Chip
Passive or active components test and their interconnected circuitry in silicon or germanium.
See Also: Integrated Circuit, IC
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Product
SODIMM DDR4
SQR-SD4N
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Original IC chips adopted, Data transfer rate: 3200MT/s. Capacity: 4/8/16/32GB, Operating temperature: 0 °C ~ 85 °C. 3years longevity, Fixed BOM, Lifetime warranty.
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Product
CMOS Cameras
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A digital still or video camera that uses a CMOS-based image sensor chip rather than a CCD to record the picture.
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Product
Open-source CAD tool to simulate 2D and 3D-ICs.
IntSim v2.0
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Simulate and optimize 2D and 3D-ICs. Pre-silicon estimates for die size, number of metal levels, size of each metal level and chip power.
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Product
16 Channel Multihit TDC (25 ps)
V1290N-2eSST
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The V1290N-2eSST is a 16 channel Multihit TDC, housed in a 1-unit wide VME 6U module. The unit features High Performance Time to Digital Converter chips developed by CERN. LSB is 25 ps (21 bit resolution, 52 µs FSR). The module accepts NIM inputs..
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Digital Step Attenuators
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Analog Devices provides a range of broadband IC digital attenuators that come in low cost, leadless surface mount packages. Our digital attenuator family offers excellent attenuation and includes off chip ac ground capacitors for near dc operation, making it ideal for an extensive number of RF and IF applications.
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Product
Digital I/O Board
P104-DIO-96
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Each I/O line of this card is buffered and capable of sourcing 32mA, or sinking 64mA. The board simulates Programmable Peripheral Interface chips (PPI) to provide a computer interface to digital I/O lines. Each PPI supports two 8-bit ports (A, B) and two 4-bit ports (Chi, Clow). Each port can be configured to function as either input or output latches. The I/O line buffers (types 74ABT240 and 74ABT245) are configured automatically by hardware logic for input or output according to the PPI Control Register direction software assignment.
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Product
Simics
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With Wind River® Simics® you can simulate anything, chip to system, giving you a path to DevOps and Continuous Integration and Deployment.
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Product
Pyroelectric Detectors
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Pyroelectric detectors are thermal detectors; i.e. they create an electric signal due to temperature changes in the chip. This temperature change is caused by absorption of light. We do use LiTaO3 and DLaTGS as pyroelectric materials. Basically such detectors cover the whole spectra. However, they are mainly used for mid-wave and long-wave infrared detection (MWIR and LWIR). In addition, the usage in the THz region seems to become more popular these days.
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Product
Impulse Voltage Generator
GDCY
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The impulse voltage generator is mainly used to the field of impulse voltage tests by lightning impulse voltage full wave, lightning impulse voltage chipped wave and operate impulse voltage wave for such test products as electrical instrument.
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Product
8 Channel DAC FMC Module
DACNF08 – HPC
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Sundance Multiprocessor Technology Ltd.
The RFM-DACNF08 is a eight channel Digital to Analog converter FMC which complies with VITA 57.1-2010.It uses 4x AD9122 DAC chips, with a sampling speed of up to 1.2GHz
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Product
Software
SSI-TRES
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Was developed to read and edit Plug and Play Smart Sensors that are compliant to the IEEE 1451.4 Standard. TEDS, or transducer Electronic Data Sheet, is a set of electronic data in a standardized format defined within the IEEE 1451.4 standard. This data specifies what type of sensor is present, describes its interface, and gives technical information such as sensitivity, bridge type , excitation, etc. This information is stored in an EEPROM chip attached to the sensor. By having this chip, the sensor can identify and describe itself to the network and or Smart Load Cell Meter (DPM-3), thereby easing automatic system configuration.
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Automated Optical Inspection
AOI
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No complex assembly process is complete without the ability to inspect and characterize the many different components used. ficonTEC’s fully automated INSPECTIONLINE systems acquire high-resolution pictures of the surfaces of interest and performs optical inspection based on the user’s criteria. For example, facet inspection of laser diodes, QC for coatings, surface inspection, top/bottom/side-wall inspection of semiconductor chips, and die sorting are just some of the many inspection tasks performed routinely by ficonTEC’s suite of inspection tools. As for all of ficonTEC’s systems, a modular approach permits the inspection platform to equipped with additional features – automatic tray handling and various feeding philosophies, testing capabilities (e.g. LIV), top/bottom chip inspection, and in-situ labelling.
