Wafer Inspection
Inspection of integrated circuits in wafer form for contaminants, flatness, size, and roughness.
See Also: Wafer, Wafer Thickness, Wafer Failure Analysis, Wafer Edge, Wafer Resistivity, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Handlers
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Product
Analog Ultrasonic Inspection System
ULTRAPROBE 100
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The Ultraprobe senses high frequency sounds produced by operating equipment, leaks and electrical discharges. It electronically translates these signals by heterodyning them down into the audible range so that a user can hear these sounds through a headset and see them as intensity increments on the meter. Heterodyning works the same as a radio in that it accurately transforms the sounds so that they are easily recognized and understood.
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Product
Inspection Microscope
Z-NIR
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The McBain Z-NIR Near Infrared Inspection System is best-in-class for wafer-to-wafer and die-to-die alignment measurement and verification. This unique tool has been sold into many industries with various applications including sub-surface wafer and die inspection for cracks and bond integrity, MEMS, wafer bonding, 3-D chip stacking, failure analysis, process development, tool verification, part characterization, environmental testing and more.
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Product
Digital Video Inspection Microscope
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Contamination is the first reason for troubleshooting optical networks. Proactive inspection and cleaning of fibre connectors can prevent poor signal performance, damage to equipment, and network downtime. DIAMOND’s Video Microscope Kit contains all necessary tools for proper inspection and cleaning of the connector’s front-faces to help ensure optimal connector performance.
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Product
X-Ray and CT Inspection
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Systems offer a microfocus X-ray source, a large inspection volume, high image resolution and is ready for ultrafast CT reconstruction. They cover a wide range of applications, including the inspection of plastic parts, small castings and complex mechanisms as well as researching materials and natural specimens.
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Product
Wide Range Film Inspection
790
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For a wide range of coatings the easy-carry and easy to handle SPY Model 790 speeds inspection time with its built in Jeep meter and various other time saving and comfort features
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Product
Vehicle Inspect Lines Software System
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Foshan Analytical Instrument Co, Ltd.
Flexible control mode(A collective-type control mode can be adopted,but a distributive-type control can also be adopted); Powerful system function(Distributive-type control and collective-type management,provide the functions of equipment debugging,vehicle log-in,vehicle testing and bill printing.A secret code and right-limit can be set so that the system safety function is enhanced); Remote control(A remote log-in,main remote control and remote printing can be realized in accordance with the actual conditions of the testing station.At the sametime,provides a powerful data-base and one station with multi-wire:That is one testing station has more
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Product
Refurbished And Demo X-ray Inspection Systems
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Our 2024 collection of refurbished and demo X-ray inspection systems offers high-quality performance at an affordable price. These precision X-ray inspection systems provide exceptional value without compromising on quality.
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Product
Real-time X-ray Inspection Systems
JewelBox Series
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JewelBox x-ray inspection systems feature ultra-high resolution, powerful microfocus x-ray tubes, five-axis, and positioners. The JewelBox Series is divided into three broad categories: JewelBox 70-T, JewelBox 90-T and Ultra Compact each of which can be customized for specific applications.
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Product
Magnetic Particle Inspection
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Is an inspection method used to identify defects on the surface of ferromagnetic materials by running a magnetic current through it.
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Product
First Article Inspection Machine
Optima III FAI
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Landrex Technologies Co., Ltd.
First Article Inspection Machine
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Product
High Speed Solder Paste Inspection
VisionPro HSi
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The VisionPro HSi offers high speed solder paste inspection. Utilizing the most advanced high resolution staging and sensor technologies, the VisionPro HSi provides the accuracy and reliability needed to compliment your overall screen print process improvement strategy.
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Product
Non-Destructive Test Resonant Inspection System
RAM-AUTO
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Resonant Acoustic Method is designed to help deliver fully inspected parts, economically and on time. Every component has a unique resonant signature or pattern that reflects its composition.
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Product
3D Solder Paste Inspection Machine (3D-SPI)
3Si Series
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Saki's 3D SPI identifies critical defects and assists with process improvement.
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Product
Sensor for Filament Inspection
EyeFI
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EVT presents the EyeFI - the sensor for the inspection of filaments. The sensor contains two cameras with an Aptina sensor and S-Mount lenses. The cameras are perpendicular to each other. It is therefore possible to inspect two sides of the filament, which means that the EyeFI can detect if the filament is out-of-roundness. Additionally the errors and defects can be detected. For example the occurring flaws are point-shaped or partly flaked, or point-shaped and transverse, or also looking like a longitudial rib, or only spots in different shapes. The defects can be detected with the EyeFI sensor. The EyeFI contains board cameras with sensors from Aptina, the IoCap and an evaluation processor. The housing is about 14x10x4 cm in size. The IoCap is the image-capture-IO-board, which is designed and developped by EVT.
