Wafer Inspection
Inspection of integrated circuits in wafer form for contaminants, flatness, size, and roughness.
See Also: Wafer, Wafer Thickness, Wafer Failure Analysis, Wafer Edge, Wafer Resistivity, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Handlers
-
Product
GPR System for Concrete Inspection
StructureScan™ Mini
-
Geophysical Survey Systems, Inc.
The StructureScan Mini safely locates metallic and non-metallic targets within concrete structures up to a depth of 20 inches. The system incorporates an auto target feature that marks the detection of features of interest. This function also estimates the depth of targets and automatically adjusts the depth scale.
-
Product
Entry Level GPR System for Concrete Inspection
StructureScan Mini LT
-
Geophysical Survey Systems, Inc.
The StructureScan™ Mini is GSSI’s all-in-one GPR system for concrete inspection. This handheld system locates rebar, conduits, post-tension cables, voids and can be used to determine concrete slab thickness in real-time.
-
Product
Inspection of Glue Dot Assembly
ScanINSPECT's ADI
-
ScanINSPECT provides a simple and user-friendly alternative to inaccurate and time-consuming manual inspection methods or expensive, high-end AOI systems. ScanINSPECT uses a simple Windows user interface integrated with an automatic table and image-processing unit. This combination allows 100% inspection of adhesive placement on PCBs after dispensing.
-
Product
Automatic Flight Inspection System
AT-950
-
The AT-950 is the easiest to use and the fastet performing FIS available.
-
Product
Hi-Definition Video Inspection Station with Measuring
VIS810
-
Video Inspection Stations are available with?or without on-screen measurement capabilities?and offer?an excellent way to evaluate or test small works or items in?difficult to access locations.? As todays electronic and mechanical systems keep getting smaller, it becomes impossible to test or measure these products with traditional methods. For many applications, from development to production testing, video based inspection can help maintain quality control. Many of these systems are used in labs for development or used in production for testing production samples.
-
Product
Power Transmission Line Inspection System
-
Shandong Senter Electronic Co., Ltd
With the aid of high-end technology and equipment, Senter Electronic manufactures and trades high-tech power transmission line inspection system with low price. And we are known as one of the leading such manufacturers and suppliers in China for our quality products and good service. Welcome to buy the power transmission line inspection system with our factory.
-
Product
Vision Inspection Systems
-
We have available with us diverse array of Vision System. These systems are based on high-end technologies and meet the requirements of diverse sectors. Further, our systems are an epitome of quality and available at economical prices. Details of different systems.
-
Product
Intelligent PCB Inspection
-
It uses a proprietary image analysis system based on Artificial Intelligence. Eliminates time-consuming (re)programming of the process thanks to advanced self-learning. Guarantees high efficiency of the error detection process regardless of the type of component or PCB being inspected. Effectively supports decision-making processes in the area of quality control. Fully compatible with every production line. Ideal for high-variability production models thanks to self-configuration.
-
Product
Wafer Analyzer
RAMANdrive
-
RAMANdrive is the specialized Raman microscope for wafer analysis equipped with our dedicated 300 mm stage. RAMANdrive gives you an ultra-fast, highest resolution analysis of the whole wafer with unique stability and accuracy
-
Product
X-Ray Inspection System
MX1
-
Manncorp’s new MX1 is a high-performance x-ray inspection system designed for real time imaging of multilayer PCBs and dense metal BGAs, μBGAs, and chip scale packages. Its high voltage (80kV), computer-controlled x-ray tube and 35 μm focal spot provide the power necessary for detection of a variety of defects including bridging, voids, and missing balls. The MX1’s standard camera features continuous zoom magnification from 4X to 50X and variable angle viewing up to 45°, and an upgrade to the x-ray tube can boost magnification to 225X.
-
Product
Sensor for Filament Inspection
EyeFI
-
EVT presents the EyeFI - the sensor for the inspection of filaments. The sensor contains two cameras with an Aptina sensor and S-Mount lenses. The cameras are perpendicular to each other. It is therefore possible to inspect two sides of the filament, which means that the EyeFI can detect if the filament is out-of-roundness. Additionally the errors and defects can be detected. For example the occurring flaws are point-shaped or partly flaked, or point-shaped and transverse, or also looking like a longitudial rib, or only spots in different shapes. The defects can be detected with the EyeFI sensor. The EyeFI contains board cameras with sensors from Aptina, the IoCap and an evaluation processor. The housing is about 14x10x4 cm in size. The IoCap is the image-capture-IO-board, which is designed and developped by EVT.
-
Product
Battery Inspection
-
We design, develop and manufacture X-ray solutions specifically for battery cells. At Exacom we stand for passion, innovation, out of the box thinking, honesty and reliability, as well as speed and a hands on mentality.
-
Product
Wafer Probers
-
Devices to align probes to test the electrical properties of IC chips or TEGs (Test Element Groups) formed on wafers. The vast options available will meet various needs, from research to mass production.
-
Product
Magnetic Particle Inspection
NDT
-
DCM Tech offers a comprehensive selection of Magnetic Particle Inspection machines for non-destructive testing (NDT). Easily and quickly detect internal and subsurface damage on critical parts. Contact DCM to speak to your regional Technical Specialist about adding an MPI to your shop.