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Automotive Infotainment SoCs
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ST’s portfolio of infotainment systems on chips (SOCs) includes a complete offer of automotive-grade devices for a wide range of infotainment systems ranging from turnkey Accordo2 processors for car radio applications and Display Audio systems, featuring smartphone mirroring and support of rear-view cameras, up to powerful Accordo5 multi-core processors with best-in class 3D graphics and video decoding capabilities, to address multi-standard smartphone replication technology as well as Digital Instrument Cluster applications.
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Product
288-Pin Dual In-Line Memory Module
SQR-UD4(ECC)
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SQRAM is Industrial Grade DRAM memory. all of SQRAM are designed with original IC chip and adopt a rigorous test program.
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Product
PCI Express Optical Link Board
SIS1100-E2
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The SIS1100-e2 is the follow up card to our SIS1100-eCMC board (without CMC carrier functionality). It was developed to extend the lify cycle of our PCIe to VME interface. For software/driver compatibility reasons we still employ the PEX8311 PCI Express to local bus bridge chip.
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Product
Automated Programmer Superpro Sb05
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※ Four Pick & Place nozzles, Eight socket pressing actuators and 2 tape feeders※ High throughput up to 2400UPH※ Embeded with eight ultra-high speed programmers SuperPro / 7500, each with up to 4 sockets, totally 32 sockets. Throughput 60 times higher than SuperPro / SB01 for eMMC devices※ Supports over 80,000 devices from over 300 IC manufacturers※ Supports tray, tape and tube input and output. Supports laser and ink marking※ Short change-over time※ Intelligent s/w cuts learning curve and setup time, makes task management an easy job※ Compact sizeHigh throughput：4 nozzles, 8 independent socket pressing actuators and 2 tape feeders. Up to 2400 UPH for devices with programming time less than 50 sec. Throughput 0.6 to 60 times higher than SuperPro/SB01, especially higher for large capacity devices like eMMC, NAND /NOR FLASH,SPI FLASH. Suitable for both small and large capacity devices. Prog. Time (S) 50 60 120 180 240 300 UPH (unit per hours) 1600 1600 840 560 420 336 Accurate positioning：Equipped with high performance servo system, precise CCD cameras and vision algorithm for device alignment and sockets / pick & place spots positioning.High performance programmers： 8 ultra-high speed universal gang programmers SuperPro/7500 resident. Each with up to 4 sockets, totally up to 32 sockets in the system. Supports up to 100,000 devices from over 300 IC manufacturers and growing.Varied I/O devices：Supports tray, tape and tube input and output. Supports laser and ink marking. Supports packing conversion and can work as a packing conversion machine alone.Short change-over time：I/O devices and socket adaptor are easy to be changed when programming task need to be changed. Socket positioning can be performed automatically. Projects can be loaded automatically with barcode scanning.Powerful and intelligent software：Setup data saved for next operation, log file and statistic reports for quality and yield traceability, flexible sockets prohibition strategy promises high yield rate for unattended operation, graphical user interface cuts learning curve, prevents chip over-lapping by socket checking before chip placing.Remote Control：Remote project loading, quality monitoring, volume control, file security.
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Product
Multilayer PCB
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ultilayer circuit boards were essential in the advancement of modern computing. The multilayer PCB basic construction and fabrication are similar to micro chip fabrication on a macro size. The range of material combinations is extensive from basic epoxy glass to exotic ceramic fills. Multilayer can be built on ceramic, copper, and aluminum. Blind and buried vias are commonly produced, along with pad on via technology.
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Product
Module Spectrum
nRF51822 Series
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Raytac nRF51822 module provides 16K & 32K RAM option with Chip Antenna & PCB Antenna for selection.
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16G DDR5-4800 288Pin 2GX8 1.1V Unbuffered Samsung Chip
AQD-D5V16GN48-SB
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Samsung Original Chip, Increased Banks and Burst Length. DDR5 4.8GT/s, Same-Bank Refresh, On-die ECC for Enhanced RAS.
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Product
pH 550 Benchtop pH Meter Kit with Probe, Stand, and pH Buffers
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The PH 550 benchtop pH meter features a microprocessor chip which provides automatic temperature compensation, data storage, parameter setup, and Max/Min reading display. The meter offers a pH range from 0 to 14 and a three-point automatic calibration, with the ability to recognize standard buffer solutions (USA or NIST series). The advanced digital processing technology improves meter response time and measuring accuracy. A stable reading display icon appears when the measuring value is stable. The 3-in-1 combination pH electrode measures pH and temperature simultaneously. The compact meter includes a detachable electrode holder and three bottles of pH buffer solution. It has a dustproof and spillproof rating of IP54. Connectors are protected by silicone seal caps.
