Showing results: 91 - 105 of 592 items found.
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Pomona Electronics
Low-profile fine-pitch chips, desnely populated boards, or vertical boards, Pomona test clips connect you with confidence.
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ASML
Our HMI e-beam solutions help to locate and analyze individual chip defects amid millions of printed patterns.
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ASML
ASML's industry-leading computational lithography products enable accurate lithography simulations that help to improve chip yield and quality
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Aven Inc.
A digital still or video camera that uses a CMOS-based image sensor chip rather than a CCD to record the picture.
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id150 SERIES -
ID Quantique SA
Intended for large-volume OEM applications, the id150-1x8 is the only multichannel solid-state single photon detector on the market. It consists of a CMOS silicon chip packaged in a standard TO8-16pin header with a transparent window cap. The chip combines 8 in-line single photon avalanche diodes that can be accessed simultaneously for parallel processing. square in center-to-center A fast active quenching circuit is integrated within each pixel in order to operate each diode in photon counting regime. The chip is mounted on a printed circuit board on top of a single-stage thermoelectric cooler (TEC). A thermistor can be used to measure the temperature of the chip. Only two low power supplies of +5V and -25V are needed for operation in photon counting mode. The fast active quenching circuit leads to a dead time of less than 50ns per channel. An outstanding timing resolution of less than 60ps allows high accuracy measurements.
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Moortec
Range of in-chip monitoring and embedded sensing fabrics allows for meaningful data to be captured at each stage of a chip’s lifecycle. Manufacture | Wafer Sort | Package Test | In-field | End-of-lifeDeep in-chip sensing, telemetry & analytics enablement. Highly distributed, real-time thermal analysis. Supply voltage sensing for power optimisation. Chip assessment for chip to product appropriation.
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200 V -
Macom Technology Solutions Holdings Inc.
The MACOM KV CAPSTM Si high voltage capacitors feature very high working voltage ratings, very low loss and excellent stability by virtue of their novel internal construction and very high-quality dielectric layers. These capacitors are available as unpackaged chips. The chips have gold bonding surfaces on both terminals to enable excellent bonding and minimum contact resistance.
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500 V -
Macom Technology Solutions Holdings Inc.
The MACOM KV CAPSTM Si high voltage capacitors feature very high working voltage ratings, very low loss and excellent stability by virtue of their novel internal construction and very high-quality dielectric layers. These capacitors are available as unpackaged chips. The chips have gold bonding surfaces on both terminals to enable excellent bonding and minimum contact resistance.
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UNIVANS Co., Ltd.
the electrical characteristics of the individual CHIPs in WAFER that have been completed through the FAB stage during the semiconductor fabrication process
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TRd, TRs, TRds equipment family -
LEMSYS
The equipment is designed to test IGBTs, MOSFETs and free wheeling Diodes from single chip to complex power modules and IPMs.
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Advantech Co. Ltd.
Edge AI Inference computers have NVIDIA Jetson chips for video image applications in surveillance, transportation, and manufacturing sectors.
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FMC231 -
Vadatech Inc
The FMC231 is an FPGA Mezzanine Carrier (FMC) per VITA 57 specification. The board has quad ADC (the ADC chips are dual channels) and quad DAC (the DAC chip is quad channel). The FMC231 utilizes TI ADS54J60 (option for ADS54J69) providing 16-bit conversion rates of up to 1.0 GSPS and a DAC DAC39J84 providing 16-bit conversion rates of up to 2.8 GSPS.
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CI2000-RQD -
Shanghai ChangAi Electronic Science & Technology Co.,Ltd
Determining gas concentrations by measuring the thermal conductivity of the gas, CI2000-RQD analyzer uses advanced thermal conductivity sensor with single chip technology. It adopts platinum thread as sense organ to make up Imbalance Bridge, which output signal has a relationship with tested gas volume. And the single chip will magnify, sieve wavelength, modify linearly and criteria the signal by electric procedure.
