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Passive or active components test and their interconnected circuitry in silicon or germanium.

See Also: Integrated Circuit, IC


Showing results: 451 - 465 of 592 items found.

  • Low Light USB Camera Board (Color)

    See3CAM_CU30 - 3.4 MP - e-con Systems Inc.

    See3CAM_CU30 is a 3.4 MP UVC-compliant Low Light USB camera board based on AR0330 sensor from ON Semiconductor®. This Low Light Board Camera is backward compatible with USB 2.0 and supports compressed MJPEG formats at frame rates equal to USB 3.0. This sensor enables a superior low light performance. It has a dedicated, high-performance Image Signal Processor chip (ISP) that performs all the Auto functions (Auto White Balance, Auto Exposure control) in addition to complete image signal processing pipeline that provides best-in-class images, videos and the MJPEG compressions.

  • Optical Transimpedance Amplifiers

    Analog Devices Inc.

    Analog Devices optical transimpedance amplifiers offer a complete, high performance, single chip solution for converting photodiode current into a differential voltage input. Supporting data rates from 155 Mbps to 11.1 Gbps, our transimpedance amplifiers are ideally suited for data communications and telecommunications applications supporting lay protocols including 1×, 2×, 4×, and 8× Fibre Channel, 10GBASE-LX4, SONET/SDH up to OC-192 with FEC, and 10 Gigabit Ethernet. Our transimpedance amplifiers feature low input referred noise current, high input current, and low power dissipation.

  • QC Multiple Vibrators At Once

    Bird Dog 3 - 11 Channel - Seismic Source Co.

    *Additional Functionality when compared with Standard Bird Dog 3-3*32-bit, high speed, ADC chips for lower noise and increased accuracy*8 Gigabytes of Data Storage, Expandable to 16*GPS based time and location saved for every record*Stable and rugged unit for use in all conditions*Eleven-Channels, unit checks multiple vibrators at once to save time and effort*All test data saved in non-volatile memory for later download and retrieval*Connects to PC via Ethernet or optional Wi-Fi, provides control, data download and real time display and analysis of data and results

  • SparkFun FM Tuner Basic Breakout

    Si4703 - SparkFun Electronics

    This breakout for the Silicon Laboratories Si4703 FM tuner chip is a little more stripped down than our FM Tuner Evaluation Board. If your project already has an amp and just needs a full-featured FM tuner, this is the board for you. Beyond being a simple FM radio, the Si4703 is also capable of detecting and processing both Radio Data Service (RDS) and Radio Broadcast Data Service (RBDS) information. The Si4703 even does a very good job of filtering and carrier detection. It also enables data such as the station ID and song name to be displayed to the user.

  • VIS-SWIR FPA's

    Inframet

    Imaging electronic sensors sensitive in visible, near infrared, short wavelength infrared spectral bands that generate two dimensional electronic images have found mass applications in industry, defense, security, science, environmental protection, medicine etc. Imaging sensors sensitive only in VIS/NIR range are almost exclusively silicon chips manufactured using a series of technologies: CCD, CMOS. ICCD, EMCCD, EBAPS, sCMOS in color or monochromatic versions. Color VIS/NIR sensors are sensitive to light only in visible range when monochromatic VIS/NIR sensors are sensitive up to about 1000nm.

  • Anti-Sulfurated Thick Film Type Resistors, Precision Type

    ERJ-U2R/ERJ-U3R/ERJ-U6R Series - Panasonic Industrial Devices Sales Company of America

    High Precision And High Resistance To Sulfurization In One Resistor!Panasonic's ERJ-U2R, ERJ-U3R, ERJ-U6R (ERJ-U*R Series) offers high precision and also provides anti-sulfurization characteristics that avoid an open circuit caused by a sulfide disconnection. High resistance to sulfurization is achieved through the use of an anti-sulfurated electrode structure and material in the manufacture of ERJ-U*R Series Resistors. AEC-Q200 Compliance and IEC 60115-8, JIS C 5201-8 and JEITA RC-2134C Reference Standards for the entire ERJ-U*R Series of High Precision, Thick Film Chip Resistors from Panasonic ensures optimal quality and reliability.

  • 13MP MIPI Camera Module

    e-CAM130_CUMI1820_MOD – - Sensory Analytics

    e-CAM130_CUMI1820_MOD is a 13MP MIPI Camera Module. This small form factor 13MP camera module comes with S-Mount lens holder. It is based on AR1820HS – an 18MP CMOS Image sensor from Aptina™ / ON Semiconductor® and has a dedicated, high-performance Image Signal Processor chip (ISP) on-board that performs all the Auto functions (Auto White Balance, Auto Exposure control) in addition to complete image signal processing pipeline that provides best-in-class images and video and the optional MJPEG compression. Though the AR1820HS is an 18MP image sensor, the e-CAM130_CUMI1820_MOD supports only up to 13MP resolution.

