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Passive or active components test and their interconnected circuitry in silicon or germanium.

See Also: Integrated Circuit, IC


Showing results: 406 - 420 of 592 items found.

  • 3.4 MP Custom Lens Low Light Camera Module

    e-CAM30_CUMI0330_MOD - Sensory Analytics

    e-CAM30_CUMI0330_MOD is a high performance, small form factor, 3.4 MP pluggable Low Light Camera Module with S-Mount lens holder. It is based on AR0330 - a 3.4MP CMOS Image sensor from ON Semiconductor®. It has a dedicated, high-performance Image Signal Processor chip (ISP) on-board that performs the entire Auto functions (Auto White Balance, Auto Exposure control) in addition to complete image signal processing pipeline that provides best-in-class images, videos and the optional MJPEG compressions.

  • Analysis

    DENKEN Co., Ltd.

    External appearance due to non-destructive semiconductor · X-ray fluoroscopic observation, SAT observation, electrical operation confirmation, ESD fracture analysis, plastic opening observation of Chip, search for abnormal portions by EMS / OBIRCH, package (PKG) analysis, Please do not hesitate to contact us anything related to semiconductor analysis, such as observation by polishing / parallel polishing (ball and bump observation etc.), peeling observation of defective part, analysis of foreign matter by EDX · FT - IR etc.

  • TMR Current Sensors

    MultiDimension Technology Co.,Ltd.

    An open-close current transducer, high sensitivity and signal-to-noise ratio TMR chips are used in the design, which based on Tunneling magneto resistance effect. The transducer has a built-in temperature compensation and nonlinear compensation circuit, which can accurately measure DC, AC and pulse current. The transducer has many benefits ,such as high precision, wide bandwidth, low power consumption, excellent isolation performance and so on. Besides, the design of open-close structure makes it easier to install and unload.

  • I2C Isolators

    Analog Devices Inc.

    Analog Devices’ family of isolated I2C isolators support a complete isolated I2C interface. This portfolio is based on our iCoupler® chip scale transformer technology. iCoupler is a magnetic isolation technology with functional, performance, size, and power consumption advantages compared to optocouplers. By integrating iCoupler channels with semiconductor circuitry, our technology enables a complete, isolated I2C interface with a small form factor. Our I2C isolators covers applications such as central office switching, networking, and power over Ethernet.

  • OEM CCD Camera

    Syncerity BI-NIR Camera - HORIBA, Ltd.

    The TE-cooled back illuminated 2048 x 70 CCD Camera combines affordability, performance and versatility for OEM applications. With peak QE of 84% @ 700nm and 20% at 1050nm, Syncerity BI-NIR offers a relatively broad response and addresses multiple applications. In the near-NIR, this detector is a much lower cost alternative to a deep depleted CCD, with no etaloning. Syncerity’s flexible design allows our OEM-dedicated team to quickly adapt the camera for industrial requirements, ranging from alternate CCD chips to electronics

  • Diode Arrays

    Bourns

    a silicon diode with minimal packaging overhead. The small signal 0603, 1005 and 1206 Chip Diodes are lead free with Cu/Ni/Au plated terminations while the other packages (SMA, SMB, SMC, 1408, 1607, 2010, 2419, 8L NSOIC, 16L NSOIC, SOT23, SOT23-6, 16L WSOIC) use 100 % Tin terminations. All Bourns® diodes are compatible with lead free manufacturing processes, conforming to many industry and government regulations on lead free components.

  • Accelerometers - Special Purpose

    Analog Devices Inc.

    Analog Devices accelerometers and iSensor® MEMS accelerometer subsystems provide accurate detection while measuring acceleration, tilt, shock, and vibration in performance driven application. Our portfolio leads the industry in power, noise, bandwidth, and temperature specifications, and offers a range of MEMS sensor and signal conditioning integration on chip. Our MEMS-based Circuits from the Lab® reference designs have been built and tested by ADI experts to help you jumpstart your next system design.