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4G SO-DDR3-1600 512X8 1.35V SAM -40~85C
AQD-SD3L4GN16-SGW
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30u" Gold Plating Thickness, Anti-sulfurization resistance, Samsung original chip, Wide Temp. -40C to +85C, 100% tested for stability, compatibility and performance.
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Product
Scalable Multi-Channel Active Thermal Control (ATC)
T-Core Thermal Control System
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Cohu’s proprietary T-Core thermal system’s controller provides precise, multi-site temperature management of power dissipation ICs, such as graphic chips and CPUs, optimizing test yield.The T-Core thermal control system optimizes test yield at cold, ambient, and hot temperatures and offers better than +/- 1°C accuracy with response speeds of >125°C/sec. The system’s flexibility to control air, liquid, and refrigerant based thermal heads gives semiconductor manufacturers excellent temperature control capability for high volume manufacturing.
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Product
SparkFun MicroMod Teensy Processor
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The SparkFun MicroMod Teensy Processor leverages the awesome computing power of the NXP iMXRT1062 chip and pairs it with the M.2 MicroMod connector to allow you to plug it into your choice of compatible MicroMod Carrier Board. With the M.2 MicroMod connector, connecting your Teensy Processor is a breeze. Simply match up the key on your processor's beveled edge connector to the key on the M.2 connector and secure it with a screw (included with all Carrier Boards). Adding a Teensy to your desired project has never been easier!
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Product
Resistors
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Panasonic Industrial Devices Sales Company of America
Panasonic offers a broad line of Resistors that include Chip Resistors, Power, High Power, Fuse, EMI Filters, and Arrays and Networks for all applications.Panasonic Resistors have a wide range of features and specifications including conventional Thick Film Chip Resistors or specialized types like Anti-Sulfur, 0201 to 0805 case sized Chip Resistor Arrays, three different types of Power Resistors, Surface Mount and Leaded EMI Filters and one of the smallest Chip Fuses in the industry.
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Caibration Equipment For Lab Use
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In the field of high-power semiconductor testing, PONOVO has launched a smart test platform with high-speed high-frequency, high-voltage, high-current power sources, combined with high-speed, high-precision high-voltage, high-current analog acquisition technology and high-speed digital processing control system. The platform can complete the testing of dynamic parameter parameters, static parameters, thermal parameters and mechanical parameters, and power life parameter of various types of high-power semiconductor devices, modules, and chips, which could meet different testing requirements. It is the universal testing platform for automated testing for different application purpose, such as the research and development testing, engineering acceptance test, factory acceptance test, etc.
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Ultrasound Pulser ICs And HV Multiplexers
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ST's Ultrasound Imaging IC Solutions offer a complete range of integrated high-voltage transmitters from quad and octal, to the latest device, the state-of-the art STHV1600 ultrasound pulser IC, to high-voltage multiplexer IC, the STHV64SW, a 64-channel, high voltage analog independent switches. ST’s proprietary BCD6s-SOI and BCD8sSOI process technologies enable the combination of low-voltage CMOS logic, precise analog circuitry, and robust power stages on the same chip, offering unprecedented level of integration.
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High Precision Electronic Load
PEL-8000
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PEL-8000 series adopts high-performance chip high-speed and high-precision design, providing resolution of 0.1mV, 0.01mA (basic accuracy is 0.03%, basic current rise rate is 2.5A / US)
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8G SO-DDR4-3200 1GX8 1.2V SAM -20~85℃
AQD-SD4U8GN32-SE2
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SAM Original Chip, Industrial Design for Improved Reliability, PCB: 30μ gold finger, Anti-sulfuration, Semi Wide-temp Support -20~85℃.
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Pressure Sensors
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ST’s tiny silicon pressure sensors use innovative MEMS technology to ensure extremely high-pressure resolution in ultra-compact and thin packages. The devices implement proprietary technology for the fabrication of pressure sensors on monolithic silicon chips, which eliminates wafer-to-wafer bonding and maximizes reliability.
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16GB DDR5-5600 288Pin 2GX8 1.1V Unbuffered Hynix Chip
AQD-D5V16GN56-HB
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Hynix Original Chip, Increased Banks and Burst Length, DDR5 5.6GT/s, Same-Bank Refresh, On-die ECC for Enhanced RAS.
