DC servo, high-precision piezo inertia actuators, and voice coil actuators. Additionally, our piezoelectric offerings include modular, screw, and replaceable-tip piezoelectric actuators, as well as Langevin transducers for ultrasonic welding applications. A wide variety of piezoelectric chips and stacks are also available.
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Product
N2,O2 Analyzer
P860 Series
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Shanghai ChangAi Electronic Science & Technology Co.,Ltd
P860 series analyzer is the online intelligent measurement instrument, which adopting advanced ion current oxygen sensor with single chip technology. N2%=100%-O2%. It has been widely used in the fields of nitrogen separation from air, fertilizer, petrochemicals and biological fermentation. - See more at: http://en.ci-ele.com/8aedb8bf-ef48-4f8c-127a-797c939a6181/54b8d904-ebc5-7b11-fc19-cf39baaa5889.shtml#sthash.0iShzAbt.dpuf





























