Wafer Inspection
Inspection of integrated circuits in wafer form for contaminants, flatness, size, and roughness.
See Also: Wafer, Wafer Thickness, Wafer Failure Analysis, Wafer Edge, Wafer Resistivity, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Handlers
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Wafer Test
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Silicon Turnkey Solution, Inc.
Most foundries provide wafers already probed to a set of DC parameters at room temperature to ensure they meet a basic subset of the package-part specification. Beyond this basic set of tests, more rigorous testing is often needed to meet specifications requiring die to be 100 percent probed, identify and segregate devices with higher performance levels and guarantee that parts will perform to a certain specification level.
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Product
Batch Wafer Transfer Tools
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Dou Yee Enterprises (S) Pte Ltd
Dou Yee Enterprises Batch Wafer Transfer Tools
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Product
In-Line Inspection
Mapvision | Q
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Inspect ALL features for EACH part you manufature within your Takt time – even for the most complex components with hundreds of features.
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Product
Inspection Cameras
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The inspection camera opens a new view into the insides of machines and systems; whether an endoscope, thermal imaging camera or infrared thermometer - an inspection camera is the ideal instrument for monitoring and maintenance.Due to the flexible control of the endoscope or the visual display of potential damage areas in machines or systems, weaknesses and points of failure can be detected and therefore be prevented. The inspection camera make this possible without the need for complex disassembly.The inspection camera is used by electricians, safety experts, expert witnesses, mechatronics, and mechanics. The inspection camera is also used for apprenticeships and in-service training. An inspection camera can be applied internally as well as at school or at universities for demonstration purposes. With their help, inspections in the industrial sector can be organized considerably faster, more targeted and more cost-efficient. An inspection camera is an important companion in the course of everyday work.
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Product
Wafer Prober
Precio XL
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Fully automated 300mm wafer prober. The system achieves high productivity, excellent contact performance, improved cleanliness, and short lead time, and offers a number of high value-added functions as options.
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Product
Die-To-Wafer Bonding Systems
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Several different D2W bonding methods are available and selected depending upon the application and customer requirements. In direct placement D2W (DP-D2W) bonding, the singulated dies are bonded to the target wafer one by one using a pick-and-place flip-chip bonder. Plasma activation and cleaning of the surfaces of the dies on the handler wafer are essential steps for establishing a high-yielding bond and electrical interface between the dies and target wafer. This is where the EVG320 D2W activation system comes in.
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Wafer Test Solutions
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Wafer Test Solutions has established leadership positions in developing and deploying application-specific test solutions for MEMS devices, offering wafer and frame probing stations suitable for R&D, Wafer Sort, and Final Test. We offer state-of-the-art solutions to test environmental and motion sensors in wafer and other advanced packages.
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Optical Inspection
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Typically, in a standard PCB manufacturing facility, there will be a department where people perform inspection of PCBs through a manual processes, such as visual inspection with magnifiers, microscopes, etc...
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Production Wafer Level Burn-in
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TV19 VersaTile™ probe cards are designed with Celadon’s patented ceramic technology for superior electrical performance, yet is highly modular due to it’s 28mm x 28mm chassis. Micro-adjustments can be made in seconds with an allen wrench and a microscope. Easily align VersaTile cards for different wafer layouts using a 4.5” compatible 1×3 , 200mm, or 300mm VersAdjust plate.
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Wafer Testing
Trio Vertical
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SV TCL's TrioTM is a reliable solution for advanced wafer testing challenges, specifically full array and parallel probing. We offer a complete line of vertical probe card products, each designed for your unique application.
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Product
Defect Inspection and Review
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KLA’s defect inspection and review systems cover the full range of yield applications within the chip and wafer manufacturing environments, including incoming process tool qualification, wafer qualification, research and development, and tool, process and line monitoring. Patterned and unpatterned wafer defect inspection and review systems find, identify and classify particles and pattern defects on the front surface, back surface and edge of the wafer. This information allows engineers to detect, resolve and monitor critical yield excursions, resulting in faster yield ramp and higher production yield.
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X-Ray Inspection
MXI Jade Plus
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Restrictions in manufacturing materials and ever increasing expectations for reliability mean ensuring quality product manufacture is more important than ever. Jade Plus enables you to Prove Your Quality and reduce product returns from the field, and the associated cost and damage to reputation.
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Product
Inspection Toolkit
OTK-4000
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The Inspection Toolkit contains selected tools for verifying the existence of threatening electronic surveillance devices.
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Product
WAFER MVM-SEM® E3300 Series
E3310
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The E3310 is a WAFER MVM-SEM®* for next generation wafers, supporting 1Xnm node process development and volume production at the 22nm node and beyond. With its high-speed carrier system employing a dual arm vacuum robot, and low-vibration platform to improve measurement accuracy, the E3310 delivers high throughput and performance for wafer measurements. Its multi detector configuration and unique 3D measurement algorithm also enable stable, high-accuracy measurement of 3D transistor technologies such as FinFET. The E3310 makes a significant contribution to reducing process development turnaround time and improves productivity for next-generation devices.
