Showing results: 76 - 90 of 592 items found.
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IMV Corporation
A Piezo-resistive Accelerometer has a stable structure composed on a silicon chip created by the micromachining and semiconductor production technology. A mass and a beam on which a set of the Piezo-resisters are created on the silicon chip. A set of electrical bridged is formed by such Piezo-resistive resisters to generate signals proportional to the applied acceleration.
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On-Chip Analyzer -
iSYSTEM ag
If you are in need of an embedded software development platform that does more, much more, than just debugging, then our family of BlueBox Debug and Trace tools is the hardware you are looking for. Fully integrated into our winIDEA IDE, these hardware tools provide the link between your chosen microcontroller platform’s on-chip debug implementation and your development PC.
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1870D -
Chroma ATE Inc.
The Chroma 1870D Series (1870D/1870D-12) are specifically Designed automated test equipment for chip inductors. It comprises Various test functions that are required for verifying chip inductors. In addition, an automated tape packaging machine at the end of production line is equipped to fulfill demand for automated manufacturing.
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MPI Photonics Automation
MPI’s Sorter Series are improving production efficiency and yields for market sectors related to LED chip, package production, discrete device handling, and IC substrate manufacturing. Deploying MPI’s Pick & Place technology, the Sorter Line offers dedicated sorting and defect inspection solutions particularly suited for GaN, GaAs, Vertical LED Chip, Flip Chip, and Laser Diode applications. With a proven heritage of and market-advanced technologies, MPI offers competitive and differentiated solutions that are scalable and cost-effective.
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Naprotek, LLC.
The 01311 attenuator chip series is designed to achieve precision and tight flatness with an attenuation accuracy of ± 0.2 dB on our 1-10 dB pads and ± 0.3 dB on our 11-20 dB pads. SemiGen tests 100% of all attenuator chips prior to shipment to verify that they meet specifications.
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Naprotek, LLC.
The SemiGen 8000 and 8100 series of MIS Capacitors are available in a wide variety of capacitance ranges and sizes. They are made with prime starting material and consist of an Oxide/Nitride layer that provides low dielectric loss and high standoff voltage. These RF microwave chip capacitor products are available in chip form only.
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Analog Devices Inc.
SigmaDSP® processors are fully programmable, single chip audio DSPs that are easily configurable through the SigmaStudio™ graphical development tool, and are ideal for automotive and portable audio products. SigmaDSP chips are available with integrated sample rate converters, A/D converters, D/A converters, and output amplifiers.
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Advanpack Solutions Pte Ltd.
Like in conventional fabrication, integrated circuits are created on the wafer but near the end of the manufacturing process, the attachment pads are metalized on the surface of the chips to make them more receptive to solder. Then solder dots are deposited on each of the pads, and chips are cut, flipped, and positioned so that the solder balls are facing the connectors on the external circuitry.
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Naprotek, LLC.
SemiGen builds high power tantalum nitride resistor chips to customer specifications. We can manufacture chip resistors using a variety of substrates in various thicknesses to meet your specific needs. Resistors can be produced with element features under 0.002 inch for high density or high value resistor applications. Low noise stable TCR and chip sizes under 0.010 inch x 0.020 inch are routinely processed in production quantities. SemiGen’s series of Thin Film Resistors offer proven stability, low noise, and excellent TCR of both Tantalum Nitride (TaN) and Nichrome (NiC) resistive films. From our standard product offering, to custom requirements, this series of resistors is offered in a large selection of chip size, resistance values, and tolerances.
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Advanpack Solutions Pte Ltd.
A substrate interposes between an IC chip and a motherboard to enable the IC chip to communicate with the motherboard effectively. Typically, the IC chip is attached onto the substrate and assembled into an IC package before connecting to the motherboard. It is an essential part of the IC package and is responsible for a successful packaging process. Also, it plays an important role in making the IC chip to become a real product and a real solution for end customers. In the past years, semiconductor technologies were highly driven by PC applications which follow Moore’s law in technology migration. In recent years, the emergence of mobile applications increasingly, become the main driver in the semiconductor industry. These mobile applications requires a new kind of substrate that have ability for making IC packages with smaller form factor, thin profile, better thermal, mechanical and electrical performance.
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nRF51822 Series -
Raytac Corp
Raytac nRF51822 module provides 16K & 32K RAM option with Chip Antenna & PCB Antenna for selection.
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Macom Technology Solutions Holdings Inc.
MACOM's chip capacitors are used extensively in commercial and aerospace and defense applications. Our capacitors are designed for long-term reliability and repeatable performance in a variety of hybrid microwave circuit applications operating up through the Ku-band frequency. MACOM’s capacitors have the distinct advantage of higher capacitance per unit area, resulting in smaller chips for a given capacitance.
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Pomona Electronics
Low-profile fine-pitch chips, desnely populated boards, or vertical boards, Pomona test clips connect you with confidence.