Chip
Passive or active components test and their interconnected circuitry in silicon or germanium.
See Also: Integrated Circuit, IC
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Product
Chip Test Adapter
SOJ EDO/FPM
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Our new addition to the RAMCHECK line provides support for common 20 to 42-pin EDO/FPM DRAM SOJ chips of sizes 256Kx16/18, 1Mx16/18, 8Mx8, 16Mx4, 2Mx8, 4Mx4, 16Mx1, 1Mx4, and 4Mx1.
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Product
Thick Film Chip Resistors
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Panasonic Industrial Devices Sales Company of America
An AEC-Q200 Compliant SeriesPanasonic components specified as AEC-Q200 Compliant are consistently designed into automotive systems. However, today’s Design Engineers are specifying AEC-Q200 components to meet the high-quality standards of devices beyond automotive applications.
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Product
10μm Silicon IDE Sensor Chip
SBI1
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10μm silicon interdigitated electrode (IDE) for MEMS gas sensing, biosensing, electrochemical analysis, and photoelectric research.
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Product
50μm Ceramic Interdigitated Electrode Chip
CIE1
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50μm ceramic interdigitated electrode chip for biosensing, gas sensing, humidity monitoring, and capacitive sensor research.
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Product
4μm Transparent Quartz Interdigitated Electrode Chip
TIA1
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4μm transparent quartz IDE chip designed for MEMS, gas sensing, biosensing, and photoelectric applications.
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Product
ISDN Chip Set
Emutel Symphony
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Emutel Symphony is a convenient and flexible Basic Rate ISDN, Primary Rate ISDN and Analog PSTN network simulator. With support for S, U, E1, T1 and PSTN analog interfaces you can use the Emutel Symphony to test and develop a full range of ISDN(E1/T BRIS BRIU) and PSTN analog (FXS) equipment.
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Product
Chip Resistor Array
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Panasonic Industrial Devices Sales Company of America
An AEC-Q200 Compliant SeriesPanasonic components specified as AEC-Q200 Compliant are consistently designed into automotive systems. However, today’s Design Engineers are specifying AEC-Q200 components to meet the high-quality standards of devices beyond automotive applications.
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Product
32GB SO-DDR4-3200 2GbX8 1.2V ECC Samsung Chip
AQD-SD4U32GE32-SB
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32GB, Speed 3200MHz, 30u" Gold Plating Thickness, Anti-sulfurization resistance, ECC.
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Product
100μm Large Ceramic IDE Sensor Chip
LSC1
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100 μm large-size ceramic interdigitated electrode (IDE) sensor chip with a 10 × 20 mm sensing area. Designed for gas sensing, humidity monitoring, biosensing, and capacitive sensor research.
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Product
Current Sensing Chip Resistors
CS
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*3W rating in 1W size, 1225 package*High purity alumina substrate for high power dissipation*Long side terminations with higher power rating
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Product
25μm Circular Quartz Interdigitated Electrode Chip
CIQ1
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Circular quartz IDE chip with a 25μm gap for gas sensing, humidity monitoring, biosensing, and electrochemical research.
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Product
50μm Transparent Quartz Interdigitated Electrode Chip
IEQ1
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50μm transparent quartz IDE chip designed for gas sensing, biosensing, MEMS, and photoelectric applications.
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Product
IEEE-488 GPIB Device Interface IC (Chip) for the PCI-Bus
GPIB-72120
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The i72120 GPIB-Chip is the ideal solution to implement a IEEE488.2 GPIB interface for next generation PCI based instruments. The GPIB-ASIC is designed to meet all of the functional requirements for talker and listener (TL) devices as specified by the IEEE Standards 488.1-1987 and 488.2-1987. Connected between the PCI bus and the GPIB, this GPIB-IC provides high-level management of the GPIB to unburden the processor and to simplify both hardware and software design. The i72120 is fully compatible with the PCI specification and requires only the addition of bus driver/receiver components to implement a talker/listener GPIB interface.
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Product
Chip Inductors AECQ200 Compliant
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Bourns products include surface-mount chip inductors, power chokes, chip beads, chip bead arrays, as well as radial-leaded and axial-leaded inductors. These components are used in computer, communication, instrumentation, industrial, and medical applications.
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10μm Quartz Interdigitated Electrode Chip
BAP1
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Transparent quartz IDE chip with a 10μm gap for gas sensing, biosensing, and photoelectric applications.
