Showing results: 331 - 345 of 592 items found.
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Teledyne LeCroy quantumdata
Teledyne LeCroy offers a wide variety of products for engineers in the R&D lab. R&D testing entails functional testing for source and sink devices as well as interoperability testing for diagnosing problems between A/V devices. Solutions for silicon chip manufactures are available for both source and sink devices. Quantum Data solutions are available for testing HDMI, MHL, DisplayPort, HDBaseT and 3G-SDI products.
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Terma A/S
Flight Processor Emulators are an essential part of satellite simulators – both for testing of flight software and at the heart of operational simulators. The Terma Emulator is a suite of instruction-level emulators, based in the ESOC Emulator Suite, supporting several processors used in the Space industry: MIL-STD-1750 in both A and B variants. ERC32 in both 3-chips configuration (691-E) and single chip configuration (695-F). LEON 2 (AT-697)...
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Macom Technology Solutions Holdings Inc.
MACOM's receivers are widely used in point-to-point radio, aerospace and defense, and other broadband communications applications. Operating between the 4.5 - 45 GHz frequency range, our receivers feature an integrated LNA, mixer and LO buffer amplifier onto a single chip. Available in lead-free QFN or SMD packages, our receivers boast excellent noise figure and conversion gain performance.
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DPA Components International
DPEM (Decapsulate Plastic Encapsulated Module) is DPACI’s patented Turn-Key Solution to replacement of obsolete high reliability devices in legacy systems. From dissolving the plastic encapsulation of a semiconductor device to re-bonding new wires onto a chip or package lead frame, complete solutions are offered. DPACI retains reliability test data as well as customer testimonials for the process and can share this information on a need-to-know basis.
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28317 -
Parallax Inc.
The Parallax TSL1401 Linescan Imaging Daughterboard provides one-dimensional sight to almost any microcontroller. It is designed for plug-in compatibility with Parallax’s BS2pe Motherboard but can be used with other BASIC Stamp modules, the Parallax Propeller, the SX, PICs, and AVRs, to name just a few. It is a platform suitable not only for evaluating TAOS’s TSL1401R imaging chip, but also for incorporation into OEM products, as well as hobbyist, robotic, and educational platforms.
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CP39101 -
LinkedHope Intelligent Technologies Co.,Ltd.
CP39101 is a 3U CompactPCI 4-channel independent isolated serial communication board, designed for industrial communication applications, compliant with PICMG R3.0 2.1 specification.CP39101 adopts EXER 17D158 communication processor as the master control chip. Each of the on-board 4-channel serial port can be individually configured as RS232, RS485 or RS422, and in any mode, CP39101 can be operated properly in extended temperature ( -40℃ to +85℃ ) range.
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MC400 -
Manncorp
The MC400 Pick and Place machine places an enormous range of components, quickly and accurately, from 0201s through 100 x 150 mm SMDs, including BGAs, MBGAs, CSPs, µBGAs, MLFs, flip chips, odd form components and ultra-fine-pitch parts down to 15 mil. The system is easy to program and operate and comes standard with universal CAD conversion and teach-in capability.
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AmITX-AL-I -
ADLINK Technology Inc.
The AmITX-AL-I is a low-profile Thin Mini-ITX embedded board supporting an Intel Atom® processor E3900 series, Intel® Pentium® processor N4200, and Intel® Celeron® processor N3350 system-on-chip (SoC). The AmITX-AL-I is specifically designed for customers who need optimized processing and graphics performance with low power consumption in a long product life solution.
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SL100 -
TEAM SOLUTIONS, INC.
The SL100 uses a standard 16450 UART with baud rate settings that makes it capable of communicating with a Chrysler CCD Vehicle bus. The SL100 uses a protected interface driver chip, as prescribed by the bus specification, to connect with vehicle peripherals in a robust and highly noise immune way. The card automatically configures to become another COM port by using the built-in O.S. drivers that are tried and tested and are optimized to work in the Windows environment.
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mPCIe-IDIO-8 -
Acces I/O Products, Inc.
The mPCIe-IDIO-8 consists of a type F1 PCI Express Mini Card (mPCIe) interface board that connects to a Mobile-ITX-sized, DB-37M Isolation Module via an included 9” cable. That module is designed to be easily panel-mounted in any application environment. It uses the high speed PCI Express bus to transfer digital data to and from the card. The digital I/O is compatible with 8255 PPI chips making it easy to program.
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mPCIe-II-16 -
Acces I/O Products, Inc.
The mPCIe-II-16 consists of a type F1 PCI Express Mini Card (mPCIe) interface board that connects to a Mobile-ITX-sized, DB-37M Isolation Module via an included 9” cable. That module is designed to be easily panel-mounted in any application environment. It uses the high speed PCI Express bus to transfer digital data to and from the card. The digital I/O is compatible with 8255 PPI chips making it easy to program.
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mPCIe-IIRO-8 -
Acces I/O Products, Inc.
The mPCIe-IIRO-8 consists of a type F1 PCI Express Mini Card (mPCIe) interface board that connects to a Mobile-ITX-sized, DB-37M Isolation Module via an included 9” cable. That module is designed to be easily panel-mounted in any application environment. It uses the high speed PCI Express bus to transfer digital data to and from the card. The digital I/O is compatible with 8255 PPI chips making it easy to program.
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1110087 -
Aries
144 Pin VQFP to PGA Adapter. Convert surface mount VQFP packages to a 13 x 13 PGA footprint. Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs. Pins are mechanically fastened and soldered to board using Aries patented process, creating a reliable electrical connection and rugged contact. Consult factory for panelized form or for mounting of consigned chips.
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SolarWIS Platform -
ASM Assembly Systems
Eliminating the opportunity for problematic wafers to enter cell manufacturing lines greatly improves output and yield. ASM AE’s wafer sorter features 3D area inspection capability to inspect wafer thickness, total thickness variation (TTV), saw marks, as well as wafer bow and warpage. SolarWIS also includes modules that can inspect for stain, geometry, micro-cracks, edge chips, resistivity, P or N conductivity and lifetime.
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SparkFun Electronics
The Alchitry Au+ is the "gold" standard for FPGA development boards and it's possibly one of the strongest boards of its type on the market. The Au+ substitutes a more robust & scalable FPGA chip (Xilinx XC7A100T) that allows for more complex application circuits. The number of Configurable logic blocks (LABs/CLBs), Logic Elements, and total RAM bits are all nearly 3x that of the standard Au; see "Features" for more details.