-
Product
Wafer Sort
-
TestEdge offers complete wafer sort solutions. Our range of wafer sort capabilities demonstrates our ability to handle a wide range of devices and device characteristics. State of the art Electroglas probers Sort experience with high probe count Less than 4 mil pitch on probes Experience with C4 Bump and Aluminum pad Experience on Bipolar, CMOS, GaAs, & SiGe Overhead sort or cable harness sort Microsite testing capability
-
Product
Automated Surface Inspection for Glossy Components
-
Flawlessly glossy surfaces are among the most important quality features of many premium products. The smallest surface defects immediately have a degrading effect on the product. The result: disappointed end customers or buyers. At the same time, reflective surfaces are often very sensitive and a challenge for optical metrology. A manual inspection is tedious, expensive, and ultimately always governed by subjective decision criteria. During production, faulty painting or coating processes can cause high scrap rates. Defects that are not detected even during the final inspection can lead to expensive complaints and, in the worst case, to the loss of the customer. Only an efficient, automated surface inspection achieves the highest quality at acceptable costs.
-
Product
Contactless Wafer Geometry Gauge
MX 20x series
-
The E+H geometry gauges are based on two heavy plates mounted parallel to each other. Embedded in the plate are a set of capacitive distance sensors. The wafer will be moved manual or automatically between the plates and measured without any movement.
-
Product
Wafer ESD Tester lineup
-
Hanwa Electronic Ind. Co.,Ltd.
◆Correspond to 300mm Wafer. This tester can measure LED or the large sizes Wafer, such as a system LSI. And Zap of HBM/MM can be performed. The Automatic destructive judging by V/I measurement can also be performed after Zap.◆Waveform guarantee in Zap needles. HED-W5100D carries out the calibration before shipment in the place of Zap needles. Therefore, Correlation of the Result of a Package Device becomes clear easily.◆Correspondence to Standards This Tester corresponds to the Standard of JEITA, ESDA, and JEDEC. A Zap unit adopts the plug-in system and also has the waveform of Customer's requests.◆Connection with TLP This Tester is the best for TLP Testing with deep relation of ESD. The protection circuit of a device with an ESD problem is investigated.
-
Product
Thickness and Flaw Inspection
OmniScan MX ECA/ECT
-
With thousands of units being used throughout the world, the OmniScan® MX is a field-proven, reliable instrument that is built to withstand harsh and demanding inspection conditions. Compact and lightweight, its two Li-ion batteries provide up to 6 hours of manual or semi-automated inspection time.
-
Product
Selective Wave Soldering Optical Inspection Machine
-
Landrex Technologies Co., Ltd.
Selective Wave Soldering Optical Inspection Machine
-
Product
Ultrasonic Inspection System
PULD 40
-
The PULD-40 is a versatile and highly accurate ultrasonic inspection system designed to meet the needs of our customers.
-
Product
Inspection
-
A complete line of testing instruments for inspection laboratories is available from our Petrolab group. We specialize in instruments for vapor pressure, flashpoint, distillation, and color as well as equipment for hundreds of other ASTM, ISO, and DIN testing procedures. Below are a handful of items we offer.
-
Product
Analytical Gear Inspection Machine
KNM 2X / 5X series
-
Analytical gear inspection machine for workpieces up to Ø 650 mm. Measuring machines for spur and helical gears, rotors, bevel gears, gear tools, shafts etc. Ultimate highly precise measurement of smaller size gears in the lab or on the shop floor - no foundation required.
-
Product
Complete GPR System for Road Inspection
RoadScan
-
Geophysical Survey Systems, Inc.
The RoadScan™ 30 system provides users with an effective tool for quickly determining pavement layers at high speeds. RoadScan is able to collect data densities not obtainable using other labor-intensive methods commonly used for pavement testing.
-
Product
Wafer Thickness Measuring System
WT-425
-
Contact type can measure any materials within 0.2 µm (2 σ at 20℃ ±1℃). The wafer floats positions while measurement points change and it does not damage even thin wafers. Best for the process control of compound wafers and oxide wafers. (SiC, GaN, LT, Sapphire and Bonded Wafers)
-
Product
Thickness and Flaw Inspection
OmniScan SX
-
Olympus is proud to introduce the OmniScan® SX, a flaw detector that benefits from more than 20 years of phased array experience and shares the OmniScan DNA. For improved ease of use, the OmniScan SX features a new streamlined software interface displayed on an 8.4 in. (21.3 cm) touch screen. A single-group and non-modular instrument, the OmniScan SX is easy to operate and cost-effective for less demanding applications.
-
Product
Complete Non-Contact Inspection System For OLED/TFT/LTPS
GX3/GX7
-
*Fastest*Workable to large panel as well as fine pattern of medium-small panel*Workable to large mother glass of every generation*Possible to dock width Repair Machine
-
Product
Structural Adhesive Bead Inspection
Predator3D
-
The Predator3D bead inspection technology measures bead height, width (volume) and position to assure structural integrity. It also alerts users to skips and partial skips, where material is deposited with insufficient volume.





