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Product
3D Automated Optical Inspection Systems
New 3Di Series
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To handle today’s rapidly changing market trends, the system can handle complex inspection challenges such as high component mounting density areas containing highly miniaturized parts placed near much larger and taller component. With our new 3D AOI system, you can strengthen quality assurance and increase production efficiency.
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Product
X-ray Inspection System
JewelBox-90T/100T/110T™
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All JewelBoxes deliver precision x-ray images of ultra-high resolution and grey scale accuracy without the aberrations of voltage blooming and image distortion prevalent in other systems.
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Product
GENERAL INSPECTION MACHINE AFTER SOLDER MASK
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DVI is a technology of automated optical inspection, which can inspect deep to the difference from semi-transparent layers or semi-reflective layers.
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Product
WAFER MVM-SEM
E3300 Family
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The E3310 is a WAFER MVM-SEM* for next generation wafers, supporting 1Xnm node process development and volume production at the 22nm node and beyond. With its high-speed carrier system employing a dual arm vacuum robot, and low-vibration platform to improve measurement accuracy, the E3310 delivers high throughput and performance for wafer measurements. Its multi detector configuration and unique 3D measurement algorithm also enable stable, high-accuracy measurement of 3D transistor technologies such as FinFET. The E3310 makes a significant contribution to reducing process development turnaround time and improves productivity for next-generation devices.
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Product
Pipe & Duct Inspection Cameras
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Pipe & Duct Inspection Camera are video inspection cameras with a probe long enough (roughly 70 ft.) to locate and identify an obstruction in a water or sewer line or HVAC duct by taking close-up video clips and photos of it. The P16PIP probe (also available separately) that comes with the DPS16 Pipe & Duct Inspection Camera has better camera lighting and optics and slightly better resistance to water than the P610-20PR probe that attaches to a recording or non-recording wet/dry inspection camera console.
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Product
Automatic Flight Inspection System
AT-950
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The AT-950 is the easiest to use and the fastet performing FIS available.
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Product
Wafer Level Test
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Double sided wafer inspection system is an automatic inspection system for afterdicing wafer chip. It can do double side inspection simultaneously. The appearance defects of wafer chip are clearly conspicuous by using advanced illumination technology. Illumination and camera acquisition mode can be adjusted for various wafer process, like vertical chip or flip chip.
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Product
Wafer Level Multi-Die Test System
ITC55WLMD
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The ITC55WLMD series of test systems has been developed by ITC to be stand-alone UIL test systems configured specifically to test on wafer. The systems include an ITC55series UIL tester and inductor box, a current limiter module and a system controller
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Product
Incremental Length Gauges For Measuring Stations And Multipoint Inspection Equipment
CERTO series
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*Interferential scanning principle*Very high system accuracy of down to ±0.03 µm*Well-matched ball-bearing guide for very high quality*Defined thermal behavior*Large measuring ranges of up to 60 mm*Interface: 11 µAPP
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Product
X-Ray Inspection System
MXI Ruby XL
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Designed for the largest PCBs, Ruby XL allows 96 x 67 cm (37.9” x 26.4”) areas to be inspected non-destructively, with feature resolution up to 0.5 µm.
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Product
Probes for Tube Inspection
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Probes for tube inspection are lightweight but solidly constructed eddy current, remote field, magnetic flux leakage, and IRIS ultrasound. These probes are used for ferromagnetic or non-ferromagnetic tube inspection applications.
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Product
Wafer Prober
Precio XL
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Fully automated 300mm wafer prober. The system achieves high productivity, excellent contact performance, improved cleanliness, and short lead time, and offers a number of high value-added functions as options.
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Product
Video Inspection Probe
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With today's high data rates and high definition services, connector quality and inspection has never been so important. Research reveals that up to 75% of all optical network failures are attributed to poor connector quality - reduce your installation time and ensure your network is reaching its full potential.The Video Inspection Probe (VIP) application for Anritsu field testing platforms gives operators a safe, easy way to analyze and document connector conditions.
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Product
Laser Sherography NDT Sensor for Post-Production Quality Control or In-Field Component Inspections
FlawExplorer
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The FlawExplorer is a laser shearography NDT sensor designed to be used for post-production quality control applications or in-field (in-service) component inspections. Depending on the application, the sensor can be configured with thermal or vacuum (partial) excitation systems and may also be automated. It incorporates the very latest in phase-shifting technology delivering accurate and reliable measurement results through clear and sharp imaging with sub-micrometer displacement resolution.
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Product
BT Imagine New wafer Thickness System
IS-T1
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Measurement Technique Laser Triangulation1-3 Laser Sensor SpotsLaser Spot Size Optimized for Accuracy and Precision.
