Showing results: 211 - 225 of 592 items found.
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STMicroelectronics
ST offers a series of intelligent power switches (IPS) for high-side and low-side configurations. These devices integrate the control section (logic interface, drivers, diagnostic and protection features) and the power stage on the same chip, with benefits in terms of compactness, increased system reliability and cost effectiveness.
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HF-960M -
HORIBA, Ltd.
The HF-960M uses sensors that offer outstanding corrosion resistance for high-precision, high-speed measurement of low concentrations of hydrofluoric acid, hydrochloric acid and ammonia, and is thus perfect for single-bath and wafer cleaning. The HF-960M is also an environmentally-friendly product that uses lead-free solder for mounting chips on the PCB.
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cPCI-7248/7249R -
ADLINK Technology Inc.
*PICMG 2.0 Rev 2.1*48-CH digital TTL/DTL input/output*Emulates 4/2/1 industry standard 8255 PPI (mode 0)*Direct interface with OPTO-22 compatible I/O modules Output port status read back*On board 8254 timer/counter chip
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Xeltek
Until now,Support 396 IC manufacturer, 94596 pcs devices and keeps growing.Support devices with Vcc from 1.2V to 5V. The programming speed up further increase 30% compared to SUPERPRO 5000.The programmer support files up to 256 GBytesBuilt with 144 universal pin-drivers.Universal adaptors are available for varies packages up to 144 pins. New device support will be easier. PC hosted mode and stand-alone mode. Under PC hosted mode the programmer is controlled by a PC via USB2.0 (high speed) to program a chip. Under stand-alone mode the programmer is controlled via the 6-KEY keypad and the 20 character by 4 line LCD display. A SD card is used to store the project files.User can operate multiple units to construct a concurrent multiprogramming system thank for the stand-alone mode. Only IC manufacturer approved programming algorithms are used for high reliability. (+5%~-5%) and (10%~-10%) Vcc verification enhances programming reliability.Advanced and powerful functions.Production mode start chip operation at the moment the chip is inserted in the socket properly.Project function simplifies processes such as device selection, file loading, device configuration setting, program option, and batch file setting into one touch step.Password can be set for project files and production volume controlBatch command combines device operations like program, verify, security into a single command at any sequence.Serial numbers generators are available as standard or customer-specific functions.Log file is useful for quality tracking. Over-current and over-voltage protection for safety of the chip and programmer hardware. WINDOWS XP/Vista/Win7/Win8/Win10 32/64bit compatibility
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Wewon Environmental Chambers Co, Ltd.
IC welding to PCB, IC is integrated in the chip general purpose circuit, it is a whole. Once the inside is damaged, the chip will be damaged. The goal of printed circuit boards (pcbs) is to connect IC and discrete components to form a larger working circuit. Thermal cycling equipment can detect the defects and hidden dangers of welding components in the production process, decreasing failure rate. When it fails, components can be replaced in timehttps://www.wewontech.com/thermal-cycling-test-equipment/
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STMicroelectronics
ST’s tiny silicon pressure sensors use innovative MEMS technology to ensure extremely high-pressure resolution in ultra-compact and thin packages. The devices implement proprietary technology for the fabrication of pressure sensors on monolithic silicon chips, which eliminates wafer-to-wafer bonding and maximizes reliability.
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SolGel Technologies GmbH
active areas from 0.06 mm² to 36 mm² and quadrant photodiodes for position determinationUV broadband sensitivity or with optional filters for UVA, UVB, UVC or UV indexdifferent entrance windows and housing designsown SiC chip production since 2009PTB-published high radiation hardnessPhotodiodes catalog
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Air quality 4 click -
MikroElektronika D.O.O.
Air quality 4 click is an advanced air quality sensing device that combines multiple metal-oxide sensing elements on a chip to provide detailed information of the air quality parameters. This click can output a TVOC value readings as well as the CO2 equivalent concentration readings in an indoor environment.
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TTV -
Thermal Engineering Associates, Inc.
Using the TTC-1002 Thermal Test Chip as a basis, TEA offers TTVs in flip-chip, bare die, BGA packages for a variety of thermal simulation, reliability, qualification, heat sink characterization, and TIM characterization activities. Selective unused balls are sequentially connected together for daisy-chain applications.
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AOI -
ficonTEC Service GmbH
No complex assembly process is complete without the ability to inspect and characterize the many different components used. ficonTEC’s fully automated INSPECTIONLINE systems acquire high-resolution pictures of the surfaces of interest and performs optical inspection based on the user’s criteria. For example, facet inspection of laser diodes, QC for coatings, surface inspection, top/bottom/side-wall inspection of semiconductor chips, and die sorting are just some of the many inspection tasks performed routinely by ficonTEC’s suite of inspection tools. As for all of ficonTEC’s systems, a modular approach permits the inspection platform to equipped with additional features – automatic tray handling and various feeding philosophies, testing capabilities (e.g. LIV), top/bottom chip inspection, and in-situ labelling.
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Walts Co., Ltd
Advanced Dummy Test Wafers/Chips available with over 35 different chip designs and choices of 11 different material configurations as well as kits complete with test vehicles. Custom-make test production of TEG wafer/glass (TEG=Test Element Group). Design and provide custom-make test kit.
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Veloce -
Mentor Graphics Corp.
The Veloce® Emulation Platform dramatically reduces risk in the verification of today’s complex SoCs and is a core technology in the Mentor Enterprise Verification Platform™ (EVP). Mentor’s software and application solutions and continual enhancements enable a comprehensive verification environment for IP, chip, and system level verification.
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Renesas Electronics Corp.
Renesas' signal integrity products provide a 300% reach extension over passive copper solutions, and consume 80% less power than competing optical solutions. Renesas lane extender chips with analog equalizers are the perfect solution for DisplayPort™ USB-C long active cables.
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Renesas Electronics Corp.
Renesas' signal integrity products provide a 300% reach extension over passive copper solutions, and consume 80% less power than competing optical solutions. Renesas lane extender chips with analog equalizers are the perfect solution for DisplayPort™ USB-C long active cables.
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SX-SDPGN -
Silex Technology
The Silex SX-SDPGN (Qualcomm Atheros AR6103) is a third generation wireless LAN solution, featuring 802.11n. Based on the game-changing AR6003 Wireless LAN chip, the SX-SDPGN brings 802.11n throughput, range and power eficiency to portable devices including patient monitors, printers, handheld terminals and more.