Showing results: 466 - 480 of 592 items found.
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MKS Instruments
MKS RF Power Generators provide reliable solid state power for thin films processing equipment. They are vital components of semiconductor fabrication systems, which produce the integrated circuits (ICs) or chips required by modern computers and electronic equipment. MKS RF Generators, combined with our Impedance Matching Network and our V/I Probe form a complete RF Delivery System.
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400-02 -
Srico, Inc.
Srico’s optical voltage probe uses advanced, proprietary optical chip technology to achieve precise, interference-free measurement. Our sensor and optical fibers are made of dielectric materials. This facilitates a high degree of isolation between the voltage test point and the instrumentation system ⎯ at a safe distance of 100 meters and more. This system senses, measures, and transmits electrical data very accurately.
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HELIOS -
Diamond Systems Corp
Helios is a low power, mid-range performance PC/104 form factor single board computer combining a highly integrated CPU with Diamond Systems’ renowned high-accuracy data acquisition circuitry on a single board, reducing size and cost while increasing ruggedness. Helios utilizes a Vortex integrated single chip CPU operating at 800MHz or 1GHz, and 256MB of DRAM soldered on-board.
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Seismic Source Co.
*GPS accuracy for time break collection and source equipment locations.*32-bit, high speed, ADC chip for lower noise and increased accuracy for signatures.*Operates independently of crew, including observer and shooter or operators.*Can be used with any Vibrator Control System.*Great for monitoring rental equipment and operators.*Provides accurate start times that can be used with any nodal recording system.
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104-DIO-48E -
Acces I/O Products, Inc.
The circuits use an 82C55A PPI with mode 0 supported. Ports A, B and C are buffered with 74ABT245 transceivers and pulled up to 5V. The optional 82C54 has three-sixteen bit down-counters within one chip. These counters are useful for making frequency outputs, measuring frequency of square waves, pulse width outputs, pulse width measurements etc. Software drivers are provided on CD.
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N2115A -
Keysight Technologies
The N2115A DDR4 BGA Interposers are soldered in between the DRAM and PC board or DIMM raw card where the DRAM would normally be soldered. They are designed with the PCB or DIMM foot print on the bottom side and the DRAM footprint on the top side. The signals from the memory controller chip and DRAM are then passed directly to the top side of the BGA probe adapter where they can be accessed with the oscilloscope probes.
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SAJE -
SiliconAid Solutions, Inc.
SAJE is the SiliconAid Suite of JTAG related standards focused tools for chip development, verification, validation and patterns generation of ATE, Board, and System Test. Each tool can be used as a point tool by itself to compliment other tools in your flow. However, the SAJE Tool Suite used together in a flow can provide a total solution that also leveraging previous steps for debug and analysis.
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Saluki Technology Inc.
The new SEL7 series programmable DC electronic load is a new generation product designed by Saluki Technology. Incorporating high-performance chips, the SEL7 series delivers high speed and high accuracy with a resolution of 0.1mV and 0.01mA (basic accuracy is 0.03% and basic current rise speed is 2.5 A/μs).SEL7 series have wide application from production lines for cell phone chargers, cell phone batteries, electronic vehicle batteries, switching power supplies, linear power supplies, and LED drivers, to research institute, automotive electronic, aeronautic and astronautic, maritime, solar cell and fuel cell etc. test and measurement applications.
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SynapsePlus CCD -
HORIBA, Ltd.
Superfast electronics (up to thousands of spectra per second). Very low read noise. Best linearity in its class. Different chip types to suit every spectroscopy need. Open Electrode (OE) 1024 x 256 pixels, Front-illuminated UV enhanced (FIUV) - 2048 x 512 pixels, Front-illuminated visible (FIVS) - 2048 x 512 pixels, Back-illuminated UV enhanced (BIUV) - 1024 x 256 and 2048 x 512 pixels, Back-illuminated visible (BIVS) - 1024 x 256 and 2048 x 512 pixels, Back-illuminated deep depletion (BIDD) – 1024 x 256 pixels.
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CP32001 -
LinkedHope Intelligent Technologies Co.,Ltd.
CP32001 is designed based on the second generation Intel® Atom™ processor and D525, D455,.The processor has the advantages of low power consumption, high performance and other characteristics and also equipped with high performance Southbridge chips: the Intel® I / O Controller Hub 82801HBM (ICH8M).CP32001 memory controller supports up to 4 GB of DDR3 memory (2x 2GB).The maximum resolution of VGA display core is 2048x1536.CP32001 is a small PC, integrates many common interfaces, for example: USB, Gigabit Ethernet. SATA II and COM, and also equipped with high-performance sound card interface.
