Wafer Inspection
Inspection of integrated circuits in wafer form for contaminants, flatness, size, and roughness.
See Also: Wafer, Wafer Thickness, Wafer Failure Analysis, Wafer Edge, Wafer Resistivity, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Handlers
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Product
Video Inspection Probe
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With today's high data rates and high definition services, connector quality and inspection has never been so important. Research reveals that up to 75% of all optical network failures are attributed to poor connector quality - reduce your installation time and ensure your network is reaching its full potential.The Video Inspection Probe (VIP) application for Anritsu field testing platforms gives operators a safe, easy way to analyze and document connector conditions.
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Product
Defect Inspection and Review
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KLA’s defect inspection and review systems cover the full range of yield applications within the chip and wafer manufacturing environments, including incoming process tool qualification, wafer qualification, research and development, and tool, process and line monitoring. Patterned and unpatterned wafer defect inspection and review systems find, identify and classify particles and pattern defects on the front surface, back surface and edge of the wafer. This information allows engineers to detect, resolve and monitor critical yield excursions, resulting in faster yield ramp and higher production yield.
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Automated Surface Inspection for Glossy Components
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Flawlessly glossy surfaces are among the most important quality features of many premium products. The smallest surface defects immediately have a degrading effect on the product. The result: disappointed end customers or buyers. At the same time, reflective surfaces are often very sensitive and a challenge for optical metrology. A manual inspection is tedious, expensive, and ultimately always governed by subjective decision criteria. During production, faulty painting or coating processes can cause high scrap rates. Defects that are not detected even during the final inspection can lead to expensive complaints and, in the worst case, to the loss of the customer. Only an efficient, automated surface inspection achieves the highest quality at acceptable costs.
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Thickness and Flaw Inspection
MultiScan MS5800
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Eddy current testing is a noncontact method used to inspect nonferromagnetic tubing. This technique is suitable for detecting and sizing metal discontinuities such as corrosion, erosion, wear, pitting, baffle cuts, wall loss, and cracks in nonferrous materials.
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Field Inspections
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MISTRAS Group has evolved into an asset protection industry leader on the backbone of our expansive non-destructive testing (NDT) and field-testing portfolio.
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3D Automated Optical Inspection System
EAGLE 3D 8800 SERIES
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EAGELE 3D 8800 AOI applies 8-way projection for 3Dmeasurements to all models, minimizing shadow effectserrors and performing 100% 2D&3D examinations simultaneouslyin all FOV areas.
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Product
Automatic Drilling Inspection
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Landrex Technologies Co., Ltd.
Automatic Drilling Inspection
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Product
Surface Inspection Gauge for the Shop Floor
4D Inspec Surface Gauge
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Product
Magnetic Particle Inspection
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Shanghai Xianda Denshijiki Industry Co.,Ltd
Using the "leakage magnetic flux" phenomenon generated from the scratches, the magnetic powder (or fluorescent magnetic powder) of the ferromagnetic material scattered on the surface by magnetizing the specimen is adsorbed to the scratch. Observe this and detect scratches.
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Inspection Assist Software
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RVI software is a must for streamlining your inspection processes and improving overall efficiency. Olympus inspection assist software provides support throughout the entire process, whether streamlining on-site inspections or assisting with remote report generation.
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Silicon & Compound Wafers
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Compound semiconductors are undergoing a major expansion addressing many new applications and using various materials such as SiC, GaN, GaAs and others, to improve the performance of new devices in several segments such as Power and Face Recognition.
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Product
Property Inspection Solution
DJI / IMGING
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Advanced DJI drone solutions for the P&C Insurance industry. IMGING™ to conduct full roof and property inspections with incredible detail in as little as ten minutes from start to finish, and they’re getting high-resolution, actionable data they can use to make informed decisions. By combining Insurance-focused workflows and patents-pending autonomous flight control technology, IMGING is making roof inspections safer, quicker, and more consistent. It’s deceptively simple, amazingly powerful, and built specifically for Insurance.
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Product
Non-contact Measurement Wafer Sorting System (Belt Drive Tranceportation)
NC-6800
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*Non-contact measurement of resistivity, thickness and conductivity (P/N)*Number of cassette station can be changed by customers request*Eddy current method for resistivity, Electric capacitance method for wafer thickness*Temperature correction for silicon wafer function
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Product
Vehicle Inspect Lines Software System
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Foshan Analytical Instrument Co, Ltd.
Flexible control mode(A collective-type control mode can be adopted,but a distributive-type control can also be adopted); Powerful system function(Distributive-type control and collective-type management,provide the functions of equipment debugging,vehicle log-in,vehicle testing and bill printing.A secret code and right-limit can be set so that the system safety function is enhanced); Remote control(A remote log-in,main remote control and remote printing can be realized in accordance with the actual conditions of the testing station.At the sametime,provides a powerful data-base and one station with multi-wire:That is one testing station has more
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Product
Automated Wafer Prober for Magnetic Devices and Sensors
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Hprobe design and fabricate turnkey automated testing equipment (ATE) for electrical characterization and testing of integrated circuits under magnetic field such as MRAM (Magnetic Random Access Memory) and sensors. In each phase of the technology and product development as well as during mass manufacturing, a dedicated magnetic tester is available.