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Product
Precision Thick Film Chip Resistors
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Panasonic Industrial Devices Sales Company of America
An AEC-Q200 Compliant SeriesPanasonic components specified as AEC-Q200 Compliant are consistently designed into automotive systems. However, today’s Design Engineers are specifying AEC-Q200 components to meet the high-quality standards of devices beyond automotive applications.
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Product
20μm Silicon Interdigitated Electrode Chip
SBC1
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High-stability 20μm silicon IDE chip for MEMS, gas sensing, biosensing, and photoelectric applications.
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Product
100μm Flexible PET IDE Sensor Chip
LAF1
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100μm flexible PET interdigitated electrode (IDE) sensor chip with gold electrodes for gas sensing, humidity monitoring, biosensing, and capacitive sensing research.
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Product
Capacitors - Binary Chip
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Macom Technology Solutions Holdings Inc.
MACOM’s BOO and BSP Series Capacitors are designed to facilitate bread-boarding or to use where a trimming capability is required. These devices feature the same dielectric layer and bonding surfaces as our 9000 and 9100 Series chip capacitors. By connecting the pads in parallel, the capacitance values are additive, so many combinations are possible.
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Product
Chip Manufacturing
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KLA’s advanced process control and process enabling solutions support integrated circuit manufacturing. Using KLA’s comprehensive portfolio of defect inspection, review, metrology, patterning simulation, in situ process monitoring and data analytics systems, IC manufacturers can manage yield and reliability throughout the chip fabrication process - from research and development to final volume production. SPTS provides deposition process solutions for insulating materials and conducting metals that cover a range of chip manufacturing process steps. IC manufacturers use KLA's array of products and solutions to help accelerate their development and production ramp cycles, to achieve higher semiconductor die yield and improved IC quality, and to improve overall profitability in the IC manufacturing process.
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Chip Obsolescence Solutions
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Solve component obsolescence problems with an Ironwood adapter and an alternate device. Adapters convert the pinout of an alternate device to maintain compatibility with an existing footprint – no need to redesign a new circuit board. Very often, these adapters (called Package Converters) are a simple 1:1 pin mapping from the new package to the old. Here are a few examples of package converters and how they can solve chip obsolescence issues.
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Product
8GB SO-DDR4-3200 1GbX8 1.2V ECC Samsung Chip
AQD-SD4U8GE32-SE
Memory Module
8GB, Speed 3200MHz, 30u" Gold Plating Thickness, Anti-sulfurization resistance, ECC.
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Product
5μm Quartz Interdigitated Electrode Chip
THB1
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Transparent 5μm quartz interdigitated electrode chip for gas sensing, biosensing, and photoelectric applications.
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Product
32G DDR5-4800 288Pin 2GX8 1.1V Registered Samsung Chip
AQD-D5V32GR48-SB
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Samsung Original Chip, Increased Banks and Burst Length. DDR5 4.8GT/s, Same-Bank Refresh, On-die ECC for Enhanced RAS.
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Product
5μm Transparent Quartz Interdigitated Electrode Chip
TIM1
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5μm transparent quartz IDE chip designed for MEMS, gas sensing, bioelectrochemical, and photoelectric applications.
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Product
4G DDR4 2400 288Pin 512MBX8 1.2V Registered Samsung Chip
AQD-D4U4GR24-SG
Memory Module
DDR4-2400 Registered DIMM. – standard height, 30μ" gold plating thickness (IPC-2221 Standard) 1.2V power consumption. Low-power auto self- refresh (LPASR) Provides better reliability, availability and serviceability (RAS) and improves data integrity.
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Product
Metal Foil Low Resistance Chip Resistor
MFF
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*Low Resistance / TCR / EMF / Inductance*Excellent long term stabilityRoHS compliant and halogen free.*Lead free.*High precision current sensing and voltage division.
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Product
100μm Gold Interdigitated Electrode Chip
IGE1
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Gold interdigitated electrode chip with a 100μm gap for gas sensing, humidity monitoring, and biosensor applications.
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Product
16GB DDR5-5600 288Pin 2GX8 1.1V Unbuffered Hynix Chip
AQD-D5V16GN56-HB
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Hynix Original Chip, Increased Banks and Burst Length, DDR5 5.6GT/s, Same-Bank Refresh, On-die ECC for Enhanced RAS.
