Defect
other than specified, imperfection .
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Receptacle Tester
RT500
Designed to detect the most common wiring problems in standard 120V receptacles.Test for correct wiring, open ground, reverse polarity, open hot, open neutral, hot and ground reversed.Conditions NOT indicated: Quality of ground, multiple hot wires, combinations of defects, reversal of grounded and grounding conductors.Large light indicators for greater visibility.Reinforced prongs for increased durability.Push-pull design with slip-resistance ribbing.Made in USA of U.S. and imported parts.
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Probing Machines
Probing machine is a wafer transfer and positioning device used for testing the electrical characteristics of chips formed on wafers. This wafer test is used to sort out good and defective chips.
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Non-destructive Eddy Current Testing of Long Products such as Tubes, Rods, Wire, and Profiles
DEFECTOMAT® Product Familiy
Foerster Instruments, Incorporated
The DEFECTOMAT systems by FOERSTER were specially developed for quality testing and process monitoring of long products. From hot testing to all bright steel processing steps, the surfaces of semi-finished products made from austenitic, (non) ferromagnetic metals can be tested for defects. The DEFECTOMAT systems operate in a contactless and non-destructive manner in accordance with the eddy current method and are used for detecting short defects, such as holes or localized defects and transverse defects. The systems detect defective materials fully automatically and reliably. Defects can be marked, classified, and automatically discarded. the test speed of up to 150 m/s facilitates 100% testing, even at high production speeds. The systems benefit from low operating costs and frugal energy consumption as well as low maintenance costs, few wear parts, and low use of materials.
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Metrology Solutions for Semiconductors
Bruker Semiconductor develops, manufactures, markets, and supports metrology solutions for thin films, which are based on novel, rapid, non-contacting and non-destructive X-ray technology. With Bruker’s acquisition of Jordan Valley Semiconductors, a name synonymous with unparalleled worldwide customer service and support, 75% of the world's top 25 semiconductor manufacturers rely on Bruker metrology tools for front-end and back-end applications, including development of their next-generation thin films. Bruker commitment to innovation and technology leadership drives the continued release of new advancements in metrology, and has garnered numerous awards and industry recognition. In applications ranging from C-S thin films materials characterization to wafer substrate analysis and defect detection, Bruker’s systems provide simulation analysis and fit. HRXRD, XRR, WA-XRD, and XRDI measurement types are fully supported, enabling researchers, production engineers, and process developers unparalleled capabilities. Whether you are a semi and C-S fabricator, R&D center or academy, or an industry materials research facility, Bruker has a specifically designed solution for your metrology needs.
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Tool and Process Monitoring
BK MIKRO
BK Mikro is typically used as a broken tool detection system but can also be used for many other applications such as object inspection, position recognition and checking for part defects. The selection of the scanner and controller for broken tool detection systems is mainly application based. Follow the links below to explore specific models or contact us with application questions about our broken tool detection systems.
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400x Bench-Top Optical Fiber Microscope - FTM-400X
Shanghai Fibretool Technology Co.,Ltd.
With coaxial illumination optic magnify system, FTM-400X can easily find the slight defects and scratches on fiber endface. High resolution image sensor and 8"pure black and white digital TFT LCD can show the most real details of fiber endface.This is an integrated fiber endface inspector, it combines optical microscope and monitor in a body other than separate designs. It has clear images and long life time. it has series of adaptors for various kinds of connectors such as multi fiber connectors, optical components. It is an essential instrument for optical manufacturing.
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Semiconductor
DieMark
DieMark Inking Systems are available in Electric and Pneumatic models and utilize convenient, disposable DieMark Ink Cartridges to streamline and optimize the process of marking defective die. With models available for nearly every test platform and configuration, Xandex inking systems are in operation daily in every corner of the world where wafer sort is performed.
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In-Process Test OTDR
8000i
The 8000i In-Process Test OTDR is the most recent addition to Photon Kinetics' family of innovative solutions for optical fiber cable testing. The 8000i's "cable test optimization" provides the balance of OTDR dynamic range and dead zone performance that's proven to be most effective for accurate characterization of typical fiber cable lengths. Dynamic range has been maximized to reduce measurement time, while resolution has been tuned to ensure that typical cabled fiber defects are detected. The 8000i delivers this optimized measurement capability at a more economical price than our full featured, final QC 8000 OTDR, which makes it a perfect fit for "in-process" testing on ribbonizing or loose tube production lines.
