Chip
Passive or active components test and their interconnected circuitry in silicon or germanium.
See Also: Integrated Circuit, IC
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Product
288-Pin Dual In-Line Memory Module
SQR-UD4(ECC)
Memory Module
SQRAM is Industrial Grade DRAM memory. all of SQRAM are designed with original IC chip and adopt a rigorous test program.
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Product
48-CH DIO & Timer/Counter Cards
cPCI-7248/7249R
Counter/Timer Module
- PICMG 2.0 Rev 2.1- 48-CH digital TTL/DTL input/output- Emulates 4/2/1 industry standard 8255 PPI (mode 0)- Direct interface with OPTO-22 compatible I/O modules Output port status read back- On board 8254 timer/counter chip
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Product
Inductor Tester
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An impulse can be applied to the coil of a chip power inductor to perform insulation tests (surge tests) within the windings.
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Product
Programmable DC Electronic Load
M97 series
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The new M97XX series programmable DC electronic load is a new generation product designed from Maynuo Electronic Co.,Ltd. Incorporating high-performance chips, the M97XX series delivers high speed and high accuracy with a resolution of 0.1 mV and 0.01 mA (basic accuracy is 0.03% and basic current rise speed is 2.5 A/μs). M97XX series have wide application from production lines for cell phone chargers, cell phone batteries, electronic vehicle batteries, switching power supplies, linear power supplies, and LED drivers, to research institute, automotive electronic, aeronautic and astronautic, maritime, solar celland fuel cell etc.test and measurement applications. From 150W to 200KW, there are many models to choose from :
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Product
Optical Voltage Probe
400-02
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Srico’s optical voltage probe uses advanced, proprietary optical chip technology to achieve precise, interference-free measurement. Our sensor and optical fibers are made of dielectric materials. This facilitates a high degree of isolation between the voltage test point and the instrumentation system ⎯ at a safe distance of 100 meters and more. This system senses, measures, and transmits electrical data very accurately.
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Product
8G SO-DDR5-5600 1GX16 1.1V SAM -20~85℃
AQD-SD5V8GN56-SCH
Memory Module
SAM Original Chip, Industrial Design for Improved Reliability, PCB: 30μ gold finger. Anti-sulfuration, Semi Wide-temp Support -20~85℃.
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Product
Digital Oscilloscope
MSO8000
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The MSO8000 series digital oscilloscope is a mid- to high-end mixed-signal digital oscilloscope based on RIGOL's proprietary intellectual property ASIC chip and UltraVision II technology platform.
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Product
3.4 MP Custom Lens Low Light Camera Module
e-CAM30_CUMI0330_MOD
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e-CAM30_CUMI0330_MOD is a high performance, small form factor, 3.4 MP pluggable Low Light Camera Module with S-Mount lens holder. It is based on AR0330 - a 3.4MP CMOS Image sensor from ON Semiconductor®. It has a dedicated, high-performance Image Signal Processor chip (ISP) on-board that performs the entire Auto functions (Auto White Balance, Auto Exposure control) in addition to complete image signal processing pipeline that provides best-in-class images, videos and the optional MJPEG compressions.
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Product
4G SO-DDR3-1600 204Pin 512MX8 1.35V Unbuffered Samsung Chip
AQD-SD3L4GN16-SG1
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DDR3 1600Mhz Unbuffered SO-DIMM, 30μ" gold plating thickness, 1.35V power consumption, Samsung original chip.
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Product
Electrical Receiver Conformance Test Application for IEEE 802.3bs/cd
M8091BSCB
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IEEE 802.3bs receiver test application for 200GAUI-4 and 400GAUI-8, covering chip-to-module, chip-to-chip, backplane, and copper cable interconnects.
