Defect
other than specified, imperfection .
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Network Emulator
KMAX
The KMAX network emulator helps network engineers test and measure performance in order to identify and remove defects. Network emulators turn well behaved development and test networks into the kind of slow, congested, and less-than-reliable services encountered on the internet. In addition, unlike the real internet, network emulators allow the operator to control these conditions so that products and apps can be subjected to controlled and repeatable tests, by routing selected packets through a series of impairment nodes.
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Partial Discharge Testing Equipment
PD-Analyser
This is an ‘All in One’ solution for testing and analysing partial discharges in the insulation of high-voltage transformers, cables, GIS and electric machines. The DIMRUS ‘PD Analyser’ help diagnose their insulation state and find any type of defects very effectively.It can be used for temporary or constant monitoring of partial discharge in medium and high voltage systems and cables of any rated voltage.The PD Analyser is the most useful device for condition estimation of high-voltage insulation. This multipurpose device is designed for -Partial discharge measuring in high-voltage insulation at a high noise level.Fast detecting of the defects in different high-voltage equipment and identifying how dangerous they are.
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Ultrasonic Flaw Detector
MFD550B
Based on ultrasonic principle, digital ultrasonic flaw detector MFD550B can test, orient, evaluate and diagnose various flaws such as crack, lard, air hole in workpiece’s interior swiftly and accurately without any destruction. With full digital 640X480 TFT LCD display, it show the defect clearly under the dim light and strong sunlight environment. 0-9999mm measuring range can meet the requirement for general defect inspection in manufacturing industry, metallurgical industry, metal processing industry, chemical industry and so on. Low power design with large capacity and high performance lithium ion battery module，it can work more than 10 hours continuously. Full English master-slave menu, emphasizing on user experience, collecting shortcut keys, digital shuttle rotary wheel, cross menu three operating ways inone body, customers with different habits can operate it freely. With comprehensive performance self-checking function, it can automatically generate test reports and support for many languages. With high cost performance, it is the smart choice for the practical economic model of ultrasonic testingequipment.
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CT Ratio/Burden Tester
1047
TESCO’s new CT Ratio/Burden Tester (Catalog No. 1047) is a lightweight, portable and highly accurate in-service test set to assist in finding lost revenue by testing the accuracy of your meter circuits. The Tester can help determine if there are installations errors, loose connections, incorrect ratios, resistance buildup, open CT’s, or manufacturers defects. The CT Ratio/Burden Tester measures and displays the primary and secondary current of the CT under test, and the ratio of the currents. All test data is stored in the internal memory and easily uploaded to a PC.
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3D Automated Optical Inspection
Zenith UHS
High-speed full 3D AOI that brings about a revolution in SMT process management Industry-leading speed for full 3D measuring inspection equipment skill solutions- Only solution in the industry to set inspection criteria according to IPC-610 standards- Performs defect diagnosis through measurement-based data and eliminates the causes of possible errors- Powerful 3D solder joint inspection
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Power Steering Tester Kit
PST22A
Pinpoints defective power steering pumps, defective power steering gears and kinked or clogged power steering lines.
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Auto Macro Wafer Defect Inspection
EagleView
EagleView automated macro defect semiconductor wafer inspection system provides industry leading throughput, defect detection accuracy, and wafer classification for semiconductor manufacturing. EagleView systems have inspected over 100 million semiconductor wafers worldwide. The EagleView macro defect inspection tool resolves many of the problems and pitfalls of manual and micro wafer inspection by automating and standardizing semiconductor wafer inspection processes while creating complete images of every wafer in the cassette. Unlike manual micro defect wafer inspection, EagleView’s automated wafer inspection is always consistent, tireless, reliable, and fast. EagleView helps find macro defects while there’s still time to take corrective action.
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High-speed In-Line 3D CT Inspection System
X-eye 6300
Automatically inspects the defects of products in customer's line with high-speed 3D CT tomography.Able to inspect every defects of Double-sided PCBA & BGA mounted components precisely by solving overlapped X-ray image issue.Inspection speed of 3 sec/1FOV from loading to automatic Good/NG judgement.
