Wafer Inspection
Inspection of integrated circuits in wafer form for contaminants, flatness, size, and roughness.
See Also: Wafer, Wafer Thickness, Wafer Failure Analysis, Wafer Edge, Wafer Resistivity, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Handlers
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Optical Inspection System
OIS Products
A manual optical inspection system that is able to inspect the wire-bonded leadframe or substrate.
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Turnkey NDT Corrosion Inspection Services
Robot-enabled ultrasonic inspection that produces thickness grid maps to identify areas where corrosion and other damage mechanisms have caused wall-thinning.
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Thickness and Flaw Inspection
OmniScan SX
Olympus is proud to introduce the OmniScan® SX, a flaw detector that benefits from more than 20 years of phased array experience and shares the OmniScan DNA. For improved ease of use, the OmniScan SX features a new streamlined software interface displayed on an 8.4 in. (21.3 cm) touch screen. A single-group and non-modular instrument, the OmniScan SX is easy to operate and cost-effective for less demanding applications.
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Batch Wafer Transfer Tools
Dou Yee Enterprises (S) Pte Ltd
Dou Yee Enterprises Batch Wafer Transfer Tools
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Magnetic Particle Inspection Systems for Non-Destructive Testing (NDT)
VERIFY SURFACE AND SUBSURFACE STRUCTURAL INTEGRITY IN: Industrial Crankshafts, Ferrous Parts, Aircraft Components, Landing Gear Components.
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Robotic Inspection Made Easy
i-Robot
The i-Robot technology is suitable for all industrial robots; it provides a production-ready metrology solution that is accurate, reliable and flexible. i-Robot is perfectly suited for all applications requiring flexibility and productivity while providing high metrological accuracy.
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Paint Inspection Gauge
141
The Paint Inspection Gauge is ideal for use on metallic & non-metallic substrates such as wood, glass and plastics.Large easy grip handle - makes cutting thick or hard coatings easyInternal cutter storage compartmentx50 magnification microscope
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Inspection Tools
Multi Disk Test System (4-Port)
16 types of inspection modes can be registered and edited. More accurate acceptance inspections can be performed using various types of inspections.High speed data communications using USB interface for communicating with host computer.Acceleration testing for temperature loaded HDD can also be performed. (Optional)Easy attaching and removing HDD using optional plug-in unit.
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Tool, Inspection Depth Gauge, Micro Coax, ITA
910121180
Tool, Inspection Depth Gauge, Micro Coax, ITA.
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Appearance Inspection
We perform quality assurance agency of customers' important products through inspection.
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DIP Vision Inspection Machine
Optima III
Landrex Technologies Co., Ltd.
DIP Vision Inspection Machine
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Double Sheet / Splice Inspection
Leuze electronic GmbH + Co. KG
Double-sheet control sensors enable the reliable differentiation between one or more layers of very thin objects made of different materials. This allows, for example, single-layer paper sheets to be reliably pulled in or individual electrodes to be stacked for the production of a battery cell. Different operating principles, based on ultrasonics and capacitive sensors, cover the range of materials for different applications. Sensors for splice inspection detect desired and random splices in paper webs independent of the surface color and material properties.
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Printing Quality Inspection Machine
TQM AVI
Landrex Technologies Co., Ltd.
Printing Quality Inspection Machine
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Portable gear inspection- and 3D-measuring systems
ultimate independent measurement - on the production machine or on the shop-floor without rotary table
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Contactless One-Point Wafer Thickness Gauge
MX 30x
The MX30x series are manual one-point Thickness gauges for silicon wafers.
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X-Ray Inspection
X-ray inspection systems are used wherever defects need to be detected by non-destructive means. The spectrum of use is broad and ranges from quality controls for complex assemblies, to the testing of materials for cracks and air inclusions, to foreign matter inclusions and shape deviations. The trend toward miniaturization, higher packing densities, and the relocation of components to the interior of the assembly require precise X-ray inspections that detect hidden defects quickly and reliably. X-ray systems from Viscom are used for the inspection of series assemblies as well as sampling and prototype controls. They take care of typical inspection tasks in concealed areas such as void controls, THT filling level measurements, and HIP inspections. At the same time, the systems reliably determine defect features such as coplanarity and polarity – at high inspection speeds and in a cost-effective way.
