Wafer Inspection
Inspection of integrated circuits in wafer form for contaminants, flatness, size, and roughness.
See Also: Wafer, Wafer Thickness, Wafer Failure Analysis, Wafer Edge, Wafer Resistivity, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Handlers
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Product
Full Wafer Contact Test System
Fox 1
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Unique cartridge technology uses full-wafer contactors combined with parallel test electronics to achieve single touch, full-wafer test
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Product
Wireless Inspection Cameras
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General offers three wireless inspection cameras whose probes can be disconnected from the grip and monitor. They are the DCS18HPART (with a 6mm/0.23 in. diameter articulating probe), the DCS1800HP (with a 5.5mm/0.22 in. diameter non-articulating probe), and the DCS500 (with a 9mm/0.35 in. diameter probe and a 5 in. diagonal color LCD). Wireless inspection cameras offer operating flexibility because the user can use both hands to manipulate the probe.
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Product
Wafer Chucks
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American Probe & Technologies, Inc.
High Performance Chuck for your needs Introducing the American Probe & Technologies’ HC-6000 series of thermal chucks,
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Product
Manual Spin Air Bearing Rotary Table for Optimal Circular Geometry Inspection
GeoInspec
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Rotary Precision Instruments UK Ltd
Inspect circular components in a shop floor environment whilst maintaining world class accuracies more commonly seen in the standards laboratory.
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Product
Low to Modest Volume Clean, Inspect, Test
KI-TK034
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1310/1550 nm source & power meter, inspection microscope, cleaning materials. Interchangeable MPO/APC, SC, LC connectors (EAR99 Restricted)
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Product
Low to Modest Volume Clean, Inspect & Test
KI-TK071A
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1310/1550 nm & 850/1300 nm source & Autotest power meter + acceptance reporting software, inspection microscope, cleaning materials. Interchangeable MPO, MPO/APC, SC, LC connectors (EAR99 Restricted)
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Product
Process Control, Measurement and Inspection Workstation
ScanINSPECT VPI
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ScanINSPECT VPI is a fully integrated, stand-alone process control, measurement and inspection and programming workstation for use in setting up processes before the production floor in the PCB or Hybrid Microcircuit assembly industries.
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Product
AOI/SPI Inspection Systems
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Dou Yee Enterprises (S) Pte Ltd
Dou Yee Enterprises AOI/SPI Inspection Systems
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Product
3D Automated Optical Inspection Systems (3D-AOI)
3Di Series
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Saki’s 3Di Series applies cutting edge technologies to improve production efficiency and enhance production quality across the entire assembly line.
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Product
Analytical Gear Inspection Machine for Workpieces Up to Ø 6,000 mm
KNM X series
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machine structure with outstanding intrinsic accuracylarge bearing distances of guidesinherently stable granite machine base on active dampers to absorb vibrations ? no foundation requireddrive system close to center of gravitylinear motors in X-, Y-, Z- measuring axeshigh precision air- or hydrostatic bearing rotary tables (diameters from 500 to 1,800 mm) with direct drive and through holemotorized positioning of measuring column (V-axis) to the actual workpiece diameterlaser based system for safe operation
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Product
3D Solder Paste Inspection Machine (3D-SPI)
3Si Series
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Saki's 3D SPI identifies critical defects and assists with process improvement.
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Product
LED Tester For Chip And Wafer
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Electrical Testing: Forward：VF,DVF,VFDReverse：VZ,IROptical Testing: can test LOP in cd/mcd/W/mW/lm... from different optical componentsWavelength λp,λd,λc,hw,purity,(x,y),CCT,CRIFour-wire measurement and contact resistance in case of deviation.Auto polarity identification and preheat function.Compatible mechanical interface.Optional ESD static test system or polycrystalline test system
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Product
Real-time X-ray Medical Device Inspection System
The Bench-X
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Our latest real-time, compact system used for Medical Device X-ray Inspection. Very configurable and compact with high resolution at relatively low radiation levels.
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Product
High-precision Surface Inspection for Wind Turbine Blades
waveCHECK™
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8tree's waveCHECK is a handheld-portable 3D-inspection tool for inspecting wind turbine blades in manufacturing and operation. Its efficient detection of surface defects and instant visual feedback revolutionize surface inspection.It can detect wrinkles, steps, gaps, rain erosion and any other surface damage.
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Product
3D Digital Inspection
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Digital stereo 3D imaging is a unique, advanced, stereo image presentation system designed to provide fully interactive real time natural 3D viewing and visualisation with outstanding depth perception.
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Product
DIP Vision Inspection Machine
Optima III
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Landrex Technologies Co., Ltd.
