Defect
other than specified, imperfection .
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Product
Defect Inspection and Review
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KLA’s defect inspection and review systems cover the full range of yield applications within the chip and wafer manufacturing environments, including incoming process tool qualification, wafer qualification, research and development, and tool, process and line monitoring. Patterned and unpatterned wafer defect inspection and review systems find, identify and classify particles and pattern defects on the front surface, back surface and edge of the wafer. This information allows engineers to detect, resolve and monitor critical yield excursions, resulting in faster yield ramp and higher production yield.
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Building Defect Investigations and Surveys
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Building defect investigations and surveys are needed not only when problems arise but when assurance is required that defects do not exist or that the standard of construction is such that problems are unlikely
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Product
Luminescence Defect Inspection System
INSPECTRA® PL Series
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This system uses luminescent images created using photoluminescence (PL) to perform high-speed, high-sensitivity automatic inspection for crystal defects, cracks, and luminescence defects which cannot be detected with conventional visible light surface inspection!
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Product
Semiconductor Wafer Defect Inspection Management Software
ProcessGuard
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Microtronic ProcessGUARD Software is the desktop client for the EagleView auto macro wafer defect inspection system. ProcessGUARD is a high volume, high speed semiconductor wafer defect inspection management solution that provides an easy-to-use, customizable and extensible platform and interface to automate your fabs defect inspection process. ProcessGUARD is feature rich (see below) and its newest releases include complete wafer randomization software, a user-defined defect library, and an integrated trainer and knowledge base.
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Product
Defect Isolation
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*Traverse through the physical design to trace nets and vias down to the defect location*Utilizes industry standard LEF/DEF design files, scan-based test information, tester fail logs and diagnostic reports to determine and isolate the physical defect location*Enables the user to leverage their diagnostic experience to determine the root cause of the defect*Interactive layout viewer displays scan chains, mapped mismatches of scan cells, layers, nets and subnets with search capabilities(component, net, cell)*Physical XY coordinates are always displayed for components and nets to guide the user through the design to quickly identify suspect sites for FA using techniques like Emission, OBIRCH, LIVA, TIVA, or FIB
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Product
Solar EL Defect Detector
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Jiangsu Keyland Laser Technology Co., Ltd.
Features: - Reveals invisible defects- Improves line yield prior to lamination- Improves quality and reliability of final product- Exceptional optical resolution in its class- Flexible system configuration for framed or unframed modules testing
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Product
Counterfeit Defect Coverage Tool
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The SAE Counterfeit Defect Coverage Tool is a dynamic, web-based application that supplements SAE Standard AS6171 authored by the SAE G-19A Test Laboratory Standards Development Committee. It provides potential test sequences for the identification of counterfeit electrical, electronic, and electromechanical (EEE) parts along a range of risk levels and EEE part types. Allowing users to compare alternative test sequences as a function of resources needed to implement those tests, the SAE CDC Tool is appropriate for those ordering counterfeit detection tests as well as those performing the tests.
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Product
Defect Inspection System
F30
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The F30 System boasts a five-objective turret that enables the resolution-throughput flexibility required by today’s multi-process inspection applications. Equipped with an advanced productivity suite (waferless recipe creation, simultaneous FOUP, recipe server and tool matching), the F30 System redefines inspection cost of ownership expectations.
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Product
Defect Inspection Module
EB40
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The Class 1 certified E40 and B40 modules (available separately or combined in one module) can automatically detect defects on the entire edge, from zone 1 to 5, and the entire backside. The ability to inspect the entire backside allows for faster root-cause analysis of zone 5 defects since such defects can migrate from the wafer interior.
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Product
Surface Defect Inspection System
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Wafer for inspection of surface condition of specular flat substrate, glass substrate, others φ 100 ~ φ 300 compatible
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Product
Defect Inspection Systems
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Candela® defect inspection systems detect and classify a wide range of critical defects on compound semiconductor substrates (GaN, GaAs, InP, sapphire, SiC, etc.) and hard disk drives, with high sensitivity at production throughputs.
