Showing results: 256 - 270 of 592 items found.
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nanoX-AL -
ADLINK Technology Inc.
The nanoX-AL is a COM Express® COM.0 R3.0 Type 10 module supporting Intel Atom® processor E3900 series system-on-chip (SoC). The nanoX-AL is specifically designed for customers who need optmized processing and graphics performance with low power consumption in a long product life solution.
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PAS 5500 -
ASML
In 1991, seven years after the company was founded, we launched the PAS 5500, which turned out to be our breakthrough platform. This system was able to dramatically reduce manufacturing times for our customers, and its modular design enabled them to produce multiple generations of advanced chips using the same system.
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ESP8266 Thing -
SparkFun Electronics
This is the SparkFun ESP8266 Thing Dev Board – a development board that has been solely designed around the ESP8266, with an integrated FTDI USB-to-Serial chip. The ESP8266 is a cost-effective, and very capable WiFi-enabled microcontroller. Like any microcontroller, it can be programmed to blink LEDs, trigger relays, monitor sensors, or automate coffee makers, and with an integrated WiFi controller, the ESP8266 is a one-stop shop for almost any Internet-connected project. To top it all off, the ESP8266 is incredibly easy-to-use: firmware can be developed in Arduino, and uploaded over a simple, serial interface. The ESP8266 Thing Development Board breaks out all of the module’s pins, and the USB-to-serial converter means you don’t need any peripheral components to program the chip. Just plug in a USB cable, download the Arduino board definitions, and start IoT-ing.
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Dev Board (with Headers) -
SparkFun Electronics
This is the SparkFun ESP8266 Thing Dev Board --- a development board that has been solely designed around the ESP8266, with an integrated FTDI USB-to-Serial chip. The ESP8266 is a cost-effective and very capable WiFi-enabled microcontroller. Like any microcontroller, it can be programmed to blink LEDs, trigger relays, monitor sensors or automate coffee makers. With an integrated WiFi controller, the ESP8266 is a one-stop shop for almost any internet-connected project. To top it all off, the ESP8266 is incredibly easy to use; firmware can be developed in Arduino and uploaded over a simple serial interface. The ESP8266 Thing Development Board breaks out all of the module’s pins with pre-soldered headers, and the USB-to-serial converter means you don’t need any peripheral components to program the chip. Just plug in a USB cable, download the Arduino board definitions, and start IoT-ing.
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ams AG
The AS721x/AS722x are complete System-on-Chip (SoC) sensor-integrated IoT smart lighting managers for color-tunable white lighting applications. They also support daylight harvesting and color/lumen maintenance lighting applications. 0-10V control and network-enabled high-level command inputs are combined with industry-standard PWM and 0-10V outputs for direct control of LED power systems.
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Skylink Microwave
Skylink SSPAs incorporate state-of-art DPD and well-done Heat Dissipation technologies with available LDMOS, GaN & GaAs Chips. Solutions of SSPA frequency range from 9kHz to 50GHz and output power up to kilowatts and includes basic PA modules to integrated chassis with embedded software for local and remote control and monitoring.
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SX-PCEAC2 -
Silex Technology
The SX-PCEAC2 is powered by Qualcomm Atheros radio chip, the QCA6174-5, which features 2x2 wave 2 MU-MIMO technology. It is a dual-band 802.11 a/b/g/n/ac module with Bluetooth support which is designed for devices that require wireless connectivity in a small form factor combined with high performance with throughputs reaching up to 867Mbps.
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SX-PCEAC2 -
Silex Technology
The SX-PCEAC2 is powered by Qualcomm Atheros radio chip, the QCA6174-5, which features 2x2 wave 2 MU-MIMO technology. It is a dual-band 802.11 a/b/g/n/ac module with Bluetooth support which is designed for devices that require wireless connectivity in a small form factor combined with high performance with throughputs reaching up to 867Mbps.
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Vishay Intertechnology, Inc.
Vishay's proximity, reflective, transmissive, slotted interrupters, optical and ambient light sensors put the "smart" into smart devices. Advantages of Vishay sensors include best-in-class performance, in-house chip manufacturing and assembly including AEC-Q101 automotive grade product lines, and comprehensive range of package types for wide range of applications.
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GateVision -
Concept Engineering GmbH
GateVision PRO is the third generation of graphical netlist analyzers from Concept Engineering. Completely rewritten to run on modern 32/64bit platforms, GateVision PRO provides the designer of even the largest chips with intuitive design navigation, schematic viewing, logic cone extraction and interactive logic cone viewing for debug support and design documentation.
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SBC347D 3U -
Abaco Systems Inc
The VPXcel3 SBC347D rugged single board computer is based on the highly integrated Intel® Xeon® D processor platform. The multiple core Xeon D brings the high performance of Intel Xeon processors into a dense, low power system-on-chip solution, ideal for High Performance Embedded Computing (HPEC) applications.
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SX-NEWAH -
Silex Technology
Powered by NRC7292 System-on-Chip from Newracom, SX-NEWAH is industry’s first IEEE 802.11ah Wi-Fi module that operates in the Sub 1GHz license-exempt band. It provides a much greater range over 2.4GHz and 5GHz Wi-Fi technologies and a much higher data rate than propriety Low-Power Wide-Area (LPWA) technologies such as LoRa and Sigfox.
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cExpress-KL -
ADLINK Technology Inc.
The cExpress-KL is a COM ExpressR COM.0 R2.1 Type 6 Compact size module featuring the 64-bit 7th Generation Intel® Core™ i7/i5/i3 and IntelR CeleronR Ultra-Low TDP processors (formerly "Kaby Lake U") with CPU, memory controller, graphics processor and I/O hub on a single chip.
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VP431 -
Abaco Systems Inc
VP431, the next generation of our highly successful VP430, is a 3U VPX commercial off-the-shelf direct RF processing system that features the 3rd-generation Xilinx Radio Frequency System-On-Chip (RFSoC). The VP431 maximizes I/O channel density, reduces the radio frequency signal chain complexity, and allows for heterogeneous processing capability.
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Macom Technology Solutions Holdings Inc.
They provide uniformity, durability and repeatability in circuit fabrication. The coils are polyimide coated to protect from ambient contaminants, and to eliminate the need for conformal coating. Quartz substrates are rugged and reduce dielectric losses. Chips may be bonded using either conductive or non conductive epoxies, and wire bonded with gold wire or ribbon by thermocompression bonding.