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Ultrasonic Imaging System
USPC 3010
Ingenieurbüro Dr. Hillger Ultrasonic-Techniques
Detects internal defects in new materials and metals. The wide frequency range up to 35 MHz enables highestresolution. A-, C-, and D-scans can be recorded. The imaging in B-scans is an option.
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DM 150-Watt Transmitter
Loc-150Tx
The Loc-150Tx, 150-Watt DM Transmitter is used primarily with the Defect Mapper (DM) Receiver, however it is also useful for those needing a low frequency, high output transmitter. Typically, the Loc-150Tx, transmitter (DM transmitter) is used to apply a signal current to the anode bed. The pipeline returns the signal via coating faults back to the transmitter. The Loc-150Tx transmitter is designed to be powered from CP (Cathodic Protection) stations, AC or external batteries, eliminating the need for internal batteries. This transmitter has a direct connection mode to apply the locate frequency onto the conductor. There is no clamp or induction mode.
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X Ray Flaw Detector
A non-destructive testing (NDT) device used to inspect materials for internal flaws or defects such as cracks, voids, inclusions, and weld discontinuities.
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Vision Sensors
Companies in a wide range of industries rely on vision sensors to perform simple pass/fail, go/no go inspections that help ensure products and packaging are error-free and meet strict quality standards. Cognex In-Sight 2000 vision sensors provide easy and reliable inspections thanks to powerful vision tools, modular lighting and optics, and an easy-to-use setup environment. By reducing defects and increasing yield, Cognex vision sensors help manufacturers streamline their operations and increase profitability.
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Advanced 3D Automatic X-Ray Inspection
V810 S2EX
V810 is "3D Automatic X-ray inspection System" that corresponds to the double side mounting SMT-PCB that is not able to be checked by a transmission-type X-ray machine. It has the ability to detect a wide range of defects, and It have 100% complete defect detection capability in the Hip-defective.And, it is the inspection machine of world's highest level that combines the ability of the ultra-fast test speed and the lowest false call positives further.
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Manual Testing Services
With manual testing services, we will hand-pick a team dedicated solely to your project. Our professionals will work with your developers, business analysts, and managers to go over requirements, build a comprehensive test plan, design thorough test cases, rapidly execute the tests, help remediate defects, and retest until the project is satisfactorily completed. The same individuals will be with you from beginning to end, so they have a complete understanding of the project and how you want it done, and you will always know exactly who you are dealing with. The same QA Engineers that develop the test cases will also execute them, leaving no room for misunderstandings and greatly expediting the process.
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Wafer Level Test
Double sided wafer inspection system is an automatic inspection system for afterdicing wafer chip. It can do double side inspection simultaneously. The appearance defects of wafer chip are clearly conspicuous by using advanced illumination technology. Illumination and camera acquisition mode can be adjusted for various wafer process, like vertical chip or flip chip.
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Photoluminescence Mapping System
VS6845A
Industrial Vision Technology Pte Ltd.
With its unique optical design technology, the System detects and classifies defects that affect yield and uses advanced photoluminescence (PL) technology to enable real-time monitoring of MOCVD production processes.
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Leak Testing
Leak testing is a non-destructive method to verify the presence of a leak in a component or device.It is implemented as a control methodology for monitoring production process and product quality control. Leak tests are used to find out possible leaks due to non-suitable material (porosity, blowholes, cracks), or in the machining process to find out machining errors or defective parts, and ultimately in assembly, to find out missing or defective gaskets, wrong positioning or assembly. The presence of a leakage could jeopardize the correct functioning of the component, device or its life span, and can also be potentially dangerous for the environment and the safety of its user.
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PCI Fault Insertion Switch Cards
Pickering's PCI Fault/Signal Insertion Switch Cards feature a breakout arrangement that allows faults to be attached to the sensor lines, this includes the breaking of a connection or the adding of defect all of which can simulate connectivity problems in the system.
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In-Line X-ray Inspection System
X-eye 6200
Automatically in-line inspect Solder joint defects of PCBA, and other defects on Hidden Components.Able to judge Good/NG fast with inspection speed of 1sec/FOV and the program can set ROIs conveniently.Performing X-ray inspection in various production site, integrated with other manufacturing equipements.