  • Accelerometers

    Analog Devices Inc.

    Analog Devices accelerometers and iSensor® MEMS accelerometer subsystems provide accurate detection while measuring acceleration, tilt, shock, and vibration in performance driven application. Our portfolio leads the industry in power, noise, bandwidth, and temperature specifications, and offers a range of MEMS sensor and signal conditioning integration on chip. Our MEMS-based Circuits from the Lab® reference designs have been built and tested by ADI experts to help you jumpstart your next system design.

  • SparkFun Cryptographic Co-Processor Breakout

    ATECC508A (Qwiic) - SparkFun Electronics

    The SparkFun ATECC508A Cryptographic Co-Processor Breakout allows you to easily add strong authentication security to your IoT node, edge device, or embedded system. It includes two Qwiic ports for plug and play functionality. Utilizing our handy Qwiic system, no soldering is required to connect it to the rest of your system. However, we still have broken out 0.1"-spaced pins in case you prefer to use a breadboard. The ATECC508A chip is capable of many cryptographic processes, including, but not limited to:

  • Ultra Low Power Radios

    IoT - Silex Technology

    IEEE 802.11b/g/n-compliant Wi-Fi Radio (2.4 GHz)Ultra-low-power hostless Wi-Fi IoT Module features QCA4010 RadioSingle Stream System (1x1), 20 MHzIntegrated RF front end and PCB trace antennaHostless IoT application development platform with large internal memoryUART AT command set for optional external MCU hostAllJoyn supportWi-Fi Protected Setup SupportIPv4 / iPv6, TCP and UDP Protocol Supported on Chip, Offloading the Host ControllerIdeal for cost effective Internet of Things (IoT) Applications

  • EUV Lithography

    NXE systems - ASML

    NXE lithography systems are used in high-volume manufacturing of advanced Logic and Memory chips. The first systems to use ASML’s novel 13.5 nm EUV light source, they print microchip features with a resolution of 13 nm, which is unreachable with deep ultraviolet (DUV) lithography. Chipmakers use our NXE systems to print the highly complex foundation layers of their 7 nm, 5 nm and 3 nm nodes. Read about how EUV lithography went from imagination to reality.

  • Pendulum Impact Tester

    43-76 - Testing Machines, Inc.

    The new 43-76 Pendulum Impact Tester uses a high resolution optical encoder and state-of-the-art data acquisition software to determine the impact resistance of rigid materials like plastic in accordance with a wide variety of ASTM and ISO test standards for Izod, Charpy, Chip Impact, and Un-Notched Cantilever Beam testing.

  • Digital Step Attenuators

    Analog Devices Inc.

    Analog Devices provides a range of broadband IC digital attenuators that come in low cost, leadless surface mount packages. Our digital attenuator family offers excellent attenuation and includes off chip ac ground capacitors for near dc operation, making it ideal for an extensive number of RF and IF applications.

  • DisplayPort v1.3 Protocol Analysis Probe

    FS4500 - FuturePlus Systems

    The FuturePlus FS4500 DisplayPort Analysis Probe provides a mechanical, electrical and software interface to the DisplayPort bus, a digital display interface standard supported by the Video Electronics Standards Association (VESA). The FS4500 is used to design and debug computer motherboards, monitors, home theater systems, and silicon chips incorporating DisplayPort technology.

  • Clock Generation Devices

    Analog Devices Inc.

    Analog Devices offers ultralow jitter clock generation products for wireless infrastructure, instrumentation, broadband, automatic test equipment, and other applications demanding subpicosecond performance. Our clock products are ideal for generating the high speed, low noise clock signals required to clock high performance analog-to-digital converters (ADCs) and digital-to-analog converters (DACs). ADI clock ICs integrate PLL cores, dividers, phase offset, skew adjust, and clock drivers in small chip scale packages.

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