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Teledyne RF & Microwave
For over three decades, Teledyne Microwave Solutions has built a strong heritage delivering advanced value added services to the military, space and industry sectors of aerospace. With test capabilities up to 40 GHz, TMS offers chip and wire assembly of products ranging from single die through complex hybrids which can then be submitted to a combination of customer-specified RF and DC testing and environmental screening. TMS offers a complete portfolio of screening and testing services for device sorting, labeling, lead forming and tinning, and tape-and-reel packaging, as well as LAT services on packaged devices or bare-die, including diodes, transistors, and MMICs.
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JonDeTech
The sensor measures a very useful 0.17 mm in thickness and is made of plastic. Essentially it is a piece of robust plastic that can be used “bare” – without protective housing, such as a metal casing commonly used by other producers. The sensor it is less than 0.2 mm. thin and it is made using plastic membrane. This configuration makes the sensor so robust it can be used “bare” – without protective housing such as a metal container. Due to the fact thatSince the sensor chip can be used applied bare, means it can be used in a totally new ways, which can re-defines todays the current view on application design and reduces the cost of the entire system, and not just the sensor-element as such.
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Teledyne Defense Electronics
For over three decades, Teledyne RF & Microwave has built a strong heritage delivering advanced value added services to the military, space and industry sectors of aerospace. With test capabilities up to 40 GHz, Teledyne offers chip and wire assembly of products ranging from single die through complex hybrids which can then be submitted to a combination of customer-specified RF and DC testing and environmental screening. We offer a complete portfolio of screening and testing services for device sorting, labeling, lead forming and tinning, and tape-and-reel packaging, as well as LAT services on packaged devices or bare-die, including diodes, transistors, and MMICs.
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Z‑Series -
Keysight Technologies
At the extremes of electrical and optical measurements, you need to make rise time measurements without being limited by scope bandwidth. You need to see your signal and not oscilloscope noise, and you need fast analysis and hardware acceleration. The Infiniium Z-Series delivers this and more with its RealEdge technology enabling 63 GHz of oscilloscope bandwidth and superior signal integrity. The Z-Series takes advantage of indium phosphide chip technology and custom thin film packaging to give you extremely low noise, low jitter, and high effective number of bits. These technologies allow you to see the true representation of your signal.
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Xeltek
Until now,Support 401 IC manufacturer, 103004 pcs devices and keeps growing.Features:Supports 87454 types of devices from 305 IC manufacturers (by 3/15/2013) and keeps growing.Supports EPROM、Paged EPROM、Parallel and Serial EEPROM、FPGA、PROM、FLASH(NOR & NAND)、BPROM、NVRAM、SPLD、CPLD、EPLD、Firmware HUB、Microcontroller、MCU；Supports devices with Vcc as low as 1.2V. Socket Adaptors available for DIP、SDIP、PLCC、JLCC、PGA、LGA、SOIC、SOJ、SOT、QFP、TQFP、PQFP、VQFP、MQFP、LQFP、TSOP、SOP、TSOPII、PSOP、SSOP、TSSOP、SON、EBGA、FBGA、FTBGA、VFBGA、μBGA、CSP、SCSP、QFN、HVQFN etc.High programming speed.Built with 144 universal pin-drivers. Universal adaptors are available for varies packages up to 144 pins. Quick new device support. Popular NAND FLASH Platform supported including Samsung (XSR1.0/1.6), QualComm, HYNIX（HIFFS）, MTK(Solution V1.1), ICERA (v1.0/2.0), ST （7162、7141等）, AMLOGIC(IF2/0), REALTEK, PICOCHIP, DataLight ( Flash FX Pro), Marvell(310/303/920/935…), BroadCom, ZTE, Intel (CE4100)，UBI, LEADCORE(L1809OG), MSATR etc. Customer-specific NAND solution available.PC hosted mode and stand-alone dual modes. Under PC hosted mode the programmer is controlled by a PC via USB2.0 (high speed) to program a chip. Under stand-alone mode the programmer is controlled via a 6-KEY keypad and a 20 character by 4 line LCD display. A CF card is used to store the project files.User can operate multiple units to construct a concurrent multiprogramming system thank for the stand-alone mode. IC manufacturer approved programming algorithms are used for high reliability.Testing functions for logic devices.Advanced and powerful software functions.Production mode starts chip operation at the moment the chip is inserted in the socket properly.Project function simplifies processes such as device selection, file loading, device configuration setting, program option, and batch file setting into one touch step.Password can be set for project files and production volume controlBatch command combines device operations like program, verify, security into a single command at any sequence.Dynamic buffer makes it possible that each chip is programmed with different data file. Applications including serial number, MAC address etc.Log file is useful for quality tracking.Many safety mechanisms are built including self-diagnosis, wrong chip placement detection, poor-pin-contacting detection, ID checking, over-current and over-voltage protection etc.Windows XP/Vista/Win7/ Win8/Win10 compatibility.