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Building Defect Investigations and Surveys
Building defect investigations and surveys are needed not only when problems arise but when assurance is required that defects do not exist or that the standard of construction is such that problems are unlikely
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Radiographic Inspection Test
The radiographic inspection is a non-destructive x-ray method for detecting internal physical defects in small component parts which are not otherwise visible. Radiographic techniques are intended to reveal such flaws as improper positioning of elements, voids in encapsulating or potting compounds, inhomogeneities in materials, presence of foreign materials, broken elements, etc.
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Welding Resistance Tester
WRT
The Welding Resistance Tester is used in battery assembly lines to detect defective intercell connections. It is equipped with a 5-channel test head for car and truck batteries. It features 1-20 O DC resistance ranges and a multi-line LC display for OCV, CCV, and DCR measurements for 5 intercell connections.
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(AOI) Automated Optical Inspection Systems
For automated defect detection and high-accuracy measurements. VisionGauge Online High-Speed AOI systems are perfect solutions for demanding high-throughput, high-resolution applications. These systems are perfect for a wide range of applications including MicroElectroMechanical systems (for MEMS inspection or MEMS measurement), semiconductor & discrete device inspection and measurement.
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Full 3D Inline Metrological & Imaging AOI
Metrological Full 3D AOI is achieved by measuring all 3 dimensions (X, Y and Height) to detect every measurable solder and component defect pre-reflow and/or post reflow soldering.
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SlipFinder
YIS and SF Series
The YIS and SF Series metrology systems are designed for optical detection of wafer defects such as crystaldislocations, slip and other defects. The YIS-300HM (for 300 mm wafers) and YIS-200HM (for 200 mm wafers) utilizeMakyoh optics technology (Magic Mirror) and integrated robotic wafer handler provided by Hologenix.The SF300M and SF300N systems offer a low cost functionally equivalent alternative to the YIS series.
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Downward-Looking SUMO Source For Gallium And Indium
Attain large capacity, excellent flux uniformity, negligible shutter flux transients, and minimal depletion effects with Veeco’s Downward-Looking SUMO® Source for MBE. It combines a dual filament source with an asymmetric SUMO crucible featuring a narrow offset orifice and tapered exit cone with hot-lip heating. Result: excellent material quality, low defect counts, and good thickness uniformity. NOTE: This source is not for use with aluminum.
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Non- Destructive Testing
NDT
Non-destructive testing (NDT) is an application of industrial radiography that uses X-rays to reveal defects in manufactured products or structures. Fujifilm NDT systems share digital X-ray innovations with our Fuji Computed Radiography (FCR) imaging systems.
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VisualDetect LCD Voltage Detector / Interface Tester
VDL-01AB
Hachmann Innovative Elektronik
VisualDetect LCD is an easily operated voltage detector and interface-tester. Its automatic, thorough self-test ensures reliable function. The permanently enabled interface-tester warns against defect interfaces. Additionally the LC-display indicates the measured current [I/A] and frequency [f/Hz]. Thanks to the integrated configuration menu it can be adjusted to switchgears operated below nominal voltage on-site.
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Manufacturing Defects Analyzer
eloZ1-1600
The eloZ1 Manufacturing Defects Analyzer is an in-circuit tester of the very latest generation, reliably detecting connection and assembly faults on printed circuit board assemblies. The eloZ1 can be integrated into table systems as well as into inline-systems.
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Flux Leakage Tester For Detecting Surface Defects In Hot Rolled Black Steel Bar
130MM ROTOFLUX® AC
Highly sensitive AC flux leakage is especially well suited to test hot rolled black steel bars and rods that have surface conditions which used to make finding shallow defects very difficult, if not impossible.
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Non-contact Ultrasonic Testing System
Yamaha Fine Technologies Co., Ltd.