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Product
Wafer Defect observing instrument
HS-WDI
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Application■Semiconductor wafer■Solar wafer■Solar Cell■Thin-film Cell
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Product
Surface Paint Quality Scanner
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Konica Minolta Sensing Americas, Inc
There is always a challenge to achieve a consistent high quality surface on a car body during production. The goal of the manufactures is to reduce defects and, quickly and accurately fix the ones that occur.
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Product
Atomic Force Microscope
HDM Series
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The task of identifying nanoscale defects is a very time consuming process for engineers working with media and flat substrates. Park NX-HDM is an atomic force microscopy system that speeds up the defect review process by an order of magnitude through automated defect identification, scanning and analysis. Park NX-HDM links directly with a wide range of optical inspection tools, thus significantly increasing the automatic defect review throughput. In addition, Park NX-HDM provides accurate sub-angstrom surface roughness measurements, scan after scan. Park NX-HDM, together with its industry's lowest noise floor, and its unique True Non-Contact™ technology, it is the most accurate AFM for surface roughness measurement in the market.
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Product
Intelligent Cable Fault Locator
TM800
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TM800 Cable Fault Locator is a portable field instrument working on TDR and bridge methods, adopting advanced micro-electronics technology. It is designed to locate accurate fault points in such cables as telecommunication leadsheathed cable, plastic cable or user’s lead covered wire, while the faults include break, mix, earthing, defective insulation, or poor connecting. It is and ideal function-stable instrument for the field operator to improve work efficiency, in addition, it can also be used for circuitry project checking electric property testing of the cable.
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Product
Probecard testers
MANAGER
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Today more complex probe cards are being used. More pins,higher density and larger array requires a new approach inprobe card analysis. With the soaring cost of new generationprobe cards, repair of defective cards becomes an necessity.BE Precision Technology offers all capabilities with the newMANAGER V. Future proof, up to 450 mm full wafer contactprobe cards can be analyzed with up to 88.000 test channels.High-end materials are used to stand extra tough requirements—such as 500 mm diameter diamante viewing window,ultra stiff carbon flip-table, high power Z–stage to generate 600Kg of contact force
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Product
Visual Control System of Label Printing Quality
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The created system allows detecting the following types of label printing defects:- absence or indistinct image or inconsistency of information applied by typographic method;- absence or indistinct image or inconsistency of information or going beyond the boundaries of the print field of variable information printed on the labeling machine (batch number, expiration date).The system is based on a Basler Scout A1300-32gc digital industrial camera and a panel computer.
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Product
Wafer Inspection System
AutoWafer Pro™
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AutoWafer pro is our most advanced ultrasonic equipment for detecting defects in bonded wafers in a production environment, providing fast, high-resolution scanning of 200mm and 300mm bonded wafers.
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Product
Portable PD Monitoring of Medium and High Voltage Power Equipment with UHF, AE, and HFCT
PDiagnosticM
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Power Monitoring and Diagnostic Technology Ltd.
The PDiagnosticM is a portable system that utilizes UHF, AE, and HFCT sensor modules to monitor PD signals from Medium and High Voltage power equipment.The system is ideal for monitoring critical power assets to find and monitor intermittent PD signals and to analyze the developing PD trends. The PD type is determined by automatic pattern recognition and internal defects can be found at an early stage.The system provides advanced protection with alarm functions and our Deep Learning data analysis capabilities utilizing our proprietary Intelligent Cloud Diagnostic Technology.
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Product
DM 150-Watt Transmitter
Loc-150Tx
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The Loc-150Tx, 150-Watt DM Transmitter is used primarily with the Defect Mapper (DM) Receiver, however it is also useful for those needing a low frequency, high output transmitter. Typically, the Loc-150Tx, transmitter (DM transmitter) is used to apply a signal current to the anode bed. The pipeline returns the signal via coating faults back to the transmitter. The Loc-150Tx transmitter is designed to be powered from CP (Cathodic Protection) stations, AC or external batteries, eliminating the need for internal batteries. This transmitter has a direct connection mode to apply the locate frequency onto the conductor. There is no clamp or induction mode.