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Wafer Cathodoluminescence Microscope
Säntis 300
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Attolight’s Quantitative CL-SEM offers “No Compromise” large field fast scanning simultaneous acquisition of SEM images, hyperspectral CL maps, and optical spectra. Smaller diameter wafers, or miscellaneously shaped substrates are manually loaded on intermediary 300mm susceptors subsequently handled automatically by the tool.
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Product
Wafer Level Test Handler
Kronos
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Wafer level test handler for 6/9DOF sensors with real stimulus. Very high UPH capacity and the lowest cost of test (COT). KRONOS is one of the only wafer level test solutions for motion sensors with real stimulus.
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Protective Coating Inspection
Kit 6
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The Elcometer Protective Coatings Inspection Kit 6 is a comprehensive kit which incorporates all the key gauges and inspection accessories required to assess a structure before, during and after coating has been applied.
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MT Inspection Scope
Um
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● Test 12 or 24 fiber MT Connectors● Find Endface defects fast● 800x Magnification●Numbered Dial Indicator to quickly identify which fiber you're onThe Um MT Inspection Scope accurately shows defects in your MT 12 or 24 fiber connectors. Quickly view each fiber to save time and money. Our unique Fiber Dial shows which fiber you are inspecting. No more getting lost!The Um MT is compatible with our Eagle Inspect Software. Create reports with images for your MT connectors.
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LED Inspection
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Indicates which LEDs are not working. Checks if all diodes are placed in the correct places. Independently configures a test program for each new LED panel. Fast and effective – 1000 LED panel test takes up to 3 seconds.
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Thick Film Inspection
785
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For thicker coatings such as coal tars, extruded and tape coatings, the Model 785 has a range of infinite voltage settings from 1,000 to 15,000 volts.
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Product
Wafer Test
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Automatic KLA wafer probers with tray-to-tray-wafer-handling are operated 24h a day and 7 days a week. Data retention bake/tests are done at wafer level
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Full Wafer Test System
FOX-1P
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Enables High Throughput, Single Touchdown, Full Wafer Production Testing. Capable of simultaneously testing up to 16,000 die in a single wafer touchdown. Resource configurable up to 16,384 " Universal Channels " - each programmable as anI/O, Clock, Pin Parametric Measurement Unit ( PPMU ) or Device Power Supply ( DPS ). Software-enabled per site flexibility to support small and large device pin count test needs. Comprehensive functional and parametric test capabilities Deep functional pattern data and capture memory optimized for BIST/DFT testing. Per channel PMU for per site parametric testing Individual channel over-current protection to protect wafers and probe cards. Configured for high volume production. Compatible with industry standard probers and probe cards. Available as an integrated test cell with prober, probe cards and 16,384 channel probe I/F. Configurable as a single or dual system integrated test cell.
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Ultrasonic Wafer Scanner
AutoWafer
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Installed in more wafer applications than all other automatic ultrasonic testing tools combined, AutoWafer provides a complete, production-ready wafer scanner for wafers from 100mm to 200mm, including multiple sizes in a single batch.
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Specialist Inline Inspection
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NDT Global treats each pipeline individually from the offset. Before a project even begins, a feasibility study of the pipeline detail is conducted by NDT Global, to determine the appropriate tool and required modifications to complete the inspection. NDT Global has an extensive engineering capability in this regard and has a proven track record in providing tailored solutions to deal with a wide variety of pipeline characteristics.
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X-ray Inspection System
X-eye SF160 Series
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High-performance Micro-focus Open Tube with 160kV is installed and fine defects of 1㎛ are detectable. High-resolution X-ray image can be gained with world best magnification by installing high-price Open Tube as standard.Dual CT function can be purchased adtionally, and exact location & size of defects can be detected and analyzed with this function.
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WiFi Inspection Cameras
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WiFi Inspection Cameras generates a local WiFi hotspot (without Internet access) through which video clips and still photos of hard-to-reach or hard-to-see areas or equipment captured by the probe camera can be sent to an app-enabled smartphone or tablet for viewing and sharing. Free apps for iOS devices (iPhones or iPads) and Android devices are available from the iTunes App Store and Google Play Store, respectively. The three WiFi cameras differ in probe length, camera lighting and grip style.
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Thickness and Flaw Inspection
FOCUS PX / PC / SDK
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Olympus offers a complete advanced phased array integration solution that meets the requirements of your most demanding customers. The solution includes the FOCUS PX, a powerful and scalable acquisition unit; FocusPC, a powerful data acquisition and analysis software program; and three software development kits (SDK), FocusControl, FocusData, and OpenView SDK, to customize your software interface based on your application and control FocusPC for a fully automated inspection solution.