Contact-free inspection through ultrasonic transmission detecting air bubbles, separation, and foreign materials inside workpieces. With a Yamaha ultrasonic amplifier installed, contact-less inspection in the air is realized. Without damaging or wetting the workpiece, it is possible to inspect the workpiece for packing defects, air bubbles, and even flaw depth.
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Thermal Imaging Cameras
Thermography tools are indispensable when it comes to non-contact detection of thermal differences. Thermal imagers can be used to find defects in buildings, discover damage during maintenance, or analyze thermal processes.
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Automated Marking Quality Control System
Angara
The machine vision system ASKKM "Angara" is designed to detect and reject defects in the marking of labels, excise stamps, boxes, vials, ampoules, bottles, etc., which have visual manifestations in the field of permanent or variable printing. It is installed on a conveyor or mounted in a labeling machine. Labels are checked before being applied to the product or marking on the package.
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Microelectronics And Packaging AOI
Machine Vision Products, Inc. has extensive experience in a wide range of Microelectronics and Packaging applications. MVP works with the world’s leading manufacturers on a global basis. From multiple die and wire technologies to leadframe, ball grid array and surface inspection applications, MVP has the widest applications toolbox of any AOI provider. MVP takes pride in the fact that they supply many complex inspection solutions to diverse industries such as Automotive, Telecoms, Medical Devices, Military, and Space. MVP’s 900 Series is the base platform upon which all Microelectronics and Packaging inspection solutions are based. The 900 series 2D capabilities provide metrology and defect detection using a propriety Quad-Color lighting, Telecentric optics and resolutions down to 1um. 3D height measurement capabilities allow for in-line high speed inspection of Dies, paste deposition, positional accuracy, volume and height with a resolution down to 1.13um.
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Battery Boxes Testing Equipment
Battery boxes can be tested for faults by placing the box on a metal plate. By applying a test voltage to an electrode inside the box, the moulding can be checked thoroughly - particularly at the injection points - and any faults found. Defects will be identified by a spark passing from the electrode, through the defect itself, to earth (the conductive material placed outside the battery box.
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G3 System
Dragonfly
Unique 2D imaging technology provides fast, reliable inspection for sub-micron defects to meet today's R&D needs and tomorrow's production demands. Onto Innovation's patented Truebump® Technology combines multiple 3D metrology techniques to deliver accurate 100% bump height metrology and coplanarity.
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MicroPhase I LRP - Dual Phase Voltage Detector / Phase Comparator
MP1-02P
Hachmann Innovative Elektronik
MicroPhase I LRP is an easily operated phase comparator, dual voltage detector and maintenance tester. Its automatic, thorough self-test ensures reliable function. The permanently enabled interface-testers warn against defect interfaces. Thanks to the "LRP-switch" the threshold value can be lowered from 2,5 µA (HR, MR, LR and LRM) to 1,0 µA (LRP).
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Software For Visualizing Surface Quality
STATOVISION
Foerster Instruments, Incorporated
In combination with a STATOGRAPH module, the STATOVISION software enables the visualization of eddy current signals in a clearly arranged C-Scan. This results in an image of the surface quality of the components, allowing surface defects to be precisely localized. A major advantage of the STATOVISION software is the pattern recognition, which can be used for surpressing drill holes on brake discs, for example. The documentation of the entire scan is used for continuous quality assurance.
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Scanning Acoustic Microscope
Pulse2
This industry-leading scanning acoustic microscope provides a universal inspection tool for packaged semiconductor development, production and failure analysis. With the ability to detect air defects as thin 0.05 micron and spatially resolve defects down to 10 microns, the ECHO is perfect for bump detection, stacked die (3D packaging) inspection, complex flip chip inspection and more traditional plastic packages.
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3D Solder Paste Inspection Machine (3D-SPI)
3Si Series
Saki's 3D SPI identifies critical defects and assists with process improvement.
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Test Equipment
Our Trans-Guard DCVBD meter provides a 1kV @ 1mA test signal for direct measurement of the DC breakdown voltage of a variety of transient protection devices/products to help identify protection products that may be defective or damaged.