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Product
Large Surface Defect Gauge
4D InSpec® XL Surface Defect Gauge
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The 4D InSpec XL Surface Defect Gauge expands 4D Technology’s 4D InSpec product line—they’re the first handheld, precision instruments for 3D non-contact surface defect measurement.
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Product
Front-end
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With geometries getting smaller, macro inspection becomes both more challenging and crucial for defect-free and high-yield wafer manufacturing. The variety of defects calls for detection optimization, fast screening and categorization of the high volume manufacturing environment, while maintaining high throughput.
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Product
DC Magnetic Flux Leakage Testing
ROTOMAT / TRANSOMAT Product Family
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Foerster Instruments, Incorporated
With the new generation ROTOMAT DA and TRANSOMAT DA flux leakage test systems FOERSTER is setting new standards in continuous quality assurance of ferromagnetic steel tubes. The test systems enable the reliable detection of natural and oblique defects, regardless of their angle or length, in addition to standardized longitudinal and transversal defects. The miniaturization of sensors together with highly integrated electronic components dramatically increases the number of channels. This makes a more precise and finer scan of the surface possible, giving a more complete set of information regarding detected defects. The newly introduced C-Scan visualizes these defects in high-definition and real-time, resulting in a completely new evaluation of the tubes to meet rising quality requirements.
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Product
NUV-PL SiC Defect Inspection System
VS6845E
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Industrial Vision Technology Pte Ltd.
Comply with IEC63068-3 Standard: Test method for defects using photoluminescence, Model VS-6845 SiC Wafer defect inspection system has capability on Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices.
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Product
Slip Line Detection System
YIS 200
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The YIS and SF Series metrology systems are designed for optical detection of wafer defects such as crystaldislocations, slip and other defects. The YIS-300HM (for 300 mm wafers) and YIS-200HM (for 200 mm wafers) utilizeMakyoh optics technology (Magic Mirror) and integrated robotic wafer handler provided by Hologenix.
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Product
Exploratory Testing
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Defects in apps and on websites directly impact customer conversions and retention. They exhaust user goodwill and ultimately damage your brand and revenues. Scripted or automated testing might indicate whether a particular customer journey works as intended, but will not necessarily reveal bugs beyond specific boundaries. They come to light only when the app or website is in front of real users.
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Product
Permanent Monitoring
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Real-time Ultrasound and Vibration data indicate changes in healthy function earlier in the P-F Curve than other condition monitoring technologies. Advanced warning allows every maintenance job to be planned while reducing levels of critical spares held in inventory. Reliability teams benefit from a proactive culture that affords them time to eliminate defects rather than simply applying band-aids.
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Product
MT Inspection Scope
Um
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● Test 12 or 24 fiber MT Connectors● Find Endface defects fast● 800x Magnification●Numbered Dial Indicator to quickly identify which fiber you're onThe Um MT Inspection Scope accurately shows defects in your MT 12 or 24 fiber connectors. Quickly view each fiber to save time and money. Our unique Fiber Dial shows which fiber you are inspecting. No more getting lost!The Um MT is compatible with our Eagle Inspect Software. Create reports with images for your MT connectors.
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Product
Making Invisible Visible
Quadra 3
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Quadra™ 3 is your partner for high quality X-ray inspection for production line quality control. Detect a wide range of manufacturing defects including BGA, QFN and IGBT attachment, PTH filling, interfacial voiding, component cracking and counterfeit device screening. High quality, high magnification inspection for product applications.
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Product
Non-contact Ultrasonic Testing System
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Yamaha Fine Technologies Co., Ltd.
Contact-free inspection through ultrasonic transmission detecting air bubbles, separation, and foreign materials inside workpieces. With a Yamaha ultrasonic amplifier installed, contact-less inspection in the air is realized. Without damaging or wetting the workpiece, it is possible to inspect the workpiece for packing defects, air bubbles, and even flaw depth.