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Visual Inspection Software
AdVISE
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R&S®AdVISE visual inspection software automates the process of visually monitoring an equipment under test (EUT) during a test sequence. This eliminates human inattention, ensures reproducible results and simplifies the test documentation. A typical application is EMS testing with R&S®EMC32 and R&S®ELEKTRA test software.
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High-speed In-Line 3D CT Inspection System
X-eye 6300
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Automatically inspects the defects of products in customer's line with high-speed 3D CT tomography.Able to inspect every defects of Double-sided PCBA & BGA mounted components precisely by solving overlapped X-ray image issue.Inspection speed of 3 sec/1FOV from loading to automatic Good/NG judgement.
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Borescopes & Inspection Cameras
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Triplett Test Equipment & Tools
Is an inspection camera with a detachable wireless 3.5" color display. It features 4x digital zoom, water resistant 8mm camera with 3.5ft cable, and 4 adjustable white LEDs for illumination.The wireless display detaches from the handle for additional freedom in viewing, and internal magnets will conveniently mount it to steel surfaces. With the included Micro SD card you can save snapshots and live video. Saved files can be viewed on the LCD screen or downloaded to a computer via the USB port.
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Semiconductor Package Inspection System
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NIDEC-READ GATS (Grid Array Testing System) series carry out open/leak circuit tests on semiconductor package (MCM/CSP/BGA).
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Product
The Complete Solution for Optical Surface Quality Inspection
OptiLux SD (Scratch-Dig)
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RedLux’s OptiLux SD system provides the complete solution for control of optical surface quality (scratch-dig) by offering a breakthrough in measurement performance along with conformity to industry standards. Designed with flexibility in mind and further enhanced by a range of customer inspired features, the OptiLux SD can support the most demanding of optical surface quality inspection processes, from highly customized optical components in low volume, to standard components in high volume.
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Protective Coating Inspection
Kit 6
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The Elcometer Protective Coatings Inspection Kit 6 is a comprehensive kit which incorporates all the key gauges and inspection accessories required to assess a structure before, during and after coating has been applied.
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Product
Wafer Test
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Automatic KLA wafer probers with tray-to-tray-wafer-handling are operated 24h a day and 7 days a week. Data retention bake/tests are done at wafer level
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First Article Inspection Services
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API’s, on-site, first article measurement services provide inspection data on parts and assemblies with direct comparison against CAD models or drawings. Generated 3D measurement data from our portable metrology equipment and 3D scanners offers a comprehensive analysis of the physical part under measurement. Inspection reports can include 3D color maps or generated 3D models for detailed computer analysis.
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Product
Wafer Tester
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Tokyo Electronics Trading Co., Ltd.
A vital step in the Semiconductor Value Stream, focusing on electrical screening and consumption of Known Good Die (KGD).
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Product
Solder Paste Inspection System
LaserVision SP3D Mini
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The LaserVision SP3D Mini offers the same level of overall measurement capabilities as the VisionPro SP3D. Utilizing a lower cost microscope platform and the ability for customers to supply their own PC if needed, the SP3D Mini sets the "affordable" boundary on reliable, low cost SPI solutions.
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Qualicoat Powder Coating Inspection Kit
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The aim of Qualicoat is to establish the minimum standard that plant installations, coating materials and finished products which have been powder coated must meet.Within this quality label, Qualicoat identifies a range of inspection requirements to be undertaken with regards to the quality control of powder coated products.The Elcometer Qualicoat Powder Coating Inspection Kit provides the various test instrumentation required to meet the high standards of this organisation.
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Bond Inspection
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Increasingly thin wires, finer pitches, as well as more applications of thick wire for higher capacities are among the current trends in wire bonding. At the same time, the requirements for robust and defect-free bonds are increasing, for example in assistance systems in the automotive sector and in RF modules in the 5G mobile communications network. This makes reliable inspections extremely important.
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Wafer Flatness Measurement System
FLA-200
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*Measures Thickness, TTV, Bow, Warp and site and global Flatness (ASTM compliance)*Measures all materials including Si, GaAs, Ge, InP, SiC*Full 500 micron thickness measurement range without re-*calibration2-D /3-D Mapping software
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X-ray Inspection Of PCB Boards And More
The RTX Series
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Glenbrook’s RTX Series of modular, real-time systems include models designed to meet a variety of production requirements including circuit board components. Numerous options make it easy to customize any RTX model to your specific application. All hardware and software elements are fully compatible to ensure the continued value of your equipment.