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Rotational Metrology System
The ZeroTouch® Rotational Metrology System is a precise, high-speed, in-line or near-line metrology, and inspection system that measures critical dimensions of rotors, stators, brake discs, and other cylindrical parts, providing manufacturers with real-time metrology, and inspection data to optimize production processes, detect defects, and improve ROI.
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In-Sight Vision System
D900
The In-Sight D900 is a smart camera powered by In-Sight ViDi software designed specifically to run deep learning applications. This embedded solution helps factory automation customers easily solve challenging industrial OCR, assembly verification, and random defect detection applications anywhere on the line that have gone uninspected because they are often too difficult to program with traditional, rule-based machine vision tools.
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SOLAR CELL TESTER
The tester is designed for terrestrial solar cell incoming/outcoming inspection with the purpose of checking and optimizing parameters and preventing manufacture defects of solar modules. Solar cells are not heated in process of inspection due to the use of xenon pulse lamp installed in the tester.
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TO-CAN Package Inspection System
7925
Chroma 7925 is an automatic inspection system for TO-CAN package. The appearance defects over 30 um like lens scratch, partial are clearly conspicuous by using advanced illumination technology. Because the height variation of tray and package exists, Chroma 7925 can calculate the focus distance and compensate to overcome the variation with auto focus function.
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Alternator/Battery Load Tester
6031
• Tests for defective alternator diodes including GM trio test• Performs complete battery test• 125 Amp load checks state of charge • Searches for excess starter current and alternator/regulator output voltage• Includes test lead set (610271)• Made in USA of US and Global Components
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Transportation Environment Data Recorder
For investigation and evaluation of the transportation route by measuring vibration,temperature and humidity on the whole travel.For search of the cause of defects of any expensive freights as shock, fall, temperature or humidity,and location of place and time.For evaluation of vibration durability of the freights or R & D of the most suitable package using the function of tailoring.Specifications
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Quick Change Probes For Weld Seam Testing (ASTM)
SONOSCAN Q
In addition to angle beam probes according to european standards (EN), we offer probes with quick-change wedges for ultrasonic weld seam inspection as well as various wedges for the american market. Quick-change probes are used wherever access to the inspection object is difficult to reach with the larger AWS transducers. The relatively small, round elements also offer better defect resolution.
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X-Ray Inspection
X-ray inspection systems are used wherever defects need to be detected by non-destructive means. The spectrum of use is broad and ranges from quality controls for complex assemblies, to the testing of materials for cracks and air inclusions, to foreign matter inclusions and shape deviations. The trend toward miniaturization, higher packing densities, and the relocation of components to the interior of the assembly require precise X-ray inspections that detect hidden defects quickly and reliably. X-ray systems from Viscom are used for the inspection of series assemblies as well as sampling and prototype controls. They take care of typical inspection tasks in concealed areas such as void controls, THT filling level measurements, and HIP inspections. At the same time, the systems reliably determine defect features such as coplanarity and polarity – at high inspection speeds and in a cost-effective way.
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Reject Station for X-Ray Image Analyser
IV-110I
IV-11OI is a reject station for X-Ray Image Analyser known for having an X-Ray Image Wire Defect Detection and a compact and space-saving dimension.
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Partial Discharge Testing Equipment
AR700
PD Defect Location in High-Voltage Equipment Insulation by Acoustic Sensors To act on deteriorating insulation the source of PD must be known.The insulation defects produce partial discharges, which emits electrical impulses, radiation of electromagnetic waves as well as acoustic signals.The AR700 measures acoustic signals with multiple sensors spread over the transformer. Then the software determines the failure location using the time difference of all incoming signals. Finally, these coordinates are shown in a 3D model of the transformer. AR700 device is used for measuring of acoustic signals on the external surfaces of gas-insulated breakers and substations, power transformers and other tank high-voltage equipment. The acoustic signals are caused by partial discharges in the insulation, which is the sigh of the defects.The advantage of “AR700” device is the quick installation of the acoustic PD sensors on the external surface of high-voltage equipment tank. The sensors have magnetic holder that is why there is no need to de-energize the equipment for the sensors installation. “AR700” device has 4 syn-chronic channels for acoustic signal measurement. This gives the possibility not only to find the defects in the insulation, but also to locate them. The location function of the “AR700”device is unique for acoustic devices.
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Ultrasonic Testing
Device for detecting defects in finished products, semi-finished products and welded joints, as well as determining their coordinates and using DAC and DGS functios.