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Product
Fibre Channel Modules
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AIM’s Fibre Channel test, simulation and analysis modules use our field proven Common Core hardware design giving you the best performance, best feature set and highest functional integration on the market. The use of SoC (System on Chip) based core designs with one dual core RISC processor per port, massive and scalable DDR3 memory and IRIG-B time encoder/decoder functions are standard. The new ultra high performance intelligent 4-lane PCIe 2.0 interface modules offer 2 ports with full function test, simulation, monitoring and analyzer functions for Fibre Channel networks. The dual core processor provides onboard processing and data transfer capabilities for the most demanding Fibre Channel applications including upper layer protocol support done on board level. Large and high data throughput DDR3 RAM is accessible for the onboard processor as is a high performance FPGA implementing the customized Fibre Channel interfaces enabling the board to analyze incoming and modify outgoing data in real time. Each module provides 2 Fibre Channel compliant full duplex ports, implementing the full link level services. SFP cages make it suitable for different media types as optical or electrical network technologies. Ports operate either in Traffic Simulator or Analyzer/Monitor mode with support for port related Frame Statistics. Sophisticated packet capturing mechanism and monitoring features are complimented with powerful triggering and filtering capabilities.
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Product
DDR4 BGA Interposers, DDR4 DRAM X16 Packages
N2115A
Interposer
The N2115A DDR4 BGA Interposers are soldered in between the DRAM and PC board or DIMM raw card where the DRAM would normally be soldered. They are designed with the PCB or DIMM foot print on the bottom side and the DRAM footprint on the top side. The signals from the memory controller chip and DRAM are then passed directly to the top side of the BGA probe adapter where they can be accessed with the oscilloscope probes.
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Product
Chip Scale TVS Arrays
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ProTek's patented* Flip Chip TVS Arrays are designed for small circuit board applications with limited size and space availability. To reduce installation costs, the Flip Chip can be mounted directly onto the printed circuit board; similar to chip resistors and capacitors. These devices are ideal for use in portable electronics such as Cellular Phones, Cellular Phone Accessories, Personal Digital Assistants (PDAs), Laptops and Pagers.
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Product
29MP Ultra-High Resolution Forensic Camera
SceneScope RUVIS 29MP System
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The SceneScope RUVIS 29MP is an Ultra High Definition camera based on a 29MP sensor with 6644 x 4452 pixel resolution, and a full-frame chip. It includes capture software with 3 user-selectable modes: Fast Viewing for placement, Focus on the evidence, and High Detail for Capture at High Resolution and High Dynamic Range.
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Product
Universal Counter (225MHz - 9GHz)
S43131
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S43131 series universal counter is the high-precision frequency and time measuring instrument developed by Saluki Technology. It adopts the high-performance single chip microcomputer as the core to conduct function control, survey time sequence control, data processing and result display. Adopt the countdown counting technique and digital interpolation technique to realize high-precision measurement within the whole range.S43131 series universal counter has stable performance, complete function, wide measurement range, high sensitivity, large dynamic range, high precision, small volume and convenient and reliable use. It has wide application in industrial production, scientific research and measurement and other fields, and is the ideal upgraded and renewed product of the traditional electronic counter.
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Product
3.4 MP Custom Lens Low Light Camera Module
e-CAM30_CUMI0330_MOD
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e-CAM30_CUMI0330_MOD is a high performance, small form factor, 3.4 MP pluggable Low Light Camera Module with S-Mount lens holder. It is based on AR0330 - a 3.4MP CMOS Image sensor from ON Semiconductor®. It has a dedicated, high-performance Image Signal Processor chip (ISP) on-board that performs the entire Auto functions (Auto White Balance, Auto Exposure control) in addition to complete image signal processing pipeline that provides best-in-class images, videos and the optional MJPEG compressions.
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Product
8G DDR4-3200 1GbX8 1.2V SAM -40~85C
AQD-D4U8GN32-SEW
Memory Module
DDR4 3200Mhz Unbuffered DIMM, 30u" Gold Plating Thickness, Anti-sulfurization resistance. 1.2V power consumption, Samsung original chip, 100% tested for stability, compatibility and performance.
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Product
ETX Module with Intel Atom® Processor E3800 Series SoC (formerly codename: Bay Trail)
ETX-BT
Computer on Module
The ETX-BT is based on the latest Intel Atom® processor E3800 SoC series, adopting the latest 22nm process technology with 3-D Tri-Gate transistors featuring significant improvements in computational performance and energy efficiency. The E3800 SOC series integrates processor and GPU cores and all I/O on a single chip. Processor performance is scalable from a single-core Intel Atom® processor E3815 at 1.4GHz to a quad-core Intel Atom® processor E3845 at 1.9GHz. Two quad-core Intel® Celeron® processors, based on the same microarchitecture, are also available.