  • 13MP MIPI Camera Module

    e-CAM130_CUMI1820_MOD - e-con Systems Inc.

    e-CAM130_CUMI1820_MOD is a 13MP MIPI Camera Module. This small form factor 13MP camera module comes with S-Mount lens holder. It is based on AR1820HS – an 18MP CMOS Image sensor from Aptina™ / ON Semiconductor® and has a dedicated, high-performance Image Signal Processor chip (ISP) on-board that performs all the Auto functions (Auto White Balance, Auto Exposure control) in addition to complete image signal processing pipeline that provides best-in-class images and video and the optional MJPEG compression. Though the AR1820HS is an 18MP image sensor, the e-CAM130_CUMI1820_MOD supports only up to 13MP resolution.

  • COM Express Type 6 Basic Module With 5th Gen Intel® Core™ I7 & 4th Intel® Core™ I7/i5/i3 & Celeron® Processor And Intel® QM87

    CEM880 - Axiomtek Co., Ltd.

    The CEM880 COM Express Type 6 basic module features 5th generation Intel® Core™ processor (H-processor line), one onboard 4 GB extended temperature DDR3L chip, and one 204-pin SO-DIMM DDR3L socket supporting up to 8 GB. With outstanding computing performance, low power consumption, wide temperature range, and seismic design, the rugged basic-size SoM (system on module) drives Internet of Things innovation and is ideal for graphics-intensive and rich I/O applications such as telecommunication, medical imaging, digital signage, gaming machines, military, and networking.

  • Advanced Node Solution

    Cadence Design Systems

    A major new challenge at 20nm/14nm is the requirement for extra masks (double patterning technology, or DPT) to make existing lithography work at this advanced node. Read 20 questions on 20nm - a Q&A document. Escalating data volume and denser, more complex chips are testing the limits of traditional routing architectures. Even the slightest perturbations in the design flow can cause dramatic swings in design integrity. Engineers face a predictability crisis riddled with silicon failures, performance degradation, and prolonged design schedules. And new process and design innovationshigh-k metal gate, SOI, 3D-IC packagingare intensifying the pressures of adoption and rapid deployment.

  • SparkFun Analog/Digital MUX Breakout

    CD74HC4067 - SparkFun Electronics

    This is a breakout board for the very handy 16-Channel Analog/Digital Multiplexer/Demultiplexer CD74HC4067. This chip is like a rotary switch - it internally routes the common pin (COM in the schematic, SIG on the board) to one of 16 channel pins (CHANxx). It works with both digital and analog signals (the voltage can't be higher than VCC), and the connections function in either direction. To control it, connect 4 digital outputs to the chip's address select pins (S0-S3), and send it the binary address of the channel you want (see the datasheet for details). This allows you to connect up to 16 sensors to your system using only 5 pins!

  • Material Identification Spectroscopy

    ChipCHECK - Gastops

    Gastops specializes in advanced fluid sensing and analysis systems specifically designed and developed for critical equipment condition monitoring applications.ChipCHECK offers the fastest way of making on-site equipment maintenance decisions. It is a field deployable analyzer designed for rapid on-site identification of equipment lube oil. This automated maintenance decision-support tool employs innovative laser spectroscopic technology, which enables on-site analysis of microscopic chip debris. ChipCHECK provides the maintainers with quick, reliable, and conclusive information, including the total number of particles, and the size, shape, and specific alloy classification for each individual particle on the sample.

  • SMARC

    ROM-5820 - Advantech Co. Ltd.

    The Advantech ROM-5820 stands as a state-of-the-art SMARC 2.1 Computer-on-Module, incorporating the robust NXP i.MX95 System-on-Chip (SOC). This SOC features an impressive configuration, with up to six Arm Cortex-A55 cores, accompanied by a dedicated Cortex-M7 and M33 real-time processor, and an added Neural Network accelerator. The ROM-5820 provides extensive connectivity options, including USB 2.0, USB 3.2 Gen1By1, 10 Gigabit Ethernet, MIPI-CSI, PCI Express, as well as both a dual-channel LVDS and a 4-lane MIPI-DSI Display interface. These remarkable features position the ROM-5820 as an exceptional choice for a wide variety of embedded applications.

  • Terahertz Analysis System

    TS9000 Family - Advantest Corp.

    The TS9000 series leverages Advantest's industry-leading terahertz analysis technology and expertise amassed over our decades as a global leader in semiconductor test equipment. This system provides a new high-speed, high-precision solution for measurement and analysis tasks including IC chip mold thickness and IC package / printed board wiring quality, which existing methods cannot measure adequately.

  • Development Kit

    Abaco Systems Inc

    The VP430 is 3U VPX RF processing system featuring the transformational Xilinx® Zynq® Ultrascale+™ RF system-on-chip technology (RFSoC). The ZU27DR device used on the VP430 includes eight integrated analog-to-digital converters at 4GSPS, eight digital-to-analog converters at 6.4 GSPS, a user-programmable FPGA fabric, and multi-core Zynq ARM® processing subsystem.

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