DIP Vision Inspection Machine
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Product
Digital Automated Interferometer and Microscope for Surface Inspection
DAISI-V3
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The ultimate production interferometer for measuring end-face geometry on single-fiber connectors, equipped with a revolutionary «no-exterior-moving-parts» mechanical design.
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Product
In-Line X-ray Inspection System for Secondary battery
X-eye 9000 Series
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X-ray Tube100 kV / 200 µAMin. Resolution5 µmInspection Ability120ppm , 150ppm, 180ppmSystemConveyor / Index / Pick&Place 방식 LoadingDimension1,800(W) x 1,560(D) x 2,070(H)mm / 5,000kg
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Product
X5 XL800 X-Ray Inspection
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Designed to be integrated into the production process at either the beginning to protect equipment or at the end to protect consumers, the X5 XL 800 is perfect for products such as meat in Euro crates or cheese in bulk boxes.
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Product
Smart Factory Inspection System
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API, recognizing manufacturing industry’s increasing demand for part measurement automation, with a higher degree of accuracy, has developed its Smart Factory Inspection System with true 6 Degrees of Freedom (6DoF) real-time 3D robotic measurement incorporating its proven metrology technology and calibration components.SFIS can be delivered as a customized integrated solution or as a standard production inspection cell.
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Product
Probe Needles for Wafer Sort and Test Applications
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Advanced Probing Systems, Inc.
APS is the global leader in the manufacture of probe needles used in cantilevered probe cards. All probe needles used in wafer sort are manufactured according to customer specifications using stringent in-process quality assurance procedures.
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Product
IR Inspection System
EVG®20
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The EVG 20 offers a fast inspection method, especially for fusion bonded wafers. A live imageof the entire wafer via IR transmission supports void detection down to a radius of 0.5 mm. The infrared inspection system is a perfect match for fusion bonding processes either as the stand-alone EVG 20 tool or as a station in EVG''s integrated bonding systems.
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Product
Non-contact Measurement Wafer Sorting System (Robot Hand Tranceportation)
NC-3000R
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*High accuracy measurement system for large diameter wafer*Non-contact measurement of resistivity, thickness and conductivity (P/N)*Compact design of Two-stage by measuring area and transfer area*Number of cassette station can be changed by customers request Option : Add wafer flattness measurement system(FLA-200)
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Product
Inspection Assist Software
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RVI software is a must for streamlining your inspection processes and improving overall efficiency. Olympus inspection assist software provides support throughout the entire process, whether streamlining on-site inspections or assisting with remote report generation.
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Product
LED Type Wafer Alignment Sensor Controller
HD-T1
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Panasonic Industrial Devices Sales Company of America
The HD-T1 Series is a new Wafer Alignment Sensor that uses a safe red LED light beam, with a resolution of 30µm, to achieve the same high level performance as Laser Sensors. The HD-T1 Sensor is best suited to detect wafer eccentricity, notches and orientation flats. Using linear image Sensor methodology and high-speed sampling technology, a wide variety of objects can now be stably measured with great precision at ultra-high speeds. This CCD style Sensor is developed for use in almost all fields of industry, e.g. tire manufacturing or Semiconductor production (Wafer Printed Circuit Boards).
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Product
Chip Inspection System
GEN3000T
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GEN3000T is an inspection system that performs automatic inspection of individual semiconductor chips.This revolutionary chip surface inspection system was achieved by combining the chip handling technology cultivated by Toray with the inspection algorithm used in the "INSPECTRA®" wafer defect inspection system.
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Product
Sapphire/SIC Wafer Flatness and Surface Appearance System
FM200
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Sapphire/SIC wafer flatness and surface appearance system provide a previous surface flatness testing solution, though non-contract lighting testing to record the whole information of the surface, rapid and fast measurement for various of surfaces, line and all kinds of surface information.
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Product
Automated Wafer Prober for Magnetic Devices and Sensors
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Hprobe design and fabricate turnkey automated testing equipment (ATE) for electrical characterization and testing of integrated circuits under magnetic field such as MRAM (Magnetic Random Access Memory) and sensors. In each phase of the technology and product development as well as during mass manufacturing, a dedicated magnetic tester is available.
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Product
Manual & Automatic Inspection systems
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Manual and Automatic inspection systems mounted on vehicles such as motortruck, van, railway testing wagons etc. Operation is either on the move or during a stop. Ideal for inspecting transmission and distribution lines and for electric transportation.
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Product
Inspection & Metrology Platform
Neon
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Neon is Cohu’s next generation inspection platform optimized for small, fragile semiconductors used in automotive, consumer, industrial and medical, and mobility applications.