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Product
16GB ECC DDR5-5600 2GX8 1.1V SAM
AQD-D5V16GE56-SB
Memory Module
SAM Original Chip, Anti-sulfuration, PCB: 30μ gold finger. Independent Power Management IC build-in, ECC function support.
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Product
16 Channel Multihit TDC (25 ps)
V1290N-2eSST
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The V1290N-2eSST is a 16 channel Multihit TDC, housed in a 1-unit wide VME 6U module. The unit features High Performance Time to Digital Converter chips developed by CERN. LSB is 25 ps (21 bit resolution, 52 µs FSR). The module accepts NIM inputs..
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Product
Registered DIMM
SQR-RD5N
Dual In-Line Memory Module (DIMM)
Registered DIMM DDR5 4800/5600/6400, Data Transfer Rate: 4800/5600/6400 MT/s. Capacity : 16/32/64/128GB, 100% Screening Test. Compatible with server platform, Original IC chip adopted.
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Product
P/N 1110087 144-Pin VQFP-to-PGA Adaptor
1110087
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144 Pin VQFP to PGA Adapter. Convert surface mount VQFP packages to a 13 x 13 PGA footprint. Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs. Pins are mechanically fastened and soldered to board using Aries patented process, creating a reliable electrical connection and rugged contact. Consult factory for panelized form or for mounting of consigned chips.
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Product
Registered DIMM
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a type of RAM module featuring a hardware register (RCD) between the DRAM chips and the system's memory controller.
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Product
Converter
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Converter and driver chips ensures data rates above 1 MBaud and therefor reliable data transmission also with highest rates.
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Product
Chip Manufacturing
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KLA’s advanced process control and process enabling solutions support integrated circuit manufacturing. Using KLA’s comprehensive portfolio of defect inspection, review, metrology, patterning simulation, in situ process monitoring and data analytics systems, IC manufacturers can manage yield and reliability throughout the chip fabrication process - from research and development to final volume production. SPTS provides deposition process solutions for insulating materials and conducting metals that cover a range of chip manufacturing process steps. IC manufacturers use KLA's array of products and solutions to help accelerate their development and production ramp cycles, to achieve higher semiconductor die yield and improved IC quality, and to improve overall profitability in the IC manufacturing process.
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Product
COM Express Compact Size Type 6 Module with 6th Gen Intel® Core™ i7/i5/i3 and Celeron® 3955U Processors (formerly codename Sky Lake)
cExpress-SL
Computer on Module
The cExpress-SL is a COM Express® COM.0 R2.1 Type 6 Compact size module featuring the 64-bit 6th Generation Intel® Core™ i7/i5/i3 and Intel® Celeron® Ultra-Low TDP processors (formerly Sky Lake-U") with CPU, memory controller, graphics processor and I/O hub on a single chip. Leveraging the benefits provided by the 6th generation Intel® Core™ and Celeron® System-on-Chip, the cExpress-SL is specifically designed for customers who need optimum processing and graphics performance with suitable power consumption using Intel® Configurable TDP in a long product life solution.
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Product
Battery Backup IC
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Analog Devices offers a range of supervisory circuits that offer a complete single chip solution for power supply monitoring and battery control functions in microprocessor systems. Functions include microprocessor reset, backup battery switchover, watchdog timers, CMOS RAM write protection, and power failure warning.
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Product
Inductor Products
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Macom Technology Solutions Holdings Inc.
They provide uniformity, durability and repeatability in circuit fabrication. The coils are polyimide coated to protect from ambient contaminants, and to eliminate the need for conformal coating. Quartz substrates are rugged and reduce dielectric losses. Chips may be bonded using either conductive or non conductive epoxies, and wire bonded with gold wire or ribbon by thermocompression bonding.
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Product
Inductor Test & Packaging Machine
1870D
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The Chroma 1870D Series (1870D/1870D-12) are specifically Designed automated test equipment for chip inductors. It comprises Various test functions that are required for verifying chip inductors. In addition, an automated tape packaging machine at the end of production line is equipped to fulfill demand for automated manufacturing.