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High Precision Angular Positioning, Calibration and Geometry Inspection
LabStandard DUO
Rotary Precision Instruments UK Ltd
Ultra precise rotary tables intended for fine inspection, metrology and test applications.2 axis design for rotary tilting applications with self-locking worm gearing and a high accuracy angular encoder ensures sensitivity and fine positioning for metrology and precision testing.
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Metrology & Inspection Systems
Our optical and e-beam wafer metrology and inspection products quickly and accurately measure pattern quality before and during high-volume chip manufacturing.
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Cylinder Inner Wall Inspection
The CylinderInspector is an optical, non-destructive inspection and measurement tool for cylinder surfaces.
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Reel to Reel Non-Contact OS Inspection System for TAB/COD/TCP/TBGA
TRV
*Most suitable mechanism for non-contact inspection*Sprochet-less transfer decreases products damage.*Easy operation by Fixture alignment mechanism*Equipped with Tracing Test function
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Inline 3D-CT Automated X-ray Inspection Systems (3D-AXI)
3Xi Series
Saki's 3D-AXI (X-Ray) series adds significant inspection capability. The system utilizes Planar Computed Tomography (PCT) providing high precision CT imaging at high speed.
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X-Ray Inspection System
TruView™ Cube
The Perfect Solution for a Powerful Small Form Factor X-ray Inspection System. The all new TruView™ Cube X-Ray Inspection System is a fully motorized radiography system developed to meet the stringent requirements of electronics assembly and component inspection. Ideal for applications where space is premium, the the TruView™ Cube X-Ray sits comfortably on your laboratory bench.
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Compact Inspection Camera
Fits in your pocket or clips on your beltAffordable1 meter drop-proofLong, thin camera-tipped probe with excellent depth of field penetrates tight, hard-to-reach spacesProbe is waterproof, holds its configured shape, and coils inside clamshell case for storageFour camera-lighting LEDs produce bright, crisp video on large color LCDFour screen controlsFour useful probe tip accessories (pickup hook, magnetic pickup, 45 mirror, thread protector)
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Vision Inspection Products
Vision inspection systems use a series of high-speed cameras and imaging software to detect and measure random objects as they move along a conveyor belt. Custom software and measurement algorithms can determine the size, shape, color or composite measurement of any object and convert this into standard units for quality control. Bench, over-line, and in-line systems are available and provide real-time 100% inspection and rejection of any production line.
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Wireless Inspection Cameras
General offers three wireless inspection cameras whose probes can be disconnected from the grip and monitor. They are the DCS18HPART (with a 6mm/0.23 in. diameter articulating probe), the DCS1800HP (with a 5.5mm/0.22 in. diameter non-articulating probe), and the DCS500 (with a 9mm/0.35 in. diameter probe and a 5 in. diagonal color LCD). Wireless inspection cameras offer operating flexibility because the user can use both hands to manipulate the probe.
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Wafer Thickness Measurement System
MPT1000
Laser based Wafer Thickness and Roughness Measurement System designed by Chapman Instrument Inc., USA and OEM by Creden Mechatronic Sdn Bhd. A non-contact measurement system measures several parameters in a single system. (wafer & tape thickness, roughness, TTV, bump height, bow and warp measurements)
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Bond Tester for Wafers 2 - 12 inch
Sigma W12
Bondtester for wafers or at wafer level 2” – 12” (up to 300 mm)Precise testing and Cold Bump Pull (CBP) testingLarge X/Y stages X: 600mm, Y: 370 mmForce range from 1gf – 10 kgfBump pitch down to 20 µm
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3D Solder Paste Inspection Machine (3D-SPI)
3Si Series
Saki's 3D SPI identifies critical defects and assists with process improvement.
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Automated And Manual Sample Inspection
In addition to typical in-process, continuous dynamic measurement applications, LaserLinc’s non-contact measurement equipment is well suited for manual and automated off-line sample inspection. Inspecting cylindrical products with long, thin characteristics, such as camshafts and catheters requires checking multiple locations and dimensions for accuracy. Manual inspections of these areas can be difficult because of the complex profile as well as the need for numerous measurement stations, different equipment and skilled personnel.
