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Product
Test Handler
M4841
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High-Throughput Device Handler for Volume Production Testing of MCUs and DSPs.
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Product
Test Handler
M4872
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Improve Efficiency in High-Volume Manufacturing and Device Characterization.
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Product
Single Site Test Handler
3210
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Chroma Single Site Test Handler 3210 supports various package types such as BGA series, QFP series, QFN, TSOP, and more. The handler is primarily designed for early device design and engineering validation.
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Product
Die Test Handler
3112
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Chroma 3112 is a productive pick & place handler for high volume single- or multi-site bare die testing.
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Product
Tabletop Single Site Test Handler
3111
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The Chroma 3111 is an automated pick & place handling system ideal for small lot engineering samples and/or NPI test development parts.
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Product
Test Handler
M6242
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Optimal Test Handler for Mass-Production DRAM, with Double the Throughput.
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Product
Wafer Level Test Handler
Kronos
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Wafer level test handler for 6/9DOF sensors with real stimulus. Very high UPH capacity and the lowest cost of test (COT). KRONOS is one of the only wafer level test solutions for motion sensors with real stimulus.
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Product
Hybrid Single Site Test Handler
3110
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Chroma Hybrid Single Site Test Handler 3110 is a full range ATC (Active Thermal Control) test handler capable of handling device bodies up to 120x120mm with 450kg force load.
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Product
Equipment Front End Module Wafer Handler
Sigma EFEM
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Integration transforms the bond tester into a fully automated system. We offer various types of EFEM (Equipment Front End Module) wafer handlers, to combine with a Sigma W12 for operator-free bond testing.
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Product
Test Handlers
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Boston Semi Equipment test handlers are designed for optimum production performance on your test floor.
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Product
Wafer Prober
Prexa
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The latest fully automated 300mm wafer prober. The system offers excellent productivity and advanced functions, contributing to KGD (known good die) testing for advanced packaging.
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Product
Gravity Test Handlers
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Extremely small to very large packages, very wide temperature range, high throughput octal site and quad site testing.
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Product
MEMS Handler
4664-IH
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The ULTRA P is a high performance production handler that provides thermal conditioning, full 6 DOF mechanical stimulus and an electrical ATE signal path for testing Micro-Electro-Mechanical Systems (MEMS) Accelerometers and Gyroscopes.
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Product
Wafer Test
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WinWay’s commitment to technology, quality and service ensures our interface solutions go above and beyond to exceed your expectations. Our products and services have a proven track record of delivering customer success in semiconductor testing. The Company offers comprehensive test interface solutions ranging from wafer-level test, package-level test to thermal management.
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Product
Wafer Inspection System
AutoWafer Pro™
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AutoWafer pro is our most advanced ultrasonic equipment for detecting defects in bonded wafers in a production environment, providing fast, high-resolution scanning of 200mm and 300mm bonded wafers.
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Product
Wafer Manufacturing
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Scientific Computing International
A procedure composed of many repeated sequential processes to produce complete electrical or photonic circuits on semiconductor wafers in semiconductor device fabrication process.
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Product
Octal Test Site Handler
3180
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The Chroma 3180 is a productive pick & place system for high-volume multi-site IC testing.
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Product
Wafer Test
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Silicon Turnkey Solution, Inc.
Most foundries provide wafers already probed to a set of DC parameters at room temperature to ensure they meet a basic subset of the package-part specification. Beyond this basic set of tests, more rigorous testing is often needed to meet specifications requiring die to be 100 percent probed, identify and segregate devices with higher performance levels and guarantee that parts will perform to a certain specification level.
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Product
Batch Wafer Transfer Tools
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Dou Yee Enterprises (S) Pte Ltd
Dou Yee Enterprises Batch Wafer Transfer Tools
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Product
Die-To-Wafer Bonding Systems
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Several different D2W bonding methods are available and selected depending upon the application and customer requirements. In direct placement D2W (DP-D2W) bonding, the singulated dies are bonded to the target wafer one by one using a pick-and-place flip-chip bonder. Plasma activation and cleaning of the surfaces of the dies on the handler wafer are essential steps for establishing a high-yielding bond and electrical interface between the dies and target wafer. This is where the EVG320 D2W activation system comes in.
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Product
Wafer Prober
Precio XL
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Fully automated 300mm wafer prober. The system achieves high productivity, excellent contact performance, improved cleanliness, and short lead time, and offers a number of high value-added functions as options.
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Product
Wafer Inspection Products
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Sonix provides manual and automated wafer inspection and metrology systems for wafers ranging from 100mm to 300mm, with extensive analysis capabilities at both the wafer and device level. These industry-leading automated wafer inspection systems are used by the world’s top manufacturers to ensure quality from development through production.
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Product
Wafer Test Solutions
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Wafer Test Solutions has established leadership positions in developing and deploying application-specific test solutions for MEMS devices, offering wafer and frame probing stations suitable for R&D, Wafer Sort, and Final Test. We offer state-of-the-art solutions to test environmental and motion sensors in wafer and other advanced packages.
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Product
Production Wafer Level Burn-in
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TV19 VersaTile™ probe cards are designed with Celadon’s patented ceramic technology for superior electrical performance, yet is highly modular due to it’s 28mm x 28mm chassis. Micro-adjustments can be made in seconds with an allen wrench and a microscope. Easily align VersaTile cards for different wafer layouts using a 4.5” compatible 1×3 , 200mm, or 300mm VersAdjust plate.
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Product
Wafer Testing
Trio Vertical
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SV TCL's TrioTM is a reliable solution for advanced wafer testing challenges, specifically full array and parallel probing. We offer a complete line of vertical probe card products, each designed for your unique application.
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Product
Tube-To-Tube Gravity Handler
Rasco SO1000
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The SO1000 test handler’s mature design and high reliability it provides excellent cost of test. Highly flexible as a result of a broad range of device kits can be combined with various Sensor and MEMS applications.Featuring a fast plunger with up to four plunger heads for high speed and high throughput with index time down to 500 ms. Available in single, dual, and quad configurations.
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Product
High Parallel Test Handlers
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High parallelism test in strip or singulated device batch handling on carriers, WLCSP post singulation test.
