Patented DPEM Process for Die Removal
DPA Components International (DPACI)
DPEM (Decapsulate Plastic Encapsulated Module) is DPACI’s patented Turn-Key Solution to replacement of obsolete high reliability devices in legacy systems. From dissolving the plastic encapsulation of a semiconductor device to re-bonding new wires onto a chip or package lead frame, complete solutions are offered. DPACI retains reliability test data as well as customer testimonials for the process and can share this information on a need-to-know basis.
